1. 1 Assessment of the potential value return from research topics Follow-up actions ITRS Maastricht 04/07/06

2. 2 Follow-up process Start working now on the subject of equivalent scaling parameters –Topic to be included in the TWG meetings Conference call early June –Joint conf call with IRC / some TWG chairs Summer meeting –Half-day workshop IRC / selected TWG chairs Contact with other consortia –MEMS Industry group (A.Allan) –iNEMI (A.Allan, JA.Carballo) –IEEE (P.Gargini)

3. 3 To be discussed in the TWG meetings Former approach –Economic value through dimensional scaling Questions to you –What will pure continuous scaling bring ? –Which non-scaling parameters can you play on that will bring equivalent scaling value ? Meeting system performance in another way or bringing additional functionalities –How to characterize / evaluate them vs. scaling approach ? –Are there trade-offs involved between parameters (e.g., frequency vs. # of processors) ?

4. 4 Possible TWG involvement preparation/proposals for July ITRS Assy & Packaging –System integration white paper –Passive integration Design –Extension of roadmap / system drivers (example Automotive HV power, Sensors) –System on Chip / network on Chip PIDS / Design –extending MASTAR to system level Interconnect –Optical –Passive integration RF Wireless –Passive integration …

5. 5 Format proposal TWGFunctionalityTechnical Parameter 1 …Value Indicator = f(TP1, …TPn) AMS / RFMulti-standard adaptability # of standardsBroader application scope AMS / RFPassive integration Inductor QLower system cost Design PIDS Image sensorsQuantum efficiency Image quality Dont feel restricted by that format ! Thinking out of the box is welcome !