1. IMD series
Iljin Metal bond Diamond
ILJIN DIAMOND Co., Ltd.

2. IMD series IMD-G IMD-F IMD-D IMD-B IMD-A
Sawing of granite & ceramic tiles
Rough polishing of granite
Reinforced glass edge
Ferrite motor core
CMP pad conditioner
Core drill of glass
Crystal & glass decorating groove
Silicon nitride OD grinding
Middle stage grinding of Crystal & granite
Glass (Normal, TFT-LCD, Motor) edge
Cut-off wheel for crystal or glass
Final polishing of granite
Fired tungsten carbide
Dental burrs
Beveling of glass and mirror
Cut-off wheel for glass & quartz
Ferrite grinding

3. Toughness Index Toughness Index Mesh Size G F D B A TP IGD II 10 20 3040 50 60 70 80
80/100
100/120
120/140
140/170
170/200
200/230
230/270
270/325
325/400
400/500

4. Grades equivalent IMD-G IMD-F IMD-D IMD-B IMD-A MBG-660 MBS-640
PDA-999
PDA-989
PDA-878
PDA-P768

5. Shape comparison
As-grown Product
Crushed Products
IMD-TP
IGD-II
IGD-V

6. Ti coating MESH Weight Percent Spec. 80/100 2wt% ±0.5 100/120
120/140
4wt% ±0.5
140/170
5wt% ±0.5
170/200
6wt% ±0.5
200/230
7wt% ±0.5
230/270
8wt% ±0.5
270/325
9wt% ±0.5
325/400
10wt% ±0.5
400/500
11wt% ±0.5

7. Ferrite Motor Core GrindingB A
Test Condition
Area :
Japan
Wheel Type :
N/A
Bond :
Electroplated
Workpiece Material :
Ferrite motor core
Mesh Size :
100/120
Concentration :
Peripheral Speed :
DOC :
Feed rate :
D Company

8. Glass Grinding Test Condition Area : Japan Wheel Type : N/A
Bond Material :
Bronze (Cu-Sn)
Work piece Material :
Glass
Mesh Size :
170/200
Concentration :
Peripheral Speed :
DOC :
Feed rate :

9. Safety Glass Grinding Area Korea Industry Automotive Part Name
Operation
Glass Edge Grinding (Bando)
Workpiece Material
Glass
Wheel Specific
Metal Bond
Φ200 x 4w x 75H x 11t
Diamond & cBN
IMD-F Ti (Ti Coating)
Process Parameters
Wheel Vs : 1600m/min
Feed rate : 10~20m/min
Results
Remark

10. Ti coated wheel grit
ILJIN DIAMOND Co., Ltd.
Grit Business Unit

11. 1. 코팅 광학 형상 기존 IMD-Fti 170/200 신규 IMD-Fti 170/200
광학사진에서 기존 방식은 상당히 어두운 색을 띄고 표면이 거칠어 보임.
신규 샘플은 기존 방식의 제품과 비교하여 광택을 띄고 표면이 매끄러움.

12. 2. 코팅 SEM 형상 기존 IMD-Fti 170/200 신규 IMD-Fti 170/200
기존 제품은 edge가 벗겨지거나 코팅층이 불균일하게 형성되었음.
신규 제품은 코팅층이 일관성있게 형성되어 있음.

13. 2. 코팅 SEM 형상 기존 IMD-Fti 170/200 신규 sputtering IMD-Fti 170/200
고배율 관찰에서도 기존 제품에 비해 치밀한 코팅층을 유지하고 있고, edge부분도 손상이 없음.

14. 3. TRS test result Transverse Rupture Strength Test
Kg/mm2
Transverse Rupture Strength Test
Dia grade/size: IMD-FTi 170/200 mesh
Concentration: 100
Segment size: 6.4*6.4*40mm
TRS M/C: ZWICK Z050
Test condition: ISO B Type
New coating
As-is #1
1.72
1.32 #2
1.96
1.47 #3
1.75
1.43 #4
1.61
1.50 #5
1.66
1.60
Avg
1.74
1.46
TRS Test-Kgf/mm 2
Sintering Condition
Bond system: 50%Cu-20%Sn-30%Fe
Sintering Temp: 700℃/2min
3.0
1.74
1.46
New coating
As-is

15. 4. 소결 후 본드와의 결합 상태 기존 IMD-Fti 170/200 신규 IMD-Fti 170/200
SEM 관찰 시 신규 제품이 본드층과의 접합성이 기존 제품에 비해 우수한 것으로 관찰됨.

16. 5. 소결 후 TIP 파단면 상태 New Coating As-is
SEM 관찰 결과 다이아몬드 표면은 모두 Ti 코팅층으로 형성되어 있음.
기존 제품과 신규 제품과의 소결 후 탈락된 부분을 비교 관찰한 결과 신규 제품에 비해 기존 제품이 약 20% 가 탈락율이 높은 것으로 분석됨.

17. Diamond for CMP Pad conditioner
ILJIN DIAMOND Co., Ltd.

18. Metal vs. Oxide CMP : Million $
Trend of CMP Process
Metal vs. Oxide CMP : Million $
CMP growth by material
Metal CMP의 성장속도가 높으며, 이 중 Cu CMP의 성장율이 높음.
Cu CMP에서 scratching issue 및 고집적화에 의한 diamond의 fine, narrow 경향 심화
Metal CMP에서 Diamond의 Shape, Narrow PSD, Diamond purity의 중요성이 강조

19. CMP Process Logic Memory
Memory Semiconductor와 Logic 간에 가공하는 피삭재의 차이에 따라 적용되는 Diamond는 틀리게 적용

20. Tech. Trend of CMP Conditioner
Typical Type of CMP Conditioner
Pattern, Narrow Size, Special Shape
CMP Conditioner에서 요구되는 Cutting Rate가 높아지고, 고 집적화 되면서 Diamond는 fine, narrow한 PSD가 요구됨.
Conditioning 효과를 높이기 위하여 pattern 및 diamond의 돌출높이는 높이기 위한 개발, 적용 진행 중

21. Tech. trend of diamond for CMP
As was
As is
Increased number
of particles
(High Density)
Coarse size
80/90
90/100
Medium / fine size
100/120
140/170
170/200
200/230
Blocky shape
IMD – F,D
PDA 999
MBG 660
Angular shape
IMD – B,A,TP
PDA 878
MBG 620
Higher Cutting Rate
(CR)

22. Special process for CMP only
PSD
Narrow PSD (Double size → Single mesh → Micron size)
Over size particle removing process (3 stage sieving at clean room)
Shape
Precision heating control (HPHT)
Perfect shape sorting and consistency
Impurity
Minimized metal inclusions using high magnetic field
Suitable for electroplating and vacuum brazing process
Special Treatment – I
Removing the twin, sharp needles and weak crystal
No damage of normal crystal’s sharp edge
Special Treatment – II
To prevent the Ni over plating and nodules on diamond crystal
Perfectly clean and non electric conductivity on the surface of diamond
De-magnetizing

23. Shape – HPHT technology
Temp
(0C)
1300
1400
1500
5.5
6.0
6.5
(111)+(100)
(110)
(111)
(100)
Pressure (GPa) A B C D E F G H I

24. Shape – HPHT technology
IMD-F
IMD-T

25. Shape – Sorting technology
IMD-G
IMD-F
IMD-D
IMD-B
IMD-A
IMD-TP

26. Special treatment I
IMD-NB1
IMD-NA1
IMD-NB2
IMD-NA2

27. Special treatment II

28. Special treatment II
Metal impurities on the surface of diamond grit for CMP
(unit : ppb)
Element
ILJIN DI E6
2hrs
4hrs
8hrs Li -
0.00
0.01 Na
1.54
1.28
1.22
1.79
3.37
3.76
13.34
12.39
14.53 Mg
0.80
0.89
1.00
0.13
0.21
0.20
6.66
6.02
6.61 Al
0.42
0.39
0.47
0.34
0.64
0.61
0.33
0.43
0.50 K
0.04
0.15
2.17
2.25
2.36 Ca
1.83
1.94
1.47
2.01
2.12
55.72
54.72
58.23 Cr
0.12
0.36
0.35
4.71
4.58
0.52
9.80
10.52 Mn
0.27
0.25
0.10
0.41
0.44
0.07
1.14
1.42 Fe
7.25
23.02
30.47
5.19
31.41
44.57
14.38
97.34
135.27 Co
0.03 Ni
1.08
4.30
6.82
1.39
5.79
9.25
4.78
20.64
31.59 Cu
0.92
0.93
0.83
1.96
2.23
2.39
0.28
0.38 Zn
1.10
1.29
0.67
0.90
1.15
1.36
1.92 As
0.02 Sr
0.17
0.18 Cd
0.05 Ba
1.05
1.17
1.20 Pb
0.81
0.77
0.69
0.06
0.14
0.48

29. Special treatment II Metal impurities on the surface of diamond grit
ILJIN DI E6
150
135.27
100
58.23
(ppb) 50
44.57
31.59
30.47
14.53 10
10.52
9.25
6.82
4.58
3.76
2.39
2.12
1.94 2
1.22
0.83
0.35
0.44 Na Ca Cr Cu Fe Ni

30. End of documents
Thank you !