1. Lecture on Integrated Circuits (ICs)

2. History 19th Century - Solid-State Rectifiers
Application of Crystal Detector in Radio Sets
BJT Constructed by Bardeen and Brattain
1959 – Integrated Circuit Constructed by Kilby
Complexity grows by Moore’s Law
In 1965, Gordon Moore predicted that the number of transistors that can be integrated on a die would double every 18 to 14 months .

3. Moore’s Law in Microprocessors
4004
8008
8080
8085
8086
286
386
486
Pentium® proc P6
0.001
0.01
0.1 1 10
100
1000
1970
1980
1990
2000
2010
Transistors (MT)
2X growth in 1.96 years!

4. DRAM Chip Capacity 4X growth every 3 years! human memory book
encyclopedia
book m m m m m m
page

5. Resolution of Features of ICs
Chip technology described by the dimensions of line width and typical transistor size. Today, the chip resolution is around 50 nano meters, or 0.05 micron.

6. IC Design and Manufacturing Process
Intellectual
Properties
Circuit Design by Tools
Mask Design
Back-End Manufacturing
Front-End Manufacturing
Bonding
Packaging
Test equipment
Process Auto
Lithography
Etch/Doping
Diffusion
Deposition
Packages
Wafers

7. IC Design Tasks Synthesis Architecture Design Design Planning
Test
Power
Physical
Synthesis IP
Architecture Design
Design Planning
Design Database
Verification IP
Assertions and Testbenches
Languages
Timing and Signal Integrity
Physical Implementation
Verification
Extraction
Physical Verification
Mixed Signal / Analog
Mask Synthesis / OPC

8. Silicon Crystal – Better than Gold
Quartz, or Silica, consists of Silicon Dioxide
Sand contains many tiny grains of quartz
Silicon can be artificially produced by combining silica and carbon in electric furnace
Practical integrated circuits can only be fabricated from single-crystal material

9. Crystal Growth
Solid seed crystal is rotated and slowly extracted from a pool of molten Si
Requires careful control to give crystals desired purity and dimensions

10. Ingot

11. Getting Wafers from Ingot
Sliced by diamond-tipped saw into thin wafers
Etch wafers in chemical to remove any unwanted
Smooth surface

12. Photolithography
Photolithography is a technique that is used to define the shape of micro-machined structures on a wafer.

13. Lithography Machine

14. Make “mask” defining electrical circuitry.
Coat wafer with “photoresist” (sensitive to UV light)
where the mask is not present.
UV light
reduction lens
Wafer

15. Start
Stop

16. Oxidation of Silicon (SiO2)
Thick (­ 1µm) oxides are used as insulation

17. Etching: Process where unwanted areas of films are removed by either dissolving them in a wet chemical solution. Wanted areas are protected by resist.
Doping: Process where certain material is implanted into substrate.

18. Clean Room First used for surgery room to avoid bacteria contamination
Adopted in semiconductor industry in 1950
Smaller device needs higher grade clean room
Less particle, more expensive to build
Class 10: less than 10 particles with diameter larger than 0.5 mm per cubic foot
Class 1: less than 1 such particles per cubic foot.
0.18 mm device require higher than Class 1 grade clean room.

19. Effect of Particles
Particle on Mask
Film
Substrate

20. Cleanroom Structure Makeup Air Makeup Air Fans Equipment Area
HEPA Filter
Class 1000
Class 1000
Process Tool
Process Tool
Class 1
Process Area
Return Air
Raised Floor with Grid Panels
Pump, RF and etc.

21. Wafer with Circuit Fabricated

22. Bonding Pad Configurations
Peripheral Bonding Pads
Area Array Bonding Pads
Pads Range from 125 m x 125 m down to 25 m x 25 m

23. Package Types Ball Grid Array (BGA) Dual In Line Package (DIP)
Single In Line Package (SIP)
Zig Zag In Line Package (ZIP)
Small Outline Transistor (SOY)
Quad Flat Pack a(DIP)
Pin Grid Array (PGA)

24. Ball Grid Array Solder

25. Gold Wire Bonding

26. Ball Grid Array (BGA) Package
Assembled IC
Ball Grid Array (BGA) Package

27. Using ICs on Circuit Board
Surface mount
Tombstone
Dead-bug
Via hole mount

28. Wave Soldering
PCB IC

30. What’s Next?

31. Who Work in IC Industry? Mechanical engineers Chemical engineers
Electrical engineers
Systems engineers
Civil engineers
Physicists
Chemists
Material Scientists
Mathematicians
Well, lawyers, finance majors, etc. too.

32. Good Luck and God Bless!!