1. NEWS  Internal Review  November 20  Presentation covering most of the relevant L4 WBS activities: rf shielding, substrate,Vacuum vessel, Position control system, Cooling system, Pixel support frame  3 hours of presentation  Discussion with the Reviewers  Question: individual comments from reviewer, written report  Charge to the reviewers

2. ESLI  48 glassy carbon tubes delivered  1.5mm OD (23), 1.2mm OD (25)  Four of each being sent to Iowa and WSU  Properties: see attached spreadsheet  Tests planned: impact test of joints, strength test of the tubes, solution to manifold, irradiation test, corrosion test  Wall thickness found to be non-uniform

4. RF shielding  Alex will report on the FEA  We met with Weiren Chou (BD) to discuss the shielding. Chou will do calculation on the beam effects: impedance, heating, and image current return  Also discussed with Cary and Mark on prototyping; would like to fabricate a short section (welding, stamping, EDM, laser cut etc)

5. Be substrate ( for CM )  More movies taken with small bump  Conclusion: not much difference  Proposed to adopt Charles’ idea; make it solid Be at the notch  Had a meeting with Mike H., Mike R., Jim Fast on the alignment holes – lead to some changes in the precision of the holes, ideas on assembly etc  We should try out the procedure; Zeiss 850 available to us; will use it for the thermal displacement test but also for the assembly practice

6. Be substrate

7. FEA  Recall that bump bond is the weakest link according to FEA  We can improve the strength by putting in underfill around the corners  Our test using ATLAS 2x8 module with 5 FPIX1 chips bonded is still OK after a few thermal cycles

8. FEA (cont)  Big stress on the epoxy layer because if CTE mismatch between Si and Be  Factor of 3 larger than strength of any known epoxy  Separate the epoxy layer into