1. PWB Product Data-Driven Analysis Using STEP AP210 An Example XAI Application Russell S. Peak Senior Researcher & Co-Director Engineering Information Systems Lab eislab.gatech.edu CALS Technology Center Georgia Institute of Technology ISTPED Workshop Roanoke VA July 19, 2000 Integration of Software Tools for Power Electronics Design http://www-rp.me.vt.edu/bohn/ISTPED/

2. 2 Engineering Information Systems Lab  eislab.gatech.edu © GIT Outline u Generalized Analysis Integration u Challenges u Techniques and Applications u Experiences with AP210 u Summary

3. 3 Engineering Information Systems Lab  eislab.gatech.edu © GIT X-Analysis Integration (XAI) (X=Design, Mfg., etc.) u Goal: Improve product engineering process by integrating physical behavior simulations with other life cycle models u Challenges: –Heterogeneous Transformations –Diversity: Information, Behaviors, Disciplines, Fidelity, Feature Levels, CAD/CAE Tools, etc. –Multidirectional Associativity: Design  Analysis, Analysis  Analysis u One Approach: The Multi-Representation Architecture (MRA) u Initial Focus: Automation of ubiquitous analysis for design

4. 4 Engineering Information Systems Lab  eislab.gatech.edu © GIT Analysis Integration Challenges: Heterogeneous Transformations u Heterogeneous Transformation u Homogeneous Transformation Mentor GraphicsCadence STEP AP210 Mentor GraphicsAnsys STEP AP210 STEP AP209 ?? Design Model A Design Model B Design Model A Analysis Model A

5. 5 Engineering Information Systems Lab  eislab.gatech.edu © GIT Analysis Integration Challenges: Information Diversity Environmental Conditions Specification Semantics Idealizations “Manufacturable” Description “Analyzable” Description “PWB should have low bow & twist” “Warpage < 7.5% when board is cooled from lamination to 25 o C” lamination temperature = 200 o C STEP AP220 STEP AP210

6. 6 Engineering Information Systems Lab  eislab.gatech.edu © GIT Diverse Analysis Disciplines Thermal Thermomechanical Fatigue Vibration Electromagnetic Electrical  N

7. 7 Engineering Information Systems Lab  eislab.gatech.edu © GIT Multi-Fidelity Idealizations Same Mode; Idealized Geometries of Varying Dimension inboard beam Design Model (MCAD)Analysis Models (MCAE) 1D Beam/Stick Model 3D Continuum/Brick Model flap support assembly Mode (Behavior) = Deformation

8. 8 Engineering Information Systems Lab  eislab.gatech.edu © GIT e se tr P f 0 2   2 1 e be ht P Cf  ),,( 13 hbrfK  Missing Today: Explicit Design-Analysis Associativity Analysis Model (with Idealized Features) Detailed Design Model Channel Fitting Analysis “It is no secret that CAD models are driving more of today’s product development processes... With the growing number of design tools on the market, however, the interoperability gap with downstream applications, such as finite element analysis, is a very real problem. As a result, CAD models are being re-created at unprecedented levels.” Ansys/ITI press Release, July 6 1999 http://www.ansys.com/webdocs/VisitAnsys/CorpInfo/PR/pr-060799.html idealizations  No explicit fine-grained CAD-CAE associativity inconsistency little automation little knowledge capture

9. 9 Engineering Information Systems Lab  eislab.gatech.edu © GIT X-Analysis Integration Techniques Multi-Representation Architecture (MRA)Explicit Design-Analysis Associativity Analysis Module Creation Methodology Constrained Objects (COBs)

10. 10 Engineering Information Systems Lab  eislab.gatech.edu © GIT Diverse Analysis Integration Projects u Team Integrated Electronic Response (TIGER) –Sponsor: Defense Advanced Research Prog. Admin. (DARPA) (SCRA subcontract) –Domain: PWA/B thermomechanical analysis u Product Data-Driven Analysis in a Missile Supply Chain (ProAM) –Sponsor: U. S. DoD JECPO National ECRC Program –Stakeholder: U. S. Army Missile Command (AMCOM) –Domain: PWA/B thermomechanical analysis u Design-Analysis Associativity Technology for PSI (PSI-DANTE) –Sponsor: Boeing –Domain: Structural analysis u Design-Analysis Integration Research for Electronic Packaging –Sponsor: Shinko Electric –Domain: Chip package thermal resistance analysis AP210 Usage AP210 Usage Potential AP210 Usage

11. 11 Engineering Information Systems Lab  eislab.gatech.edu © GIT Flexible High Diversity Design-Analysis Integration Tutorial Examples: Flap Link (Mechanical/Structural Analysis)

12. 12 Engineering Information Systems Lab  eislab.gatech.edu © GIT Analysis Tools Flexible High Diversity Design-Analysis Integration Aerospace Examples: “Bike Frame” / Flap Support Inboard Beam Analysis Modules (CBAMs) of Diverse Feature:Mode, & Fidelity Design Tools Materials DB FEA Elfini* MATDB-like Analyzable Product Model XaiTools Fitting: Bending/Shear 3D 1.5D Modular, Reusable Template Libraries MCAD Tools CATIA Lug: Axial/Oblique; Ultimate/Shear 1.5D Assembly: Ultimate/ FailSafe/Fatigue* * = Item not yet available in toolkit (all others have working examples) Fasteners DB FASTDB-like General Math Mathematica In-House Codes Image API (CATGEO)

13. 13 Engineering Information Systems Lab  eislab.gatech.edu © GIT Flexible High Diversity Design-Analysis Integration Electronic Packaging Examples: Chip Packages/Mounting (Project with Shinko Electric) EBGA, PBGA, QFP Analysis Modules (CBAMs) of Diverse Mode & Fidelity FEA Ansys General Math Mathematica Analyzable Product Model XaiTools ChipPackage Thermal Resistance 3D3D Modular, Reusable Template Libraries Analysis Tools Design Tools PWB DB Materials DB* Prelim/APM Design Tool XaiTools ChipPackage Thermal Stress Basic 3D** ** = Demonstration module Basic Documentation Automation Authoring MS Excel

14. 14 Engineering Information Systems Lab  eislab.gatech.edu © GIT Outline u Generalized Analysis Integration u Challenges u Techniques and Applications u Experiences with AP210 u Summary

15. 15 Engineering Information Systems Lab  eislab.gatech.edu © GIT ProAM Design-Analysis Integration Electronic Packaging Examples: PWA/B Analysis Modules (CBAMs) of Diverse Mode & Fidelity Design Tools Laminates DB FEA Ansys General Math Mathematica Analyzable Product Model XaiTools PWA-B XaiTools PWA-B Solder Joint Deformation* PTH Deformation & Fatigue** 1D, 2D 1D, 2D, 3D Modular, Reusable Template Libraries ECAD Tools Mentor Graphics, Accel* Analysis Tools PWB Warpage 1D, 2D Materials DB PWB Layup Tool XaiTools PWA-B STEP AP210 ‡ GenCAM**, PDIF* ‡ AP210 DIS WD1.7 * = Item not yet available in toolkit (all others have working examples) ** = Item available via U-Engineer.com

16. 16 Engineering Information Systems Lab  eislab.gatech.edu © GIT Information Requirements of TIGER/ProAM Analysis Modules PWB Warpage (Formula-Based) PWB Warpage (FEA-Based) Solder-Joint Deformation PWA Warpage PTH Deformation Detailed PWB Layup Layer Functions PWB Outline Package Geometry Package Materials Lead/Termination Shape Lead/Termination Material Component Location Solder Joint Shape Solder Joint Material PTH Geometry PTH Plating Material

17. 17 Engineering Information Systems Lab  eislab.gatech.edu © GIT Analyzable Product Model (APM) Technique Combine information and add idealizations Use idealizations Solder-Joint Deformation Model PWB Warpage Model PWA Deformation Model Analysis Models Analyzable Product Model (APM) Design Representations 1 Oz. Cu M100P1P11184 3 x 1080 Detailed component PWA Layout PWB Design E c,  c, c E B,  B, B E S,  S, S E c,  c, c TT TT TT E B,  B, B

18. 18 Engineering Information Systems Lab  eislab.gatech.edu © GIT CAD-APM Integration Technique Analyzable Product Model Mapping Custom Schema D N Source Files Target File Mapping Tool Analyzable - Product Database Analysis Application A1 Analysis Application AM Design Application D1 Translator D1-to-STEP STEP File D 1 Design File D 1 Custom Schema D 1 STEP Schema Design Application DN Translator DN-to-STEP Design File D N STEP File D N STEP Schema Design 1 Translation 2 3 Analysis 4 Mapping Definition Language

19. 19 Engineering Information Systems Lab  eislab.gatech.edu © GIT characterized_definition AP210 Board Outline Information shape_definition_representationproduct_definition_shape geometric_curve_set property_definition_representation shape_aspect inter_stratum_feature curve bounded_curve polylinetrimmed_curvecartesian_point geometric_set_select shape_definition trimming_select geometrically_bounded_2d_ wireframe_shape_representation REAL definition used_representation items[0]elements S[ 0 : ? ] points L[ 2 : ? ]L[ 1 : 3 ] coordinates trim_2 trim_1 S[ 1 : 2 ] ‘board outline’ ‘PCB outline’ name Board outline coordinates curve

20. 20 Engineering Information Systems Lab  eislab.gatech.edu © GIT capacitor resistor surface mount package discrete component integrated component pwb copper foil plated through passage through-hole package location PWA-B APM in TIGER/ProAM Projects electrical component assembly pwa part pwb feature component occurrence solid material pwb copper cladded laminate pwb prepreg set electrical package pwb layer pwb passage linear elastic model solder joint leads (partial)

21. 21 Engineering Information Systems Lab  eislab.gatech.edu © GIT AP210 - APM Mappings curve bounded_curve polylinetrimmed_curvecartesian_point trimming_select REAL points L[ 2 : ? ]L[ 1 : 3 ] coordinates trim_2 trim_1 S[ 1 : 2 ] pwbxy_coordinateREAL outline L[ 1 : ? ] x y Source schema (AP210) Target schema (APM) Mapping assignment curve

22. 22 Engineering Information Systems Lab  eislab.gatech.edu © GIT Iterative Design & Analysis PWB Warpage Analyzable Product Model PWB Layup Design Tool 1 Oz. Cu 2 Oz. Cu Tetra GF 3 x 1080 2 x 2116 2D Plane Strain ModelDetailed FEA Check 1D Thermal Bending Model Layup Re-design PWB Warpage Modules Quick Formula-based Check

23. 23 Engineering Information Systems Lab  eislab.gatech.edu © GIT PWB Warpage Modules a.k.a. CBAMs: COB-based analysis templates PWB Thermal Bending Model (1D formula-based) PWB Plane Strain Model (2D formula-based)

24. 24 Engineering Information Systems Lab  eislab.gatech.edu © GIT Experiences Using AP210 to Drive Analysis u AP210 originally geared toward manufacturing, but good source for analysis too. u Some information not available: –in AP210 (e.g., detailed PTH geometry)* –in typical ECAD database (e.g., detailed PWB layup) u Some design performed by supply chain members –E.g., detailed PWB layup –Need mechanism to add such info to a common repository u Need to coordinate unique identifiers in AP210 data with data from other sources (e.g., part numbers in laminate database) *Note: Used c.1997 AP210 DIS WD1.7. The latest AP210 version may now support such information.

25. 25 Engineering Information Systems Lab  eislab.gatech.edu © GIT Design-Analysis Integration Using STEP and APMs u Domain-specific models (AP210, AP207) are semantically richer than geometry-focused ones (and therefore easier to use for analysis). –Trend toward feature-based, object-oriented CAD –“Smart product models” u Analysis has insatiable information appetite (multi-fidelity) –A given product model cannot support every conceivable future idealization need. –APMs enable additions as needed u Companies can implement mix of company PMs and APMs (along with standard PMs) to support design-analysis requirements for a given set of analysis modules. –Analysis module information needs dictate APM content

26. 26 Engineering Information Systems Lab  eislab.gatech.edu © GIT XAI Summary u Emphasis on X-analysis integration (XAI) for design reuse (DAI,SBD) u Multi-Representation Architecture (MRA) –Addressing fundamental XAI/DAI issues »Explicit CAD-CAE associativity: multi-fidelity, multi-directional, fine-grained –General methodology --> Flexibility & broad application u Research advances & applications –Product data-driven analysis (STEP AP210, GenCAM, etc.) –Internet-based engineering service bureau (ESB) techniques –Object techniques for next-generation aerospace analysis systems –FEA modeling time reduction in pilot tests (chip packages): > 10:1 (days/hours to minutes) Improved Simulation-Based Designs u Tools and development services –Analysis integration toolkit: XaiTools ™ and applications –Pilot commercial ESB: U-Engineer.com –Company-tailored engineering information system solutions u Motivated by industry & government collaboration

27. 27 Engineering Information Systems Lab  eislab.gatech.edu © GIT For Further Information... u EIS Lab web site: http://eislab.gatech.edu/http://eislab.gatech.edu/ –Publications, project overviews, tools, etc. –See: Publications  DAI/XAI  Suggested Starting Points X-Analysis Integration (XAI) Technology http://eislab.gatech.edu/pubs/reports/EL002/ http://eislab.gatech.edu/pubs/reports/EL002/ –Regarding AP210 usage, see especially: »Tamburini, D. R.; Peak, R. S.; Fulton, R. E. (1997) Driving PWA Thermomechanical Analysis from STEP AP210 Product Models. 1997 ASME Intl. Mech. Engr. Congress & Expo., Dallas. http://eislab.gatech.edu/pubs/conferences/wam97-tamburini/ http://eislab.gatech.edu/pubs/conferences/wam97-tamburini/ »Product Data Driven Analysis in a Missile Supply Chain, http://eislab.gatech.edu/projects/proam/ http://eislab.gatech.edu/projects/proam/ u XaiTools ™ home page: http://eislab.gatech.edu/tools/XaiTools/http://eislab.gatech.edu/tools/XaiTools/ u Pilot commercial ESB: http://www.u-engineer.com/http://www.u-engineer.com/ –Internet-based self-serve analysis –Analysis module catalog for electronic packaging –Highly automated front-ends to general FEA & math tools

28. 28 Engineering Information Systems Lab  eislab.gatech.edu © GIT Nomenclature