1. Overview of a Space Qualification Process -
Radiation characterization and beyond
L. BONORA, ESA/ESTEC-Component Division
Xanthi - Oct 2006
ESA/ESTEC
TEC-QCS

2. Radiation: effects on EEE components Radiation: tests & requirements
SUMMARY
Radiation: effects on EEE components
Radiation: tests & requirements
Beyond radiation, overview of the relevant requirements for space components/flight models.
ESCC Evaluation/Qualification Approach
Minimum Quality Management Requirements
ESA/ESTEC
TEC-QCS

3. Radiation: effects on EEE components (1)
Total Ionizing Dose (TID)
Degradation of μelectronics and optoelectronics
Cumulative long term effects
Parameter drifts, threshold shifts, timing changes, functional failures
Non Ionizing Effects – Displacements Damage
Degradation of optoelectronics (GaAs …), CCDs, bipolar technologies in very harsh environments
Cumulative long term effects ( disruptions of crystal lattice)
CMOS technologies less affected ( majority carriers)
ESA/ESTEC
TEC-QCS

4. Radiation: effects on EEE components (2)
Single Event Effects (SEE)
Single charged particles (heavy Ions and protons) passing through a semiconductor material
Soft errors: data corruption (SEU), system shutdown (SEFI), transients (SET)…
Hard errors ( sometimes destructive): Latch-up ( SEL), Stuck bits (SHE), Gate ruptures ( Power MOSFETs and thin capacitors in analog devices)…
New effect types or unknown manifestations of known effects always possible especially for new technologies
ESA/ESTEC
TEC-QCS

5. Radiation: Tests and requirements for TID
Usual particle type: γ rays (1.17 & 1.33 MeV) from Co60 sources
Effects similar to/ representative of space radiation
High penetration (parts irradiated “as is” on test boards)
European Specification: ESCC
Experimental Set-up
Sample size: (10 + 1) parts in gal, from a single lot
Static bias ( considered as a worst case) ON and OFF
Total dose ~100 krad(Si) max. in several steps (0/5/10/20/50/100)
Dose rate < 360 rad(Si)/h
Actual space dose rate very low ( a few rad(Si)/h)
High dose rate not relevant for bipolar/ BiCMOS technologies due to ELDRS
Facilities: one source at ESTEC, several in Europe (e.g., ONERA Toulouse)
ESA/ESTEC
TEC-QCS

6. Radiation: Tests and requirements for SEE (1)
General:
Characterization: experimental curve σ vs. LET (HI) or energy (p+)
σ = ratio number of events / number of incident particles
Key parameters: σ sat, LETth and Weibull fit
For LETth < 12 MeV.cm2/mg → proton sensitivity possible
Based on these parameters → event rate calculations
For SET, pulse energies are also important
pulse amplitudes and durations have to be determined
For some events (e.g., SEGR), destruction of the test samples can’t be prevented
Results may be strongly dependent from test patterns or application conditions
European Specification: ESCC
ESA/ESTEC
TEC-QCS

7. Radiation: Tests and requirements for SEE (2)
Experimental method:
Fluences > 106 HI/cm2 or > 1010 p+/cm2
Sample size: ( 3+1) min.
Particle range > 30 μm
Bias: dynamic or static
The range of LETs (HI)/Energies (p+) must be sufficient to determine threshold and saturation
A min. of 5 LET/Energy steps is required
De-lidded parts for HI – Back side irrad. possible
Experimental Set-up
ESA supported facilities: HIF(B), PSI (CH), RADEF (F)
Other facilities in Europe (IPN- Orsay) or in the USA (BNL …)
ESA/ESTEC
TEC-QCS

8. Radiation: Tests for Displacement Damage
Experimental method:
Unit of interest: NIEL ( Non Ionizing Energy Loss)
Affected types: CCDs / Optocouplers / GaAs (and similar material) based components …
Ground test:
protons ( pref. < 60 MeV), fluences > 1010 p+/cm2
neutrons ( ~ 1MeV), fluences > 1010 n/cm2
Some parts are also TID sensitive ( if a silicon chip is included)
Sensitivity to bias conditions
ESA/ESTEC
TEC-QCS

9. Radiation: points of contact at ESTEC & facilities availability
Who to contact ? Radiation Effects Section (TEC-QCA)
TID, DD: Ali Mohammadzadeh -
SEE: Reno Harboe - Sorensen -
Availability of the facilities can be checked on line in ESA radiation section of ESCIES
https//escies.org
ESA/ESTEC
TEC-QCS

10.  A lot more is required to get a Flight Model
Radiation characterization of a component/technology is a mandatory step BUT
 A lot more is required to get a Flight Model
At this stage, one has to distinguish between:
An approval on a case by case basis which is an individual and limited authorisation for a specific project
A full ESCC Qualification ( including an Evaluation phase in the ESCC system) which is a general and long term authorisation of use in space
Let’s first briefly present the relevant requirements
ESA/ESTEC
TEC-QCS

11. RELEVANT REQUIREMENTS
ECSS European Coop. for Space Standardisation
Space Project Management; Space Product Assurance; Space Engineering
ECSS-Q60A: Requirements for supply and use of EEE components at equipment level
ESCC European Space Components Coordination
( ESCC is the preferred option)
The ESCC System is an international system for the specification / qualification / procurement of EEE components for use in Space programmes. It covers:
the technical specification of EEE parts
methodologies for component evaluation and qualification
testing methods / quality assurance / operational provisions
ESA/ESTEC
TEC-QCS

12. RELEVANT REQUIREMENTS
ECSS- Q60A
Non-qualified components have to be evaluated
ECSS defines what to do but not how to do
The evaluation programme shall include:
A constructional analysis
A manufacturer assessment
An Evaluation testing
Electrical stress ( Life test, HTRB …)
Mechanical stress ( shocks, vibrations …)
Environmental stress ( temp. shock and cycling, seal tests …)
Assembly capability
Radiation testing ( TID and SEE)
ESA/ESTEC
TEC-QCS

13. ESCC Eval. / Qualif. Approach: The ESCC system in brief
An international system for the specification / qualification / procurement of EEE components for use in Space programmes
For users, 3 levels of specifications:
Basic: test methods, qualification methodology and general requirements applicable to all ESCC components
Generic: requirements for screening, periodic or lot acceptance testing and qualification testing for individual families of components
Detail: performance requirements for individual or ranges of particular components
ESCC – Using the ESCC Specification System
ESA/ESTEC
TEC-QCS

14. ESCC QUALIFICATION
ESCC qualification approval is a status given to electronic components which are manufactured under controlled conditions and which have been shown to meet all the requirements of the relevant ESCC specifications.
Unlike the US MIL System, ESCC is based on a 2 step qualification approach: Evaluation + Qualification
During the Evaluation phase, components/technologies can be more extensively characterised and margins determined
3 main phases:
Manufacturer Evaluation ( ESCC 20200) -> AUDIT
Component Evaluation ( ESCC and ancillaries)
Preparation and realization of an agreed Evaluation Test Program ( ETP) including:
Constructional analysis and technology evaluation
Step-Stress testing
Preparation of a Process Identification Document (PID) & Detail Specification
Component Qualification testing
On components produced strictly as defined in the final PID and from a given lot
According to ESCC Generic Spec. requirements
ESA/ESTEC
TEC-QCS

15. ESCC QUALIFICATION COMPONENT EVALUATION Constructional Analysis
Stand. Comp. Eval
COMPONENT EVALUATION
Constructional Analysis
On random samples taken from the current production
Performed by the Evaluation Authority (ESCC Executive)
Evaluation Test Programme
Established in conjunction Manufacturer / ESCC Executive
On a sample ( ~ 100 parts) representative of the component family
In order to determine failure modes and margins, it includes:
Endurance tests ( HTRB, Extended Burn-in, Life Test …)
Destructive tests ( Step-stress, radiation, Environmental/Mechanical/Assembly…)
Includes a CA on representative components
Ancillary specifications 226xxxx* describe the procedure and requirements to create and perform an ETP
*: xxxx = generic spec. number
ESA/ESTEC
TEC-QCS

16. ESCC QUALIFICATION COMPONENT EVALUATION
Stand. Comp. Eval
Process Identification Document ( PID)
Shall be prepared by the Manufacturer
Establishes a precise reference for an electronic component qualified in accordance with the ESCC System
Component’s design configuration
Materials used in manufacture
Manufacturing processes and controls
Inspections and tests to be carried-out during and after manufacture
PID shall be in accordance with the requirements of ESCC 22700
Detail Specification
Necessary if not already described by an existing Detail Specification
Or if the existing specification requires updating
Described in ESCC
ESA/ESTEC
TEC-QCS

17. QUALIFICATION TESTING PHASE
ESCC QUALIFICATION
QUALIFICATION TESTING PHASE
Prerequisites:
Successful completion of the Evaluation Phase (EPPL listing)
The PID reviewed and approved by ESCC Executive
A production and test schedule for major processing operations
A Production Flow Chart, Process Schedules and Inspection Procedures
Components required for qualification testing must be produced strictly in accordance with the PID
Qualification testing of the component must be in accordance with the requirements of the relevant ESCC Generic Specification
On successful completion of the testing phase => ESCC QPL
A Qualification, once established, is valid for 2 years
ESA/ESTEC
TEC-QCS

18. Integrated Circuits, Monolithic, hermetically Sealed
ESCC Gen. Spec
Integrated Circuits, Monolithic, hermetically Sealed
CHART F1
ESCC 9000
describes the general requirements for
Qualification
Qualification maintenance
Procurement
Delivery
of hermetically sealed, hermetic ICs.
ESA/ESTEC
TEC-QCS

19. ESCC – CHART F3
ESA/ESTEC
TEC-QCS

20. ESCC 9000 – CHART F4
ESA/ESTEC
TEC-QCS

21. QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
QUALITY MANAGEMENT
As a minimum, the QM plan shall address the requirements of ESCC 24600
QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
As a minimum, the Manufacturer quality management plan must address the ESCC requirements ( prescriptions to ISO 9001).
The resulting Manufacturer quality management system has to include and demonstrate the application of all the applicable ESCC requirements.
ESA/ESTEC
TEC-QCS

22. QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
QUALITY MANAGEMENT
As a minimum, the QM plan shall address the requirements of ESCC 24600
QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
An appointed CHIEF INSPECTOR with clearly defined authority and responsibility ( including CoC)
CONTROL of NON-CONFORMING PRODUCTS invoking the requirements of ESCC 22800
QUALITY and CONTROL DOCUMENTATION including:
Quality manual ( indicating as a objective the conformance to ESCC 24600)
Document control procedures for all documents related to the ESCC components manufacture ( incl. subs./suppliers management)
A maintained PID
Change Control Programme establishing the requirement for documentation of ALL changes, their reasons and the associated data including reliability and re-qualification results
ESA/ESTEC
TEC-QCS

23. QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
QUALITY MANAGEMENT
As a minimum, the QM plan shall address the requirements of ESCC 24600
QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
TRACEABILITY has to be maintained at all stages of production and tests for all lots
Quality records have to be maintained for 5 years ( possibly 10 in a near future)
Record of all components found to be defective
A Conversion of CUSTOMER REQUIREMENTS (specific tests or test vehicles, marking, rework, screening )
A CONTROL/INSPECTION prog. Including:
On-receipt / incoming tests / inspections
Applicable ESCC in-process monitoring/control and back-end tests
Procedures shall detail the frequency, methods and criteria for evaluating test results
Data shall be maintained
ESA/ESTEC
TEC-QCS

24. QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
QUALITY MANAGEMENT
As a minimum, the QM plan shall address the requirements of ESCC 24600
QUALITY CONFORMANCE DOCUMENTATION AND REQUIREMENTS
A training and certification programme with periodic recertification ( for operators involved in ESCC components manufacture)
An appropriate failure analysis capability has to be established with documented procedures for the application of the techniques and the generation of reports. This capability may include the use of appropriate external facilities.
A Calibration programme to meet ESCC 21500
ESA/ESTEC
TEC-QCS