1. Metrology Roadmap ERD and ERM Update - Stresa EuropeUlrich Mantz (Infineon) Dick Verkleij (Philips) Mauro Vasconi (ST) JapanYuichiro Yamazaki (Toshiba) Kazuo Nishihagi (Technos) KoreaTaiwan USDan Herr (SRC) Steve Knight (NIST) Alain Diebold (Int. SEMATECH)

2. New Business Established link with Emerging Research Materials group of ERD –ERM to report requirements –Metrology Reports Methods and Discussion –Provided update on aberration corrected TEM and 3D TEM developments Awaiting changes in Process Tolerance for Gate CD

3. New Cross-TWG Business Litho TWG –Discussed AEC/APC needs for track –CD shape monitoring vs CD for tool monitoring –LWR LER - off line or in-line? FEP – Need to participate in Film subgroup for mobility and stress measurement discussions –Doping in FINs; FIN CD height and width; FIN shape; defects and film thickness on sidewalls –Metal Gate work function measurement needed Factory Integration –AEC/APC needs discussion –Data accessibility and integrity issues Interconnect – later today