1. 2007013265 Moon – jun young

2. Index  Introduce product  Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark Sorter Visual packing

3. Introduce product  PKG(TSOP,SOP)  Card(sdcard)

4. wafer  The wafer is cut into pieces called dies.

5. manufacturing process  Wafer backgrinding For Uniform thickness of the wafer

6. manufacturing process Wafer saw ○ cutting wafer for assemble the pieces of the wafers(die)

7. manufacturing process  Die attach attach the die on die pad using epoxy

8. manufacturing process  Mold the process that cover with device by plastic

9. manufacturing process  Mark  In order to distinguish it from other things, a kind of marker is engraved process

10. manufacturing process  Sorter

11. manufacturing process  Visual  Checking product

12. manufacturing process  Packing & delivery