1. ©HDP User Group International, Inc. Proprietary 1 BMPS (Board-Mounted Power Supply) Modules Definition Stage Project Update May 18, 2011Shenzhen, PRC

2. ©HDP User Group International, Inc. Proprietary 2 Overview of BMPS Projects BMPS Project Overview Board Mount Power Supply (BMPS) Application Guideline, version 1.0 (2007) – The first edition was released 3 years ago. It was a ”best practices paper” based on the known technology at that time. Board Mount Power Supply (BMPS) Application Guideline, version 2.0 (2010) – The second edition is complete and published. It updates the first edition with current best practices. Board Mount Power Supply (BMPS) Modules – This project will focus on features, practices and processes on and surrounding BMPS modules with respect to their assembly to PWBs. – The results of this project may be inserted in the BMPS Guideline third edition.

3. ©HDP User Group International, Inc. Proprietary 3 Objectives The objective of the project is to: Identify the key design / manufacturability issues and opportunities with a focus on assembly Demonstrate the feasibility, accessibility, and reliability of select module-PWB interconnect features. Issue guidelines on PWB layout for BMPS that will aid in assy. – Pad configurations, etc. Issue guidelines for automated handling of BMPS – Pick and place nozzles, grippers etc.Issue guidelines for automated handling of BMPS – Pick and place nozzles, grippers etc.

4. ©HDP User Group International, Inc. Proprietary 4 Opportunity / Challenges Technology changes and manufacturing expectations have uncovered issues regarding the use of modern high-current BMPS modules 1. Lead-free soldering Hole-fill on critical connections is routinely below targets. Manage critical temperatures across different components Energy Efficiency is an industry Priority 2. Surface Mount BMPS Modules Opportunity to eliminate wave solder process 3. Reliability of select “QFN” and CSP BGA packages/attaches 4. Handling Automation Desire to eliminate hand loading of BMPS modules Desire to obviate hand soldering and touch-up 5. Currents are increasing Different interconnect scheme needed Interconnect scheme is at root of other issues of greatest interest.

5. - Power brick pin-thru hole-fill is routinely below target in “real life”. - IPC-A-610DC Telecom Addendum 7.5.5.1 reducing PTH solder fill to minimum pin-wetted length within barrel of 0.047” - This “helps” – in terms of pure workmanship standards acceptability - but is a small, incremental change. -This does not change our motivation for hole-fill optimization. ©HDP User Group International, Inc. Proprietary 5 Brick Hole-Fill

6. ©HDP User Group International, Inc. Proprietary 6 Example: hole-fill below class2 minimum On “real product” assembly qualification. Note: good thermal relief, OK pin-hole clearance, Poor(?) thermal inertia(no gnd plane annular rings) Fill PCB Thickness

7. Brick Hole-Fill ©HDP User Group International, Inc. Proprietary 7 Example: hole-fill below class2 minimum On “real product” assembly qualification. Note: good thermal relief, good pin-hole clearance, Poor(?) thermal inertia(no gnd plane annular rings)

8. Brick Hole-Fill Intent of BMPS Hole-Fill focus is to complement/supplement HDP Cu- Dissolution / Hole-Fill Project. Comparison of BMPS feature complements to Cu Erosion Work from / confirm / extend findings of other hole-fill work.

9. Cu-Dissolution vs. BMPS Cu-Dissolution/Hole-Fill Optimize hole-fill vs. Cu-dissolution Measures: – Hole-fill – Cu Thickness Remaining – Cu Dissolution Rate Component Types: – DIMM sockets – Capacitors – ½ Brick Power Module 0.130” thick board – 12 layers: 4x 1oz + 8x 2oz Variables – Solder Alloy – Wave Type – Solder Temp – Contact Time – Plane connections / Thermal Relief – Pin to hole clearance BMPS © HDP User Group International, Inc. 9 Optimize BMPS interconnect to/through PCB Measures: – PTH Hole-fill – SMD Thermal/Shock/Vibe Reliability – Functional (Interconnect)Performance Component Types: – PTH ½ Brick Power Module – SMD ½ Brick Power Module – SMD Large LGA Power Module 0.140 → 0.180 thick board desired 12 layers: 4x 1oz + 8x 2oz Variables – PTH Gas-vent / No Gas-vent – PTH Lead- length – PTH thermal relief – SMD interconnect type – SMD footprint – Via configurations

10. Pin-to-Hole Clearance vs Fill Holistic View ©HDP User Group International, Inc. Proprietary 10 Courtesy of Celestica, Thilo Sack

11. Thermal Relief & Other Factors ©HDP User Group International, Inc. Proprietary 11 Courtesy of Celestica, Thilo Sack

12. Thermal Relief & Other Factors ©HDP User Group International, Inc. Proprietary 12 Courtesy of Celestica, Thilo Sack Anomaly: “Entry effect”(leading position on pcb w.r.t. reflow) superceding thermal relief as fill driver(inhibitor) Fill generally following thermal relief.

13. CURRENT DENSITY – POWER PLANE -.083” BRICK PIN HOLE W/ 4 SPOKE - 2OZ PLANE - DISTRIBUTED VIA TO TOP&BOTTOM - 100 AMP ~POINT LOAD BMPS PTH

14. CURRENT DENSITY - TOP&BTM -.083” BRICK PIN HOLE - 2OZ PLANE - DISTRIBUTED VIA TO TOP&BTM - 100 AMP ~POINT LOAD BMPS PTH

15. Fill: Gas Venting vs No Gas Venting ©HDP User Group International, Inc. Proprietary 15 Woosh!

16. BMPS PTH Fill vs Thermal Relief Variations ©HDP User Group International, Inc. Proprietary 16 Plane Disconnect Spoke Reduction Spoke Narrowing Radial/Distributed Via Targeted for DOE

17. BMPS PTH ©HDP User Group International, Inc. Proprietary 17 - Fill vs Lead Protrusion

18. ©HDP User Group International, Inc. Proprietary 18 - PTH(Pin-Through-Hole) power bricks are “the” remaining impediment to the elimination of wave solder process. - True for many assemblies. True for enough sectors of product to pursue aggressively for the sake of process elimination; cost-reduction, manufacturing lead-time, simplicity. - PTH power connection is familiar, feels robust, well characterized. However, it is a mfg process weak point. - SMD solutions are on the market, but limited. -Simple conversions have been applied. SMT BMPS

19. Brick SMT Attach Variants ©HDP User Group International, Inc. Proprietary 19 Pedestal Leg w/ Ball Pure Post LGA

20. Brick SMT Attach Variants ©HDP User Group International, Inc. Proprietary 20 PTH – NO VENT PTH – WITH VENT PTH – LONG, WITH VENT SMT - PURE POST SMT - PEDESTAL & BALL PTH – LONG, WITH VENT SMT - PEDESTAL&BALL

21. BMPS ©HDP User Group International, Inc. Proprietary 21 - BMPS DOE

22. Test Vehicle Details - Nominal Bricks – 30A or greater 0.140 - 0.180” Thick 12 Layer w/ 2oz & 1oz ENIG or ENIPIG Finish Larger PCA Multiple SMT sites Multiple PTH sites Dual PTH / SMT site SAC305 ©HDP User Group International, Inc. Proprietary 22

23. Test Vehicle Details - Nominal Assembly Rework(Multiple) Shock & Vibe ATC Xray X-section Dye & Pry Electrical Performance ©HDP User Group International, Inc. Proprietary 23

24. Test Vehicle Resourcing Brick PTH Vented- $ Re-quoting to Emerson Brick PTH Un-Vented- $ Re-quoting to Emerson Brick SMD Pedestal+Ball - $ Re-quoting to Emerson Brick SMD Pure Post - $ Re-quoting to Emerson Brick SMD LGA - $ Re-quoting to Emerson Design - Juniper Networks PCB - Meadville Assembly - ? Test - ? ©HDP User Group International, Inc. Proprietary 24

25. ©HDP User Group International, Inc. Proprietary 25 February 2011 Suggested Next Steps 1. Window until May Shenzen Meeting to gather new user/supplier participant input. 2. Complete modeling / design / tape out the test vehicle. 3. Complete resourcing the Test Vehicle 4. Build / Test / Results

26. ©HDP User Group International, Inc. Proprietary 26 Target Schedule Project TaskWhen CompleteActual Project start in definition stage01/03/09Date/Month/YY Project start in implementation stage05/18/11Date/Month/YY Collect knowledge and experience of existing solutionsOngoingDate/Month/YY Define a preferred solution, experimental work, if needed etc 05/18/11Date/Month/YY Issue a project report09/07/11Date/Month/YY Assemble information for the BMPS Guideline10/07/11Date/Month/YY

27. ©HDP User Group International, Inc. Proprietary 27 Project Participants System Integrators Juniper Networks, Leif Hutchinson, Project leader Tekelec, Tony Cosentino Oracle(Sun), Livia Hu, Michael Freda Alcatel, Joe Smetana IBM, Jim Wilcox (Ericsson – Joining Soon?) (Huawei – Joining Soon ?) Suppliers Emerson, KK Chin TDK/Innoveta Randy Heinrich Nihon Superior Keith Howell (Ericsson – Joining Soon ?) Facilitator HDP User Group Staff, Jack Fisher

28. End – Thanks! End. Thanks !