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1 4. EMC measurement methods. 2 Why EMC standard measurement methods Check EMC compliance of ICs, equipments and systems Comparison of EMC performances.

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Presentation on theme: "1 4. EMC measurement methods. 2 Why EMC standard measurement methods Check EMC compliance of ICs, equipments and systems Comparison of EMC performances."— Presentation transcript:

1 1 4. EMC measurement methods

2 2 Why EMC standard measurement methods Check EMC compliance of ICs, equipments and systems Comparison of EMC performances between different products, different technologies, designs, PCB routings Improve interaction between customers and providers (same protocols, same set-up) EMC measurement methods

3 3 Device under test Coupling device Coupling network Antennas Wave guide Acquisition system Spectrum analyzer EMI receiver Oscilloscope Emission – General measurement set-up Radiated or conducted coupling 50Ω adapted path Control - Acquisition Emission requirements verified ? Emission measurement methods

4 4 IEC 61967-2 (TEM : 1GHz) IEC 61967-3/6 (Near field scan, 5GHz) IEC 61967-4 (1/150 ohm, 1 GHz) IEC 61967-5 (WBFC, 1 GHz) IEC 61967-7 (Mode Stirred Chamber: 18 GHz) IEC 61967-2 (GTEM 18 GHz) International standards for IC emission measurement methods Emission measurement methods

5 5 GTEM cell : radiated emission up to 18 GHz Emission spectrum Emission measurement methods

6 6 Spectrum Analyser 1ohm IC Complex implementation with multiple power pins IEC 61967-4 International Standard : 1/150 Ohm method Emission measurement methods

7 7 Microcontroller - 32 MHz scan Low High X axis Y axis dBµV freq 32MHz IEC 61967-3 International Standard : Near field scan Emission measurement methods

8 8 Hx Probe Priviledged current measurement Power rails CPU 12 RAM 2K 32K FEEPROM 28K FEEPROM Power rails MS- CAN A T D 1 A T D 0 P W M E C T MI BUS MSI EE 1K MMI IN T BDM K W U LIM D60 CGM W C R MEBIBKP Emission measurement methods IEC 61967-3 International Standard : Silicon scan

9 9 Immunity measurement methods Immunity – General measurement set-up Device under test Coupling device Coupling network Antennas Wave guide Radiated or conducted coupling Disturbance generation Harmonic signal Transients Burst 50Ω adapted path Failure detection Injected level Extraction Immunity requirements verified ?

10 10 IEC 62132-2 (Bulk Current Injection : 1 GHz) IEC 62132-3 (Direct Power Inj 1GHz) IEC 62132-4 (TEM/GTEM) IEC 62132-5 (WBFC 1 GHz) New proposal: (LIHA : 10 GHz) Still research: (NFS 10 GHz) International standards for IC susceptibility measurement methods Immunity measurement methods

11 11 Immunity measurement methods 10W Amplifier Oscilloscope PC Monitoring Signal generator IEEE Bus or Good signal Failure signal Printed Circuit Board Device under test Dout Coupling Capacitance DUT Power increase loop until failure Frequency loop 1 MHz – 3 GHz IEC 62132-3 International Standard : Direct Power Injection

12 12 Immunity measurement methods Inductive coupling to the network Parasitic current injected on the chip Limited to 1 GHz Normal current Parasitic current RF power CAN Bus Microcontroler DUT Fault Measured current IEC 62132-2 International Standard : Bulk Current Injection

13 13 EMC equipments Vector Network Analyzer 10 GHz (100 K€) Signal Synthesizer 6 GHz (20 K€) GTEM cell 18 GHz (15 K€) Spectrum analyzer 40 GHz (40 K€) Amplifier 3 GHz 100W (60 K€) Expensive …. Complete EMC laboratory : 500 K€

14 14 5. EMC models

15 15 Models – What for ? IC designers want to predict EMC prior fabrication Noise margin Voltage bounce on Vdd IC designers want to predict power integrity and EMI during design cycle to avoid redesign EMC models and prediction tools have to be integrated to their design flows

16 16 Models – What for ? © Siemens Automotive Toulouse Most of the time, EMC measurements are performed once the equipment is built. No improvements can be done at conception phase. Predict EMC performances  IC, board, equipment optimizations Equipment designers want to predict EMC before fabrication

17 17 EMC of IC models Complexity Level Equipment Board Component Physical spice V, Z 10 6 R,L,C,I LEECS ICEM Dipoles 10 2 R,L,C,I 10 1 R,L,C,I 10 1 dipoles 10 0 V(f), 10 0 Z(f) x-highhighlowmedium Expo PowerSI 10 4 R,L,C,I EMC Models depends on the targeted complexity and the confidentiality. Confidentiality


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