Download presentation
Presentation is loading. Please wait.
Published byRussell Whitehead Modified over 9 years ago
1
2007013265 Moon – jun young
2
Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark Sorter Visual packing
3
Introduce product PKG(TSOP,SOP) Card(sdcard)
4
wafer The wafer is cut into pieces called dies.
5
manufacturing process Wafer backgrinding For Uniform thickness of the wafer
6
manufacturing process Wafer saw ○ cutting wafer for assemble the pieces of the wafers(die)
7
manufacturing process Die attach attach the die on die pad using epoxy
8
manufacturing process Mold the process that cover with device by plastic
9
manufacturing process Mark In order to distinguish it from other things, a kind of marker is engraved process
10
manufacturing process Sorter
11
manufacturing process Visual Checking product
12
manufacturing process Packing & delivery
Similar presentations
© 2025 SlidePlayer.com. Inc.
All rights reserved.