1. 1 Conceptual design adopts state-of-the-art silicon sensor techniques (compare ATLAS/CMS/ALICE inner tracker layers, BaBar tracking of B mesons). Design features: Minimum of 4 space points forward of 90° Barrel and forward disk structures Pixels and double-sided strips Smallest possible inner radius Fast and untriggered readout The Micro-Vertex Detector of PANDA

2. 2 Micro-Vertex Detector 10 cm

3. 3 The PANDA Micro-Vertex Detector Experimental task list: Precision identification of D mesons by fast reconstruction Measurement of long-lived baryons and mesons (open charm and strangeness) Seeding for tracking device through high time-resolution and precise spatial information close to the vertex point Limited particle identification

4. 4 The PANDA Micro-Vertex Detector Contributors and Competence: TU Dresden (  group moving to U Bonn): Strip sensor tests, layout, mechanics, readout for strip sensor part. ELBE electron accelerator, ELSA electron accelerator, neutron generators, neutron sources, skilled electronics lab.

5. 5 The PANDA Micro-Vertex Detector Contributors and Competence: FZ Jülich: Pixel detector readout, mechanics. COSY proton synchrotron, very skilled mechanics and engineering infrastructure, very skilled electronics infrastructure, experience in silicon detector technology.

6. 6 The PANDA Micro-Vertex Detector Contributors and Competence: INFN Torino: Pixel sensor readout and tests, layout, mechanics, readout for pixel sensors, sensor R&D. Long-term involvement in CERN LHC experiments, pixel sensor development at all stages, in particular readout, design of front ends on chip level, practical experience in the setup and operation of large silicon detector arrays.

7. 7 The PANDA Micro-Vertex Detector Cooperation and common interest with: CBM/GSI: Technology for strip detector readout due to very similar requirements and challenges  n-Xyter development for a strip sensor frontend with triggerfree readout. PANDA hypernuclei experiment (U Mainz). Sensor foundries (CIS, ITCirst). FH Aachen (lightweight frame)

8. 8 Conceptual design adopts state-of-the-art silicon sensor techniques (ATLAS/CMS/ALICE inner tracker layers) Design features: 5 layers forward of 90° Barrel and forward disk structures Pixels and double-sided strips Smallest possible inner radius Fast readout Micro-Vertex Detector p beam 10 cm pellet or cluster jet target

9. 9 Detector Optimization in Simulations

10. Micro-Vertex Detector - Simulations rate / ^MHz Calculations of various reaction channels, UrQMD, DPM of p on p and nuclear targets - rate estimates (data rates → electronics!) - reconstruction → resolution → detector layout - mechanics very anisotropic load! 10

11. Micro-Vertex Detector - Simulations 11

12. Micro-Vertex Detector - Simulations Radiation load maps pp at 10 GeV/c pPb at 4.05 GeV/c 12

13. 13 Detector Optimization in Simulations

14. 14 Mechanical Model – v1.0

15. 15 Micro-Vertex Detector – Building Blocks Two compact layers of pixel sensors: Barrel structures Forward walls integrated in the disks Two layers of pixel sensors: Barrel structures from double-sided rectangular sensors Forward pizzas from trapezoidal sensors Additional pizzas further downstream to supplement forward tracking ► total of four disks

16. 16 Micro-Vertex Detector - Pixels PANDA optimized pixel layout: Small pixel cells – 100 x 100 µm 2 Specialized custom hybrid features:-.13 µ technology - ToT to retain (some) energy information - fast handling for high data rates - “untriggered” readout of data - rad hard within “typical” limits - minimum material load  sensor technology

17. 17 TOPIX ASIC.13 µ technology pixel size 100x100 µm 2 high readout capability sufficient buffering to operate without trigger ToT Sensors on EPI: < 100 µm thickness

18. 18 Readout Prototype Versatile digital readout board First tests with ATLAS FE Digital part can be adapted to TOPIX

19. 19 Mechanics cooling, cables, frames CARBON FIBER 0,2 mm FOAM 1 mm PIXEL + CABLE 0,2 mm Overlapping layout Turbo layout Work on mechanical layout Scenarios for cooling: - Cooling liquid (water or C6F14) - Evaporative cooling system

20. 20 Micro-Vertex Detector - Strips PANDA strip layers: Substitute strips for pixels to keep number of space points with less traversed material where possible Use standard solutions where possible features:- pitch of 50 – 100 µm - double-sided sensors, 200 µm thick - need specialized solution for front-end to achieve untriggered readout  synergy CBM / PANDA on n-XYTER - minimum possible thermal load

21. 21

22. 22 Strip Sensors – Test Station sensor sensor “telescope” ITCirst, 20x20 mm 2 50 µm pitch

23. 23 Strip Sensors – Test Station sensor “telescope” ITCirst, 20x20 mm 2 50 µm pitch Readout of signals: front end APV25 S1 50 µm

24. 24 Strip Sensors – Test Station

25. 25  single-side readout 1 readout slice / 128 channels (one APV 25) Strip Sensors – Test Station

26. 26 Strip Sensors – Test Station

27. 27 PANDA MVD Summary PANDA will greatly benefit from a state-of-the-art silicon tracking device. PANDA-specific challenges: very compact design, high and anisotropic data rates, free-running DAQ concept (untriggered readout), material budget. PANDA-specific solutions needed: pixel readout, strip front-end (synergy with other FAIR experiments), compact arrangement around fixed target.

28. 28 PANDA MVD Summary (II) Silicon detector development uses and drives key technologies of solid state industry (e.g. flip chip in 130 nm rad-hard) The PANDA MVD project suffers from a lack in qualified contrbutors, in particular in the strip part, more specifically in the critical forward disk part. Russian groups interested in the PANDA MVD have had great impact in detector developments of large scale experiments such as D0. Their bid to assume a leading role in the PANDA MVD project in a very critical and as of yet unsolved detector region will have great impact and will be highly welcomed.