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Published byAvery Cannon Modified over 11 years ago
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FEP ITWG Meeting Notes (not for publication – work in progress) ITRS Spring Conference 2008 Petersberg, Germany 1 ITRS 2008 ITWG Spring Meeting April 2-4 Petersburg, Germany FEP TWG Report
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FEP ITWG Meeting Notes (not for publication – work in progress) ITRS Spring Conference 2008 Petersberg, Germany 2 FEP ITWG Spring 2008 Participants NAMEREGIONEMAIL ADDRESS Larry LarsonUSlarry.larson@sematech.org Masaaki NiwaJPniwa.masaaki@jp.panasonic.com Mauro AlessandriEUmauro.alessandri@numonyx.com Chris StaplemannEUchris.stapelmann@infineon.com Reported New TWG member FeRAM Masayoshi Horii
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FEP ITWG Meeting Notes (not for publication – work in progress) ITRS Spring Conference 2008 Petersberg, Germany 3 ITRS 2008 ITWG Spring Meeting FEP ITWG FEP Plans for 2008 Change Effective Gate Length I think Alan said Yes, change the gate length in 2008, push back if it is too difficult FEP will change all tables where the Gate Length dependence is first order
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FEP ITWG Meeting Notes (not for publication – work in progress) ITRS Spring Conference 2008 Petersberg, Germany 4 Spring 2008 FEP Round Table and Cross-TWG Discussion Notes Gate Length Based Modifications –Printed/Etched Ratio – need to agree with Litho –On-chip Frequency – Transistor and Design model – need alignment from PIDS, FEP and Design –New Drivers: Ion/W and CV/I – needs PIDs and FEP 2008 update and provide to ORTC - - FEP will be able to accommodate whichever driver PIDS and Design accept Flash/PCM plans for 2008 –update table entries based on PIDS survey results, refine projection for end of floating gate flash –add table to focus on charge trapping devices – Is this possible in the update? –update PCM tables UTBSOI –What is reason for color code – 2011: 14-17 yellow, 2012 14-16 red – transmit to Starting Materials
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FEP ITWG Meeting Notes (not for publication – work in progress) ITRS Spring Conference 2008 Petersberg, Germany 5 Spring 2008 Round Table Notes Edge Exclusion –Agreed with Factory Integration to change to 2mm throughout table, due to Clamp/Edge rolloff – transmit to Starting Materials 450MM wafer –Considering ROI – 2012 seems unrealistic – Push back – Transmit to Starting materials –Is there a market growth analysis that justifies this aggressive timing? Contact Maximum Resistivity –Data from MRS, IEDM shows that 1E-8 can be done – reconsider coloration. Transmit to Thermal Thin Films –Discussion with Interconnect – need to understand components and make sure lines are coordinated
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