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David.Attie@cea.fr Astrophysics Detector Workshop – Nice – November 18 th, 20081 David Attié — on behalf of the LC-TPC Collaboration — Micromegas TPC Large Prototype beam tests TILC09 – Tsukuba – April 17-21, 2009
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Outline David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 20092 Introduction, solutions for ILC-TPC Micromegas with resistive anode –description –previous results The Large Prototype (LP) Micromegas panels in the LP –drift velocity –pad response function –resolution Conclusion
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How to improve the spatial resolution? David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 20093 Need for ILC: measure 200 track points with a transverse resolution ~ 100 μm example of track separation with 1 mm x 6 mm pad size: 1,2 × 10 6 channels of electronics z=0 > 250 μm amplification avalanche over one pad Spatial resolution σ xy : limited by the pad size ( 0 ~ width/√12) charge distribution narrow (RMS avalanche ~ 15 μm) 1. Decrease the pad size: narrowed strips, pixels + single electron efficiency –need to identify the electron clusters 2. Spread charge over several pads: resistive anode + reduce number of channels, cost and budget + protect the electronics –limit the track separation –need offline computing –time resolution is affected 2. Resistive anode Simulation for the ILC-TPC 55 m 1. Pixels
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Micromegas David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 20094 Micromegas Best technology for gaseous detector readout: Micro Pattern Gaseous Detector more robust than wires no E×B effect better ageing properties easier to manufacture fast signal & high gain low ion backdrift MICROMEsh GAseous Structure Y. Giomataris et al., NIM A 376 (1996) 29 metallic micromesh (typical pitch 50μm) sustained by 50-100 μm pillars simplicity single stage of amplification fast and natural ion collection discharges non destructive ~50 µm ~50 kV/cm cathode ~1 kV/cm
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Resistive anode David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 20095 (r,t) integrate over pads (r) r (mm) Q(t) t (ns) M.S.Dixit et.al., NIM A518 (2004) 721 One way to make charge sharing is to make a resistive anode Equivalent to adding a continuous RC circuit on top of the pad plane. Charge density ρ(r,t) obeys 2D telegraph equation: R R R R R R R R C C C C C C C RpRp RpRp RpRp Current generators Pad amplifiers Signal pickup pads Resistive foil
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Resistive anode David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 20096 M.S.Dixit and A. Rankin NIM A566 (2006) 281 2 x 6 mm 2 pads (r,t) integrate over pads (r) r (mm) Q(t) t (ns) Simulation Data
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Micromegas with resistive anode David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 20097 TPC COSMo (Carleton-Orsay-Saclay-Montreal) at DESY in 2006 + Micromegas 10 x 10 cm² (gap 50 μm) + resistive anode used to spread charge over 126 pads (7x18) of 2x6 mm² 15 cm drift space 25 µm mylar with Cermet (Al-Si) of 1 M /□ glued onto the pads with 50 µm thick dry adhesive 5 T magnet at DESY + TPC COSMo Micromegas TPC COSMo Resistive foil Glue pads PCB mesh Resistive anode
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Spatial resolution at 0.5T David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 20098 B = 0.5T, resolution fitted bywhere Resolution 0 ( at z = 0) ~ 50 µm still good at low gain (will minimize ion feedback) Mean of N eff = 27 (value measured before ~ 22) Gain = 4700 Gain = 2500 N eff =25.2±2.1 N eff =28.8±2.2 0 = 1/40 of pad pitch
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Spatial resolution at 5T David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 20099 Analysis:- Curved track fit - E P < 2 GeV - | | < 0.05 (~3°) Ar Iso (95:5) B = 5T Ar Iso (95:5) B = 5T 50 m ~ 50 µm independent of the drift distance Extrapolate to B = 4T with T2K gas for 2x6 mm2 pads: D Tr = 23.3 μ m/ cm, N eff ~ 27, 2 m drift distance, Resolution of Tr 80 m will be possible !!!
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ILC-TPC Large Prototype David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200910 Built by the collaboration Financed by EUDET Sharing out : - magnet : KEK, Japon - field cage : DESY, Allemagne - trigger : Saclay, France - endplate : Cornell, USA - Micromegas : Saclay, France - GEM : Saga, Japon - TimePix pixel : F, D, NLc
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ILC-TPC Large Prototype David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200911 Endplate ø = 80 cm of 7 interchangeable panels of 23 cm: –Micromegas –GEMs –Pixels (TimePix + GEM or Microgemgas) 80 cm 24 rows x 72 columns ~ 3x7 mm 2
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Bulk Micromegas panels tested at DESY David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200912 Two panels were successively mounted in the Large Prototype and 1T magnet -standard anode -resistive anode (carbon loaded kapton) with a resistivity ~ 5-6 MΩ/□ Two other resistive technology are planned to be tested: -resistive ink (~1-2 MΩ/□) ready for next beam tests in May -a-Si thin-layer deposit (N. Wyrsch, Neuchatel) in preparation Standard bulk Micromegas module Carbon loaded kapton Micromegas module
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Beam test conditions David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200913 Bulk Micromegas detector: 1726 (24x72) pads of ~3x7 mm² AFTER-based electronics (72 channels/chip): –low-noise (700 e-) pre-amplifier-shaper –100 ns to 2 µs tunable peaking time –full wave sampling by SCA Beam data (5 GeV electrons) were taken at several z values by sliding the TPC in the magnet. Beam size was 4 mm rms. –frequency tunable from 1 to 100 MHz (most data at 25 MHz) –12 bit ADC (rms pedestals 4 to 6 channels)
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ILC-TPC Large Prototype David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200914
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5 GeV e - beam data in T2K gas David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200915 Frequency sampling: 25 MHz T2K gas: Ar/CF 4 /iso-C 4 H 10 (95:5:3) B = 1T Peaking time: 500 ns
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Pad signals: beam data sample David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200916 RUN 284 B = 1T T2K gas Peaking time: 100 ns Frequency: 25 MHz
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Pad signals: cosmic-ray data sample David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200917 RUN 294 B = 1T T2K gas Peaking time: 1 μs Frequency: 100 MHz
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Systematics David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200918 Displacement / vertical straight line ( μ m) Pad line number rms displacement: ~9 microns B = 0T
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Drift velocity measurement David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200919 Measured drift velocity (E drift = 230 V/cm, 1002 mbar): 7.56 ± 0.02 cm/ μ s Magboltz: 7.548 ± 0.003 for Ar/CF 4 /iso-C 4 H 10 /H 2 O (95:3:2:100ppm) B = 0T
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Drift Velocity vs. Peaking Time David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200920 E drift = 220 V/cm V d Magboltz = 76 m/ns B=1T data For several peaking time settings: 200 ns, 500 ns, 1 µs, 2µs E drift = 140 V/cm V d Magboltz = 59 m/ns Z (cm) Time bins
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Determination of the Pad Response Function David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200921 Fraction of the row charge on a pad vs x pad – x track (normalized to central pad charge) Clearly shows charge spreading over 2-3 pads (use data with 500 ns shaping) Then fit x(cluster) using this shape with a χ² fit, and fit simultaneously all lines to a circle in the xy plane x pad – x track (mm) Pad pitch
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Residuals (z=10 cm) David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200922 Lines 0-4 and 19-23 removed for the time being (non gaussian residuals, magnetic field inhomogeneous for some z positions?) row 5row 6row 7 row 8 row 9row 10
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Residuals (z=10 cm) David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200923 There is a residual bias of up to 50 micron, with a periodicity of about 3mm. Unknown origin: –Effect of the analysis? –Or detector effect: pillars? Inhomogeneity of RC? row 6 row 7 row 8
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Spatial resolution at 1T David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200924 Resolution (z=0): σ 0 = 46±6 microns with 2.7-3.2 mm pads Effective number of electrons: N eff = 23.3±3.0 consistent with expectations
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Further tests for Micromegas David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200925 In 2008 with one detector module In 2009 with 7 detector modules. Compact the electronics with possibility to bypass shaping Resitive technology choice 4 chips Wire bonded Front End-Mezzanine
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Conclusions David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200926 Excellent start for the Micromegas TPC tests within the EUDET facility. Smooth data taking. First analysis results confirm excellent resolution at small distance: 50 μ m for 3mm pads Expect even better results with new (bypassed shaper) AFTER chips Plans are to test several resistive layer fabrication, then go to 7 modules with integrated electronics
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Backup slides David.Attie@cea.fr TILC09 – Tsukuba – April 18 th, 200927
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