1. XFEL Large Pixel Detector DAQ

2. Project Team Technical Team: STFC Rutherford DAQ Glasgow University Surrey University Science Team: UCL Daresbury Bath University others …

3. Project Outline 1) Phase 1: Develop a digitising pipelined XFEL detector (1k by 1k pixels) 3Y Project given approval Dec 2007 2) Phase 2: Construct complete XFEL instruments as required before 2013 - mass produce electronics - match XFEL DAQ

4. Phase 1 Detector 1M Pixel 4 x 4 Super Modules

5. Module Concept

6. XFEL ASIC New design matched to the XFEL: - Time Structure - Dynamic Range - Channel Count - System Interfaces etc.

7. XFEL ASIC Preamplifiers Dynamic range stages Pixel Resetting Power supply Conditioning Deep pipeline memory (786,432 samples) IO to DAQ Overload Control Sequencing and control ADC Stages Power supplies Store in Pipeline during bunch train Readout during long gap

8. XFEL Structure 600  s 99.4 ms 100 ms 200 ns FEL process X-ray photons 100 fs Electron bunch trains; up to 3000 bunches in 600  sec, repeated 10 times per second. Producing 100 fsec X-ray pulses (up to 30 000 bunches per second). XFEL ~ 30 000 bunches/s but 99.4 ms (%) emptiness Data Sampling to Memory Serialise and Transmit to DAQ

9. Multi-gain concept Required dynamic range compression –Experience with calorimetry at CERN –Relaxes ADC requirements –Fits with CMOS complexity

10. On detector electronics

11. Detector Summary Phase 1 –Common super module design –Economic mass production –Eases test and maintenance –Scalable DAQ Phase 2 –Mechanical design –Large scale replication –Industrial technology

12. Tracker View showing Higgs decay to 4 muons LHC Example

13. The CMS Tracker ~210 m2 of silicon, 10M channels 75000 FE chips, 40000 optical links 15000 modules mass produced using automatic assembly techniques Hybrids and assembly at CERN, FE ASIC Design at RAL Radiation environment ~10Mrad ionising ~10 14 hadrons.cm -2 Inner barrel layer Rod insertion Petal assembly CERN assembly APV25

14. >500 cards>20,000 BGAs Collaboration with Imperial College and CERN Massively Parallel Processing ~ 30 VME crates 10 TERA-bits / sec 15 Exa-Bytes of raw input per year! The CMS Tracker DAQ

15. Project Management One overall project manager –Report to XFEL and provide information as required Each workpackage –run as subproject in our QA system Approved ISO9000 system –Formal design review processes –Drawing and record control

16. The First 3 Years: Included –Sensor proving tests at LCLS –XFEL ASIC development –Build and test of 1Mpixel system Excluded –Off detector DAQ –Sensor R&D

17. Work Packages WP1: Sensors WP2: Front End Electronics WP3: Mechanical Design WP4: On Detector Electronics WP5: Data Acquisition WP6: Software, controls and integration

18. WP5: Data Acquisition Leader – John Coughlan

19. DAQ Approach Up to now effort has been concentrated on WPs for Mechanics / Sensors / ASICs rather than Readout. We intend to exploit Commercial Off The Shelf (COTS) based equipment where practical (e.g. FPGA Development boards, vendor/commercial FPGA cores) Xilinx (Virtex 5) System on Chip Rocket IO serial data links, Embedded Ethernet cores Embedded PowerPCs, Fast memory interfaces Embedded Development Kit Industry standards for interface protocols vs custom (GEthernet, PCIe, sFPDP …) Develop a Scaleable system. Final detectors.

20. DAQ XFEL Integration Stay Flexible to adapt to FE ASIC and common XFEL DAQ Architecture specifications. DAQ/Timing/Trigger Interface Standards & Protocols need to be agreed with XFEL DAQ group. STFC/Rutherford has a long history of successful partnerships with DESY on Particle Physics projects (e.g. H1 DAQ)

21. DAQ Experience STFC has a large established base of DAQ hardware and firmware expertise (wide variety of projects… Particle Physics, Xray, Neutron). STFC has a proven track record on the delivery and long term support of large scale readout systems (e.g. H1 DAQ, CMS Silicon Tracker)

22. DAQ On Detector 3 Year Plan includes only elements local to detector. Module Support Cards (MSC) : FPGA Gain Selection COTS : FPGA Dev Boards Xilinx Virtex 5 + EDK PPC COTS : FPGA-> PC cores (Qx UDP) FPGA Electrical LVDS Links Switch Inputs / Farm FEMs : Firmware Data Formatting Sample selection Traffic Shaping

23. Data Rate Challenge 1 M Pixels x 512 x ~ 2 bytes x 10 Hz ~ 10 GBytes/sec Protocol overheads Fixed length fragments? Data Selection, Sparsification? => 1 TeraByte recorded every 2 minutes !

24. Modularity 1 MPix Nr Super Modules16 Nr Hybrids256 Nr Module Support Cards32 Nr Front End Modules?16 x 8 links Nr Links? (GbE) 80 MB/s128 x N MPixelx N Each FEM Fragment = 128 KB (64 MB / train) 128 KB x 512 x 10 = 640 MB/s @ 80 MB/s link = 8 links / FEM

25. DAQ EoI Off Detector E.g. ATCA crate for Surface & Nuclear Science AGATA Daresbury & Padova ATCA card with FPGA->PC PCIe readout Event Builder Advanced TeleComms Architecture COTS Carriers + AMC Mezzanines Or MicroTCA 6 TB SFPDP Disk Storage and Servers

26. WP6: Software, controls and integration Leader – Tim Nicholls

27. Software, Controls & Integration Delivery and Operation of Detector in beam-line environments. System Operation Timing and Controls. Software Development and Integration with Beam-line scientists. Real Time Data Monitoring and Analysis. Team of Integration engineers, leader with experience on DESY H1 experiment.

28. Summary 1) Phase 1: Develop a digitising pipelined XFEL detector (1k by 1k pixels) 3Y starting Jan 2008 2) Phase 2: Construct complete XFEL instruments as required before 2013 - mass produce electronics - match XFEL DAQ Architecture