1. Advanced Nanoelectronics Devices in European R&D Programmes Georg Kelm Nanoelectronics Components and Systems Information Society & Media Directorate-General European Commission

2. Presentation Outline ICT FP7 Current situation
Today’s opportunities: WP FET
And WP 2013?
Something on the future 8th FP

3. What is the money spent on? (in 2011-12)
Future & Emerging
Technologies (FET)
1. Network and
Service
Infrastructures
ICT for socio-economic challenges
Basic ICT technologies & infrastructures
~10%
~9%
~11%
International cooperation, Cooperation in an enlarged Europe, Pre-commercial Procurement
3. Component
and
Systems
4. Digital
Content and
Languages
2. Cognitive
Systems and
Robotics
5. ICT for Health, Ageing, Inclusion & Gov.
~26%
~6%
~17%
~7%
6. ICT for Lower-Carbon Economy
~12%
7. ICT for Manufac. & Enterprise
8. ICT for Learning & Cultural
Resources
~4%
+JTIs
+AAL
PPP
2 PPPs
incl FI PPP
••• 3 3

4. FP7-CIP/ICT Budget Profile: 70% increase in period 2011-13
M€ 
2007
2008
2009
2010
2011
2012
2013
TOTAL
PF7 ICT
1.189
1.217
1.227
1.241
1.382
1.582
1.760
9.597
CIP 58 52
105
113
120
135
149
732
Financial support
FP7: master & shape research & development
CIP: ensure wider uptake & better use of research
+ Regional and Structural Funds,…

5. ICT in FP7: Where do we stand?
In 2011, the FP7 ICT Programme is in its fifth year of implementation
Six main calls have been launched and evaluated
Total EU funding of 3,9 B€
Total number of projects ~1200
Launch of two JTIs and AAL
3 Calls launched for 220 M€
WP done, WP 2013 (1.5 B€) still to be drafted

6. ICT in FP7: In Summary
ICT in the FP supports collaborative R&D projects
industry - academia from at least 3 Member or ASs
Project size between 3M€ and 20 M€ of funding
4 to 20 partners per project
Supports ~17000 researchers and engineers/year
During
~ 5000 distinct organisations, ~14000 participations
1250 projects running (FP6 + FP7)

7. Presentation Outline ICT FP7 Current situation
Today’s opportunities: WP FET
And WP 2013?
Something on the future 8th FP

8. Nanoelectronics and Smart Systems ”Small, smaller, smarter”
Lower cost, higher performance and more functionality
performance
Enabled by
Smart design and Smart manufacturing of Smart Components and Systems
Power consumption
More than Moore: Diversification
Analog/RF
Passives
HV Power
Sensors Actuators
Biochips
130nm
Interacting with people and environment
Non-digital SoC & SiP -
90nm
65nm
Combining SoC and SiP: Higher Value Systems
Moore’s Law: Miniaturization
Baseline CMOS: CPU, Memory, Logic
45nm
Information
Processing
Digital content
SoC
32nm
22nm
Beyond Moore

9. Objective 3.1: Very Advanced Nanoelectronics Components
ICT Work Programme
Objective 3.1: Very Advanced Nanoelectronics Components
a) Beyond CMOS technology
b) Circuit-technology solutions
c) Nano-manufacturing and Joint Equipment Assessment
d) Coordination and Support Actions
Objective 3.2: Smart components and smart systems integration
Smart components
Smart (miniaturized) systems
Micro-Nano Bio Systems (MNBS)
Coordination and Support Actions
Objective 3.1 Very advanced Nanoelectronics Components
Beyond CMOS technology:
Very advanced Si and non-Si switches, memories and interconnects (perf/scale/ee)
Co-integration of non-Si, charge, spin, photon based devices on Si
Carbon based electronic devices
Novel materials for interconnects, nano-packaging, Beyond-CMOS (logic and memory)
Understanding fundamental artefacts and limits: nano-scale thermal processes; computational material and device science
Circuit-technology solutions
Combined modelling, technology+ design work at circuit, device, material level for monolith and 3D integr of BeyondC+MtM on Si backbone
Nano-manufacturing and Joint Equipment Assessment
Mfg solutions integr/interfacing BeyondC+MtM with nanoC
E&M solutions to manufacture and measure 1D + 3D Si
Coordination and Support Actions
CSA to develop strategies, attract young ones and link up globally to support IP creation and manufacture in Europe
Objective 3.2 Smart components and smart systems integration
Future smart components and smart systems
Materials, technologies, processes, manufacturing techniques and design methods for:
Innovative smart components (Systems on Chip or Systems in a Package) demonstrating very advanced performance (very high performance analogue, very high frequency, integrated passives); high voltage and high power operation or operating under special conditions (e.g. high temperature, high reliability, long lifetime).
Miniaturized and integrated smart systems with advanced functionality and performance including nanoscale sensing systems.
Autonomously operating, power efficient and networked smart systems.
Robust systems, compatible and adaptive to environment and lifetime requirements.
Micro-Nano Bio Systems (MNBS)
highly integrated, safe, active and autonomous “smart” implants which provide real-time performance feedback and are able to tolerate interfering body signals;
integrated systems for rapid, sensitive, specific and multi-parametric in vitro molecular analysis/detection and cellular manipulation based on biodegradable materials. Cost, manufacturing and real scenarios validation should be considered
autonomous body sensor and actuator based systems for non- or minimally-invasive targeted early detection, diagnosis and therapy.
Call 8 - MNBS
39M€
Call 8
60M€

10. Objective 3.1: Advanced Nanoelectronics Technology
To stimulate interaction of system and technology to better explore European system competences.
To address energy efficiency needs for mobile applications
Nanoelectronics products as system enablers and solution providers for global challenges as aging society, global warming, growing population or sustainable manufacturing.
To prepare for “beyond” traditional shrinking (ITRS roadmap)
35 nm Gate Length

11. Objective 3.1: Advanced Nanoelectronics Technology
Future developments in Beyond CMOS and More than Moore as an extended-CMOS vision. No disconnection from the advanced silicon CMOS in order to keep impact of its results on the applications and markets.
Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures.
Integrate-ability of novel technology with CMOS and their reliability become key factors.
ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms.

12. 3.1 Very advanced nanoelectronic components
a) Beyond CMOS technology
- New switches and interconnects (scalability, performance and
energy efficiency gains, operational reliability and RT operation);
- Advanced system integration technology and new methods for
computation;
- Emerging memories targeting the concept of non-volatile universal
memory;
- Nano-photonic devices & interconnects integrated with nano- and
Beyond-CMOS;
- Carbon based electronic devices;
-Novel materials for interconnects , nano-packaging, Beyond-CMOS
(logic and memory);
- Understanding fundamental artefacts and limits: nano-scale thermal processes; computational material and device science.
Developed components and technologies need to fulfil the criteria of
“systemability”,“integratability”, and – in the end – of
“manufacturability”

13. Objective 3.1: c) Manufacturing and Equipment assessment
Semiconductor Equipment for
Wafer Bonding with Plasma Activation EV Group, CEA-LETI, Soitec
Access to nano-manufacturing and to advanced technologies to be assured in Europe.
Access to world wide equipment market for European suppliers, especially SMEs, need to be stimulated.
Ruthenium Atomic Vapor Deposition
Competitiveness in Nanoelectronic
Device Generations
AIXTRON, Fraunhofer IISB, Infineon Munich
Low Energy and Dose Implant Test
SEMILAB, Fraunhofer IISB,
ST Microelectronics Crolles II,
NXP Crolles R&D
Metrology Using X-Ray Techniques
Jordan Valley, CEA-LETI,
STMicroelectronics Crolles II,
NXP Crolles R&D
3D Integration of Bulk Si Wafers
EV Group, CEA-LETI,
STMicroelectronics Crolles II

14. 3.1 Very advanced nanoelectronic components: design, engineering, technology and manufacturability Summary
Call 8
Open: 26 July 2011
Close: 17 January 2012 (at 17:00 Brussels local time)
Funding schemes:
Beyond CMOS technology: STREPs
Circuit-technology solutions: STREPs and at least 1 IP
Nano-manufacturing and joint equipment assessment: STREPs and at least 1 IP
Support measures: CSAs
Indicative budget - 60 M€:

15. Two complementary funding schemes
Future & Emerging Technologies – FET Supporting high-risk transformative research in ICT
Two complementary funding schemes
FET Open
Bottom-up approach
Open to any research idea
FET Proactive
Top-down approach
Set of novel pre-defined themes
Nano-electronics related topics with EU funding ~ 30M€/year:
Molecular-scale systems, Tera-scale computing, Quantum-ICT, Bio-Chemistry-based and towards zero power ICT
Budget ratio: 1/3 FET OPEN, 2/3 FET Proactive 15

16. Objective ICT-2011.9.8: Minimising Energy Consumption of Computing to the Limit (FET Pro-active)
Target Outcome:
Foundations for radically new ICT technologies striving for
the theoretical limits in energy consumption
New elementary devices and inter-device-communication mechanisms
Novel computing paradigms with radically improved energy efficiency (e.g. inspired by biology, post-Boolean logics, …)
Software models and programming methodologies supporting the strive for the energetic limit (e. g. energy cost awareness,..)
Proof of concept, indication of expected energy gain, appropriate energy metrics or benchmarks for verification
Objective ICT : FET Proactive: Minimising Energy Consumption of Computing to the Limit (MINECC)
The energy consumption of computing technologies becomes more and more an obstacle to realizing new functionalities in, for instance, mobile or distributed applications, and limits performance. It also has an increasing impact on energy supply and environment. Since energy efficiency of today's technologies is orders of magnitude above the theoretical limits, disruptive solutions and radically new approaches are needed to close this gap.
Target outcomes:
Proposals should lay the foundations for radically new technologies for computation that strive for the theoretical limits in energy consumption while maintaining or even enhancing functionality and performance. At least one of the following outcomes should be addressed:
New elementary devices and inter-device-communication mechanisms operating at the limits of minimum energy consumption.
Novel computing paradigms with radically improved energy efficiency. Examples include approaches inspired by biology, post-Boolean logics and computing under uncertainty, randomness and unreliability as a result of low-energy device properties.
Software models and programming methodologies supporting the strive for the energetic limit (e. g. energy cost awareness or exploiting the trade-off between energy and performance/precision).
Proposals should aim for a proof of concept and investigate the viability of the approach. The expected energy gain should be indicated, and the proposal should foresee appropriate energy metrics or benchmarks for verification.
Expected impact
Understanding of theoretical limits of energy efficiency in computation (e.g. energy dissipation, thermodynamic and quantum physics limits)
Foundations of computing technologies with negligible energy consumption
Reduction of the environmental impact caused by the energy consumption of ICT.
Funding schemes
STREP
Indicative budget distribution10
EUR 15 million
Call
FP7-ICT

17. Objective ICT-2011.9.8: Minimising Energy Consumption of Computing to the Limit (MINECC)
-Funding/Instruments: 15 MEuro for STREPs
-Closing of Call 8 (tbc): 17 Jan 2012
-Contacts:
Ralph.Stuebner (at) ec.europa.eu
Francisco.Ibanez-Gallardo (at) ec.europa.eu

18. ICT-2011.9.9: Quantum Information and Communication Technologies (QICT)
Target Outcomes
Push forward the boundaries of our knowledge in the Quantum-ICT area by demonstrating
Quantum simulators capable to operate on many-particle systems
Hybrid systems linking different quantum bit realizations.
Novel quantum devices exploiting entanglement and quantum coherence as a resource, such as quantum sensing, imaging, measurement and communication
Enabling methods and technologies to support aforementioned outcomes
Objective ICT : FET Proactive: Quantum ICT (QICT) including ERA-NET-Plus
The objective is to conceive theoretically and develop experimentally novel and powerful technological applications of quantum coherence and entanglement. In particular, projects should develop a conceptual platform for potentially disruptive technologies, advance their scope and breadth and speed up the process of bringing them from the lab to the real world.
Target outcomes
The results obtained should push forward the boundaries of our knowledge and ensure a constant progress in the quantum ICT area, in particular by
Demonstration of quantum simulators capable to operate on quantum many-particle systems and to simulate technologically relevant systems (e.g., coupled systems in condensed matter, new materials and chemical compounds).
Demonstration of hybrid systems linking different quantum bit realizations (e.g., by bridging atomic/molecular and optical systems with condensed matter systems). Possible devices include those that interconnect different qubit memories and quantum information carriers, and quantum repeaters.
Novel quantum devices exploiting entanglement and quantum coherence as a resource, such as quantum sensing, imaging, measurement and communication.
Enabling methods and technologies to support aforementioned outcomes (e.g., the control of coherent operations with many quantum bits in the experimental domain, or the search for new algorithms and protocols in the theoretical domain).
A joint call for proposals on QICT, to be funded through an ERA-NET-Plus action between national and/or regional grant programmes.
STREPs should address at least one of the research foci a)-d), IPs should address two or more.
Expected impact
Significant technological achievements with higher performance and superior energy efficiency such as entanglement assisted sensors and metrology
Better understanding of the dynamics of complex systems and phenomena and design of novel artificial materials with tailored properties through quantum simulators and computers
Extending the distance of secure quantum links through quantum repeaters
Closer cooperation and greater alignment between the participating national/regional research programmes through an ERA-NET-Plus action
Funding schemes
a)-d): STREP, IP; e): ERA-NET-Plus
Indicative budget distribution10
a)-d): EUR 15 million
e): EUR 7 million (Any funds remaining following the selection of an ERA-NET-Plus action will be transferred to IP/STREP actions under this Objective)
Call
FP7-ICT

19. Objective ICT-2011.9.9: Quantum Information and Communication Technologies (QICT)
“How the combination of quantum mechanics and information theory offers new concepts and resources for computing and communications.”
-Funding/Instruments: 15 MEuro, STREPs & IPs
7 MEuro, ERA-NET Plus
-Closing of Call 9 (tbc): 17 April 2012
-Contact: Werner.Steinhoegl (at) ec.europa.eu David.Guedj (at) ec.europa.eu
Objective ICT : FET Proactive: Quantum ICT (QICT) including ERA-NET-Plus
The objective is to conceive theoretically and develop experimentally novel and powerful technological applications of quantum coherence and entanglement. In particular, projects should develop a conceptual platform for potentially disruptive technologies, advance their scope and breadth and speed up the process of bringing them from the lab to the real world.
Target outcomes
The results obtained should push forward the boundaries of our knowledge and ensure a constant progress in the quantum ICT area, in particular by
Demonstration of quantum simulators capable to operate on quantum many-particle systems and to simulate technologically relevant systems (e.g., coupled systems in condensed matter, new materials and chemical compounds).
Demonstration of hybrid systems linking different quantum bit realizations (e.g., by bridging atomic/molecular and optical systems with condensed matter systems). Possible devices include those that interconnect different qubit memories and quantum information carriers, and quantum repeaters.
Novel quantum devices exploiting entanglement and quantum coherence as a resource, such as quantum sensing, imaging, measurement and communication.
Enabling methods and technologies to support aforementioned outcomes (e.g., the control of coherent operations with many quantum bits in the experimental domain, or the search for new algorithms and protocols in the theoretical domain).
A joint call for proposals on QICT, to be funded through an ERA-NET-Plus action between national and/or regional grant programmes.
STREPs should address at least one of the research foci a)-d), IPs should address two or more.
Expected impact
Significant technological achievements with higher performance and superior energy efficiency such as entanglement assisted sensors and metrology
Better understanding of the dynamics of complex systems and phenomena and design of novel artificial materials with tailored properties through quantum simulators and computers
Extending the distance of secure quantum links through quantum repeaters
Closer cooperation and greater alignment between the participating national/regional research programmes through an ERA-NET-Plus action
Funding schemes
a)-d): STREP, IP; e): ERA-NET-Plus
Indicative budget distribution10
a)-d): EUR 15 million
e): EUR 7 million (Any funds remaining following the selection of an ERA-NET-Plus action will be transferred to IP/STREP actions under this Objective)
Call
FP7-ICT

20. Prototype demonstration
Work Programme Objectives 3.1 and 3.2 vs FET
Idea
FET
Proof-of-Principle
Proof-of-Concept
Objective 3.1: Advanced
Nanoelectronics Technology
Objective 3.2: Smart
components and Systems
Prototype demonstration

21. Presentation Outline ICT FP7 Current situation
Today’s opportunities: WP FET
And WP 2013?
Something on the future 8th FP

22. Strengthen, focus & simplify
What is next?
2010
2011
2012
2013
2014
ICT WP
FP7
ICT WP 2013
Preparatory work
2011: Framework 8 Preparation
9 Feb Green Paper
Feb-May Consultation based on Green Paper
10/6 Consultation ‘wrap-up’ event in Brussels
June Proposal for next MAFF
Dec Proposal (s) for FP8/CIP-II
Light and fast
EIPs
FP8
Strengthen, focus & simplify
KETs
Externalisation
MAFF 2014+

23. And in FP7 ICT WP 2013 ?
Advanced devices – more focus – but on what?
Stronger links Technology - Design
Mfg approaches for BC and adv MtM integration
Joint E&M assessments – focus on 450 mm?
Bridging to FP8: Innovation elements (pilots, research infrastructure, …)

24. Focussed, Roadmap based e.g. Clean rooms, Innovation clusters
Some first and preliminary thinking on FP 8
Draft
Towards a Common R&I framework in the next MAFF “3 sets of challenges, 4 type of activities, (funding schemes)”
Societal challenges
Industrial leadership
Excellence in science
Focussed, Roadmap based
Flexible, Open, agile
Infrast and skills
Testing, piloting
e.g. EIPs
e.g. PPPs
e.g. FET flagships
e.g. FET open
ERC
Light WP
Any time
Small size
SMEs specific
e.g. Living labs
e.g. Clean rooms, Innovation clusters
E-Infrastruct .
CIP Pilots

25. Input from Summer School is very welcome
Summary
Two messages:
Input from Summer School is very welcome
Participate in Call 8 !!! 25

26. THANK YOU Georg.Kelm@ec.europa.eu Information Society and Media:
European research on the web: