1. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 CHAPTER 10

2. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Master Figure

3. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.1

4. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.2

5. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.3

6. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 10.4 a, b (a)(b)

7. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.5

8. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Cu Surface Treatment CVD Dielectric Via Lithography and Etch Line Lithography and Etch, TaN barrier Cu CMP TaN Clean Post CMP Clean Cu Electrofill and Anneal PVD Cu Seed Fig. 10.6

9. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.7

10. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.8

11. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.9

12. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.10

13. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.11

14. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.12

15. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.13

16. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.14

17. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.15 Resistance (m  ), Capacitance (fF), Inductance (pH)

18. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.16

19. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.17

20. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.18

21. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.19

22. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.20 Substrate Si Chip Substrate Si Chip Critical failure site - strain concentration Failure sites – no strain concentration

23. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.21

24. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.22

25. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.23

26. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.24

27. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.25

28. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.26 Stress Compensation Layer

29. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.27

30. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.28

31. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.29 0 5 10 15 20 25 30 Cr/thin Cu Al/Ni(V)/CuThick CuThick NiCu/Thick Ni UBM Current Crowding Ratio

32. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 10.30 a, b, c (a)(b) (c)

33. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 31

34. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.32 Current Density Additives Conc.of noble nutal % Ag or % Cu inside Sn

35. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig 10.33 Current crowding at solder Less current crowding at solder Passivation UBM Al trace

36. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.34

37. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.35 STUD BUMPING COST 0 50 100 150,000300,000 BUMPS PER WAFER PRICE PER BUMPED WAFER A B C A:Electroless Ni- Immersion Au B:Solder Plating C:Gold Plating

38. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 10.36 a, b (a) (b)

39. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.37

40. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.38

41. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.39

42. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.40

43. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.41

44. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.42

45. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.43

46. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.44

47. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.45

48. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.46

49. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.47

50. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Si CNT Substrate Solder UBM Substrate Flip and reflow Remove Si for CNT transfer Sputter metal Si Substrate Fig. 10.48

51. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.49

52. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.50

53. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.51

54. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.52

55. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig 10.53

56. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.54

57. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.55

58. Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 10.56