1. High Density Packaging User Group
Counterfeit PCB Materials Update 03/11/15

2. © HDP User Group International, Inc.
Problem Statement
The initial working group has identified two threats:
Safety aspect - A case was cited where solder mask failed and an electrical fire resulted. The counterfeit material was „ green, and looked normal“.
Trust aspect – Where the whole board was counterfeit, or where circuitry was added to design to accomodate malicious third party intent
Agreement – limit to Safety aspect for now
© HDP User Group International, Inc.

3. Purpose Statement 1
The Counterfeit PCB Materials Project identifies and investigates two issues in the electronics industry: Safety as a function of counterfeit materials, and Trust involving anti-counterfeit, anti-tamper, chain of custody and access control. The output of this project is a white paper assessing the validity of claims concerning potential insecure practices in the PCB Materials industry, dispelling or validating known rumors and recommending any needed changes. Recommendations may include possible surveillance schemes or techniques and third party verification of material bill of materials or chemical composition.

4. Purpose Statement 2
This project will not investigate PCB fabrication security relating to circuit verification and possible Trust issues related to changes made to layout at the PCB level. That is beyond the scope of the current project and will be considered for a future white paper specifically focused on those issues.

5. Team Activity Update
Team call with Underwriters Laboratories to understand their process for inspecting and certifying printed circuit boards
Certification of board shops worldwide
Flammability of masks and laminate
Periodic sample/inspection for use of approved UL materials and processes

6. Team Activity
Conference call with Underwriters Labs about UL problems and solutions to the Counterfeit Problem overall.
Plan for further data gathering from sources, including Feb. at IPC Expo
Potential participation in counterfeit events – CALCE Seminar June?

7. Team Activity
Conversation with Bob Neves of MicroTek Changzhou Lab at Expo
Counterfeit layers are made in China, and inserted between good outer layers
Counterfeit solder mask is used in China
MicroTek has defined process to detect these and does so routinely

8. Current Issues
Safety - A non-recognized laminate is substuted for a recognized UL 94 V-0 grade, giving the potential for fire hazard.
Safety – A non recognized solder mask is packaged in legitimate, UL marked containers and either knowingly, or unknowingly sold to a circuit board manufacturer. Potential fire hazard.
Safety – UL inspectors only check labels of mask and laminate at fabs. No FTIR scan.
© HDP User Group International, Inc.

9. Further Issues
Observation for Cyber Physical Systems (CPS) Security occurances – the combination of software and hardware attack. Malicious. Involves anti-counterfeit, anti-tamper, chain of custody, and access control. Is it an electronics interconnection problem?
Potential for Future Phase as determined by HDP membership vote.
© HDP User Group International, Inc.

10. Further Issues
Review of past work for “certification” of circuit board constructions.
IPC effort to “purchase”? certification of PCB construction through -
NADCAP (National Aerospace and Defense Contractors Accreditation Program) UL
Embryonic IPC Certification effort now – built to IPC standards J001, A610, Intellectual property protection
© HDP User Group International, Inc.

11. How can HDPug help the industry?
The Counterfeit PCB Materials Team has proposed creation of a White Paper as a fact-finding mission.
Find out if the Safety thrust is a significant threat to membership/general public and to what extent the threat exists.
This will allow HDPug to bring these issues to the attention of the industry and to determine what steps to take next.
© HDP User Group International, Inc.

12. Proposed Plan Forward
Survey HDPug Membership Interest 2Q15 (after Members Meeting)
UL Counterfeit Group information 2Q15 – further presentations
Confirm methodology (FTIR - ATR) 3Q15 – Sample parts
Contact IPC for interest in participation 3Q15 – Certification process
We will write a white paper summary 2Q16

13. Project Participants to date
SAIC/US Dept. of Defense
NIST
NMIC
Intel
Celestica UL
Panasonic
© HDP User Group International, Inc.