1. ITRS Factory Integation TWG
2017/3/27
ITRS Factory Integration Technology Working Group (FITWG) Industry Presentation
18 July 2001
Michio Honma, NEC
Jeff Pettinato, Intel
FITWG 2000

2. ITRS Factory Integation TWG
2017/3/27
Agenda
Scope and Factory Drivers
Difficult Challenges
Key Technology Requirements
Integrated Potential Solutions:
Process Control
Agile Manufacturing
Material Handling
Summary
FITWG 2000

3. Factory Integration Group Regional Representatives
ITRS Factory Integation TWG
2017/3/27
Factory Integration Group Regional Representatives
Europe
Klaus Eberhardt
Richard Oechsner
Claus Schneider
Taiwan
Hugo Chang
JJ Hsu
Japan
Michio Honma
Shoichi Kodama
Toshi Uchino
Hiromi Yajima US
Court Skinner
Jeff Pettinato
FITWG 2000

4. Factory Integration Contributing Members
Many International members have contributed to FI

5. ITRS Factory Integation TWG
2017/3/27
2001 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing
The Factory
Wafer
Mfg.
Chip
Mfg.
Product
Mfg.
Si Substrate
Mfg.
Distribution
FEOL
BEOL
Probe/Test
Singulation
Packaging
Test
The Factory is driven by Cost and Productivity:
Reduce factory capital and operating costs per function
Enable efficient high-volume production with operational models for varying product mixes (high to low) and other business strategies
Increase factory and equipment reuse, reliability, and overall efficiency
Quickly enable process technology shrinks and wafer size changes
FITWG 2000

6. ITRS Factory Integation TWG
2017/3/27
2001 Difficult Challenges
> 65nm through 2007
< 65nm after 2007
Managing Complexity
Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions
Factory Optimization
Productivity increases are not keeping pace with needs
Flexibility, Extendibility, Scalability
Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills
Post CMOS Manufacturing Uncertainty
Inability to predict factory requirements associated with post CMOS novel devices
450mm Wafer Size Conversion
Timing and manufacturing paradigm for this wafer size conversion
Will 450mm be a scale up of 300mm or a more radical change in manufacturing technology (single wafer carriers, etc.)
FITWG 2000

7. ITRS Factory Integation TWG
2017/3/27
All factory areas must be integrated to solve these Difficult Challenges
Factory Areas or Thrusts
Technology Requirements and Potential Solutions are expressed through these factory areas
Includes Wafer, Chip, and Product Manufacturing
Factory
Operations
Facilities
Material
Handling
Factory Information and Control Systems
Production
Equipment
Examples: Building, cleanroom, utility systems, process fluid delivery
Example: Manufacturing rules, production size, mix
Examples: AMHS Transport, storage, ID Systems, interface standards
Example: Equipment unit, real-time process control, interface standards, Embedded Control
Example: MES, Computers, Networks, Process Control
Complexity
Management
Rapid changes to business needs & demands; Increasing process & product complexity; Larger wafers and carriers, Increased reliance on factory information & control systems
Increased customer expectation to meet on time delivery; Increased urgency for improved factory effectiveness, High factory yield at startup; Reduce wafer and product cost; Satisfy all local regulations
Difficult Challenges
>65nm thu 2007
Factory
Optimization
Extendibility,
Flexibility,
Scalability
Reuse of building, production equipment, and factory information and control systems; Factory designs that support rapid process and technology changes/retrofits; Comprehend tighter ESH/Code requirements
FITWG 2000

8. Key Technology Requirements and Issues
1. Production equipment is not keeping up with Overall Equipment Efficiency (OEE) and Availability targets
Ex OEE target of 83% vs. actual of 65% for bottleneck equipment
2. Process technology advances are occurring at ever faster rates; factories are expected to ramp and meet yield targets more quickly
New equipment for 157nm litho, High K gate stack, Low k dielectrics, SOI, copper will be implemented in factories over the next 2-5 years
3. A 45% reduction in manufacturing cycle times by 2007 is expected for high volume high mix factories
4. Direct transport systems capability must be ready for beta tests during 2002 and HVM implementation by 2004
5. Time required to a) build/ramp new factories, or b) convert/ramp existing factories to new technologies must improve 30% by 2007
6. 300mm software standards compliance is not meeting single wafer processing and intrabay AMHS needs

9. Integrated Solutions are Essential to Meet Needs
ITRS Factory Integation TWG
2017/3/27
Integrated Solutions are Essential to Meet Needs
Technology Requirements
New disruptive process technologies
157nm litho
High K gate stack
Low k dielectrics
Copper processing +
Improved Productivity
Decreased Factory Cycle Time (QTAT)
Improved Equipment Efficiency
Reduction in non-product (I.e. test) wafer usage
More efficient direct labor
Faster factory conversion at technology nodes
Integrated Solutions
Agile Manufacturing
- Equipment Engineering Systems - EES
- Single wafer control
- e-Diagnostics
Process Control
- Fault Detection Capabilities
- Feedback & Feed forward Process Control
- Machine to machine matching
Material Handling
- Direct Transport AMHS
- AMHS for Send-Ahead wafers
- Integrated Sorters, Stockers, Metrology
Integrated Factory
Goal = Meet Factory Challenges and Technology Requirements
FITWG 2000

10. Process Control Potential Solutions Type 1: Fault Detection and Classification
Inside the Tool
FDC Models defined / configured
FDC host signals configured
FDC actions may be configured
Outside of Tool
Host determines actions based on type of fault
Host issues control command
Process
Equipment
Step N UI
Fast FDC
Module
GEM
Interface
Host System
FDC Signal / Data
External FDC
Module
FDC Control
Potential Solutions Needs Include:
Real-time process sensors on process equipment
Reporting of real-time data to host system
Ability to stop processing at various intervals via host command
Factory Software systems capabilities to manage areas and groups of equipment
Software I/F Standards
Technology Requirement Drivers:
Overall Equipment Efficiency
Equipment Availability
Yield Particle Densities

11. Process Control Potential Solutions Type 2: Run to Run Control
Run to Run Control S/W & Models
MES
(Equipment Control)
Feed Forward and Feedback Control - Use preprocess or post metrology data to adjust processing for that lot
Recipe Recommendations
Factory Network
EE Network
Detailed wafer and chamber data required
GEM
Recipe Adjustment Control
GEM EE EE EE
GEM
Metrology
Equipment UI UI
Metrology
Equipment
Step N
Step N+1
Step N-1
Parameterized recipes required
Metrology data
pipeline UI
Process
Equipment
Technology Requirement Drivers:
Overall Equipment Efficiency
Optimize Process Performance (for example):
Litho Gate CD control (nm)
Litho Overlay Control (nm)
Diffusion Oxide thickness
Potential Solutions Needs Include:
Reporting of metro data to host system
Ability to adjust key recipe parameters at various intervals via host command
Relationship between end process results and adjustable process parameters
Open software interfaces and standards

12. Process Control Potential Solutions Type 3: Integrated Metrology
Factory Network
EE Network
Metrology data and detailed wafer and chamber data
GEM EE
Recipe and Model Selection via remote interface
Host System
Equip
Controller
EES
Parameterized recipes required UI
Integrated
Process and
Metro Equip.
Integrated Metrology
Module (not Bolt on)
Potential Solutions Needs Include:
Hardware integration of process and metrology equipment
Software integration of metrology and process equipment
Single SECS/GEM interface for integrated metrology and process equipment
No increase in process equipment footprint
No degradation in equipment run rate or availability
Technology Requirement Drivers:
Factory Cycle Time per Mask Layer
Interbay AMHS throughput
Intrabay AMHS throughput

13. Agile Manufacturing Means…
Quick turn around [*faster cycle] time for production
Quick turn around time without productivity deterioration
No productivity reduction even if many lots production formed with few wafers
Quick capability to product, scale and technology change
Quick ramp-up of equipment installation and product
Assure high productivity even if low production volume
to Satisfy these Requirements…
Speed
Product: short ramp-up time
Equipment: short ramp-up time
Product Quick Turn Around Time (QTAT)
Cost
Equipment high OEE
Product yield high at ramp-up

14. Key Potential Solutions
Full Automation
Equipment Engineering System
Fundamental technology
Single Wafer Control
Multiple lots/single wafer control in equipment module (group)
Process Control
Fault Detection and Classification
Run to Run
Integrated Metrology
Direct Transportation
Real Time Scheduling (RTS)
Supply Chain Management (SCM)

15. What will Equipment Engineering Systems (EES) replace?
New!
Manufacturing Execution System
Equipment Engineering System
MES
MCS
MES
FAX and telephone be replaced by Internet
No more operator this side
Suppliers
e-Diag Capability
Operators still watch the tool to confirm its health status and do miscellaneous things
AMHS

16. e-Manufacturing Hierarchy
ITRS Factory Integation TWG
2017/3/27
e-Manufacturing Hierarchy
Company to Company
(E-Commerce)
Suppliers
Company A
Company B
Factory to Factory
(E-Factory)
e-diagnostics
capability
Factory A
Factory B
firewall
Within a Factory
(E-Factory)
Manufacturing
Execution System - MES
EES
Equipment/AMHS
Equipment Engineering
System
AMHS
Eqpt
(side view)
Ethernet
Process or
Metrology
Equipment
(side view)
Control
System
Material Control
System - MCS
Station
Controller
FITWG 2000

17. The e-Business structure for manufacturing

18. Carrier Level integrated Flow and Control Type 1: Sorter and Metrology with Stockers
End View
Sorter
Metro
Tools
OHT Loop
Stocker
Stocker robot loads
Sorters and Metro
equipment Loadports
Process Tools
Stockers
OHT Loop
Sorter
Metro
Tools
Stocker robot interfaces directly with
Sorters and Metro equip
When Solutions Are Needed:
Research Required by 2001
Development Underway by 2002
Qualification/Production by 2003
Potential Solutions Require:
Standardized Intrabay Operation
Integrated Software

19. Wafer Level Integrated Flow and Control Type 2: Connected EFEM
Equipment
Supplier A
Equipment
Supplier C
Equipment
Supplier B
Wafer
Staging
Carrier
Staging
Potential Solutions Require:
I/F Standard (H/W, S/W)
Standardized EFEM
Software
Integrated
Wafer level APC
Standardized Intrabay Operation
When Solutions Are Needed:
Research Required by 2002
Development Underway by 2004
Qualification/Production by 2005
Conceptual Only

20. Wafer Level Integrated Flow and Control Type 3: Expanded EFEM
Standard
Tool Widths
Potential Solutions Require:
System controller of Equipment Group
Wafer Dispatcher
Module structure of equipment
Standardized I/F
Standardized Width
Modular Process Steps
High Speed Wafer Transfer
Standardized Intrabay Operation
When Solutions Are Needed:
Research Required by 2003
Development Underway by 2005
Qualification/Production by 2006
Conceptual Only

21. Wafer Level Integrated Flow and Control Type 4: Continuous EFEM (Revolving Sushi Bar)
Single
Wafer
Conceptual Only
Wafer
Transport
Potential Solutions Require:
Ultra High Speed Wafer Transfer
Target M/C to M/C 7sec.
Wafer Level Dispatching
Carrier
Level
Transport
Single Chamber
Process Tool
Stocker
Metrology
Tool
Multi-Wafer
Carrier
When Solutions Are Needed:
Research Required by 2007
Development Underway by 2010
Qualification/Production by 2013
Target 450mm

22. The Next Generation Factory Concept
User’s SCM -
Supply Chain
Management
Planning
System
…..
…..
Direct
Transport
Mfg.
System
…..
…..
Agile
-Mfg.
EES
Wafer
Level Control
…..
….. E-
Diagnostic
Supporting
System
…..
Supplier’s
SCM
E-Mfg.

23. Summary
1. Advances in process technology are occurring at ever faster rates
2. Equipment suppliers must deliver stable equipment running new process technologies with very high Overall Equipment Efficiency (OEE)
3. Agile manufacturing systems are needed to quickly ramp new process technologies into high volume production and to achieve cycle time goals
4. Process control and machine to machine matching are needed to get high yields at startup and reduce cycle time
5. Open standards are a Key Part of Potential Solutions
6. We invite and encourage you to participate in FITWG activities to convert these plans to reality