1. #3-Febr. 2004 Production, Process & Test Technology for the Semiconductor Industry

2. #3-Febr. 2004 1949 Founded as Karl Süss GmbH 1999 IPO as SUSS MicroTec AG 2001 Changed Company name from Karl Süss to SUSS MicroTec Production Sites: 5 Employees 2003: 720 Global Overview

3. #3-Febr. 2004 Global Presence 30° Dresden Munich St. Jeoire Waterbury Tempe Yokohama Bangkok Over 30 Sales & Service Centers Vaihingen Production/Sales Service Sites Worldwide Shanghai SUSS MicroTec Headquarters Garching /Munich,Germany Hsinchu Wokingham

4. #3-Febr. 2004 Exposure Substrate Bonding Spin/Spray Coating Developing Product Offerings InspectionWet Processing (Cleaning, Etching, Lift-off) Device Bonding ( Flip Chip) Testing Hyperlinks: Click on each productimage NanoimprintNanoimprint Lithography

5. #3-Febr. 2004 Spin/Spray Coater /Developer Manual / Basic Delta Series Coat, Develop Manual & Pre- Production Respect 600/800 Coat, Develop Automated AltaSpray Spraycoat Back to product offerings Fab Automation (200&300mm) Automated Gamma60/80 Coat, Develop ACS200/300 Plus Coat, Develop Lithograhy Cluster

6. #3-Febr. 2004 Mask Aligner Fab Automation (200&300mm) Manual / Basic MJB4 Manual & Pre- Production MA/BA 6/8 Automated MA150/200eMA200/300PlusLithograhy Cluster MA1006 Back to product offerings

7. #3-Febr. 2004 Inspection System Inspection tool for verifying alignment on 2“ to 8" wafers. DSM8 Back to product offerings

8. #3-Febr. 2004 Substrate Bonder / Wafer Mounter Manual & Pre- Production SOI300 CL200 SB8e Substrate Bond Cluster Waferbonding Surface ActivationPrealign, Clean, FB Bond, Align, Waferbonding, Back to product offerings Cleaning Pre-Production Semiautomated Fab Automation (200&300mm)

9. #3-Febr. 2004 Probe Systems 300mm Systems Shielded environments Fully automated systems Customized solutions Manual lab systems Back to product offerings

10. #3-Febr. 2004 Device Bonder Low Cost Device Bonder FC6 Automated Device Bonder FC150 Production Device Bonder FC250 LoadingAlignmentPlacementBondingUnloading Component and Substrate inBonded device out FLIP CHIP CYCLE EQUIPMENT Back to product offerings Fab Automated Device Bonder TRIAD 05AP

11. #3-Febr. 2004 Our Commitment Worldwide infrastructure for: Service, applications Training, spare parts Wide variety of after sales support programs to match production needs Regional spare parts stocking options Man-on-site option Applications support & process development capability Detailed service training and certification Operator/User training

12. #3-Febr. 2004 Customer List (extract)