1. 2008 ITRS Public Conference San Francisco, USA 1 DRAFT – DO NOT PUBLISH ITRS Factory Integration Shige Kobayashi, Tom Jefferson July 2008 San Francisco, USA Global Co-Chairs: Europe: Arieh Greenberg Japan: Shige Kobayashi, Michio Honma Korea: S. H. Park Taiwan: Thomas Chen US: Tom Jefferson 2008 Contributors: Terry Francis, Gopal Rao, Al Chasey, Les Marshall, Todd Lasater, Brad van Eck, Kenjiro Nawa, Daniel Babbs, Dave Eggleston, Mutaz Haddadin, Gavin Rider, Andreas Neuber, Eric Englhardt, Peter Csatary, Adrian Pyke, Mikio Otani, Bill Fosnight, Richard Oeschner Junji Iwasaki, Mazafumi Fukushima, Tomoyuki Masui

2. 2008 ITRS Public Conference San Francisco, USA 2 DRAFT – DO NOT PUBLISH Factory Integration Scope and Drivers Wafer Mfg Chip Mfg Product Mfg Distribution FEOL BEOL Probe/Test Singulation Packaging Test Si Substrate Mfg Reticle Mfg Increasing cost & Cycle time implications Factory is driven by Cost, Quality, Productivity, Speed, and Flexibility Reduce factory capital and operating costs per function Faster delivery of new and volume products to the end customer Efficient/Effective volume/mix production, high reliability, & high equipment reuse Enable rapid process technology shrinks and wafer size changes Factory Operations Production Equipment AMHS Factory Information & Control Systems Facilities UI

3. 2008 ITRS Public Conference San Francisco, USA 3 DRAFT – DO NOT PUBLISH Key Technologies that will Impact Factory Design 2008 and future years are targeted to meet productivity and capture technology requirements Key process & device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), new materials, 450mm conversion, significant productivity improvements, and waste (inefficiencies) reduction Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth to attain efficiency and effectiveness Year2008200920102011 Technology trend (nm)65555045 Wafer Size (mm)300 Near Term Years Long Term Years Year2012201320142015201620172018201920202021 Technology trend (nm)40353228252220181614 Wafer Size (mm)450 450mm ? NGF ? Planning for NGF/450mm EUVL in Production?

4. 2008 ITRS Public Conference San Francisco, USA 4 DRAFT – DO NOT PUBLISH FI 2008 Focus Enable the Transition to NGF / 450mm for cost, cycle time & productivity improvement 2008 TopicsResult 1Incorporate waste (inefficiency) reduction as part of FI roadmap -Defined initial factory integration high level metrics for creation of a waste reduction roadmap -Equipment Output Waste -Wait Time Waste -Completed initial draft of package to communicate waste reduction roadmap approach 2Improve data quality, & time to information - Defined strategy for integrating time synchronization and data handling requirements between production equipment and factory information and control systems. 3 Develop Facilities modeling methodology - Initial development of a modeling methodology for evaluating factory size and cost relationship 4FOUP Airborne Molecular Contamination (AMC) requirements - In conjunction with the Yield Enhancement TWG, reached consensus on monitoring and control methods, and developed initial requirements

5. 2008 ITRS Public Conference San Francisco, USA 5 DRAFT – DO NOT PUBLISH FI 2009 Focus Enable the Transition to NGF / 450mm for cost, cycle time & productivity improvement Focus Areas2009 Goals 1Incorporate waste reduction as part of FI roadmap Inclusion of initial high level Waste Reduction metrics and roadmap in FI Technical Requirements tables 2Improve data quality, & time to information Definition of requirements for equipment and factory data handling rates to improve equipment and productivity monitoring 3Airborne Molecular Contamination Requirements Incorporate AMC limits for wafer carriers into technical roadmaps and document potential solutions 4Facility Modeling Methodology Completion of a functional model validated against benchmarked data 5Address FI Cross-cut issues Address NGF/450mm and identify common areas of waste reduction needs and challenges. Address FI key issues with FEP (Carrier Purging), Litho (Reticle Electrostatic Field, Double Patterning), ESH (Energy conservation), YE (AMC, PCS for Yield) and Metrology (Wafer map standards). Other Focus Areas will be Addressed as Required

6. 2008 ITRS Public Conference San Francisco, USA 6 DRAFT – DO NOT PUBLISH Supporting Materials For ITRS Factory Integration 2008 and 2009 Focus Areas

7. 2008 ITRS Public Conference San Francisco, USA 7 DRAFT – DO NOT PUBLISH NGF/450mm Fab Guidelines 300mm JEITA Guidelines Equipment maker Inputs ISMI Guidelines NG Factory Guidelines combined with ITRS TR & PS Source XTime Dest XTime Source STK Wait Time Dest STK Wait Time Inter-Bay XTime Source Tool Wait Time Dest Tool Wait Time Seasoning etc Wafer by wafer Process Start Speed etc Tool STK Wafer Point Of View 2 6 4 5 3 ITRS FI TWG will synchronize with NGF and 450mm guidelines to address FI challenges, technology requirements and potential solutions 20052006200720082009201020112012? 20052006200720082009201020112012 Carrier & lot-size determination Direct Transport Standards Production Equipment Standards Factory Control System Standards Interoperability Testing & Reliability Verification 450mm wafer Standards Courtesy: JEITA/ISMI 300mm Classic Today Next several years 450 Productivity Axis 450mm Era Time axis 300mm Prime Driven by productivity & cost improvements (Cycle time & cost/cm 2 ) Cycle time &Cost/Cm 2 reduction

8. 2008 ITRS Public Conference San Francisco, USA 8 DRAFT – DO NOT PUBLISH More Detailed Representation of Factory Waste Wafer Equipment Factory Integration Working Group Focus People Unit View Silicon Waste Equipment Resource Waste People Capability Waste Factory View Wait time Waste Equipment Output Waste in Factory People Output Waste in Factory

9. 2008 ITRS Public Conference San Francisco, USA 9 DRAFT – DO NOT PUBLISH Waste Reduction Activity Time Table 20082009 JulyAug-OctNovDecJanFebMarAprilMayJunJuly ITRS Events 2008 Focus Area manuscript Winter meeting preparation Material for IRC consideration Spring meeting preparation Finalizing 09 ITRS Summer Mtg Winter Mtg Spring Mtg Manuscript Summer Mtg Working with Other TWGs W/R Write Up for 2009 ITRS Work with other TWGs to pilot W/R Review of W/R approach FI W/R TR tables development

10. 2008 ITRS Public Conference San Francisco, USA 10 DRAFT – DO NOT PUBLISH Facility Resource View Wait Time (WTW) and Equipment (EOW) Output Waste Cycle Time WTWReference Wait Time Product View Bottleneck Resource Operation Efficiency Losses Availability Efficiency Losses Assignable Quality Losses Rate Efficiency Losses E79 1 Theoretical Production Time Operation View Lot Size Batch Size Dandori Hot Lot Dispatch Rule Trade-Off X-Factor Metrics 2 N AMHS Raw Process Time by Process Steps Operators Issue: Comprehensive data collection of factory resource activities Addition of related factory resource activity data(; equipment, AMHS, operators, facility) Standardization of data definition Data collection automation by Lot by Wafer W/R:Waste Reduction WTW:Wait Time Waste EOW:Eqp Output Waste W/R Plan Do Check KPI Structured Information Action EOWReference OEE Metrics Waste Reduction Cycle

11. 2008 ITRS Public Conference San Francisco, USA 11 DRAFT – DO NOT PUBLISH Applying Waste Reduction to Drive The Industry in the Proper Direction Wait Time Waste Baseline = time to process a single wafer in an un-loaded tool = CTmin Actual performance = cycle time of wafer when processed in production with large lot Waste = (actual CT-CTmin)/CTmin Equipment Output Waste Baseline = designed equipment output capability (wph) Actual performance = actual good production wafer output of the equipment in production Waste = (capacity-actual good wfrs)/capacity * 100

12. 2008 ITRS Public Conference San Francisco, USA 12 DRAFT – DO NOT PUBLISH Factory Integration - AMHS Sub-team June 18, 200812 Data Collection Roadmap FICSPE Tool Sensor Host Software EDA E148 (NTPv3) Factory Time Server Data Frequency Time Synchronization

13. 2008 ITRS Public Conference San Francisco, USA 13 DRAFT – DO NOT PUBLISH Process Mask Layers Metal Layers Process Steps Process Mask Layers Metal Layers Process Steps Process Tools Physical Characteristic s (LxWxH, Weight, etc) Process Materials (New Technology Impact) Facility (SF,M2) Clean space, Admin Space, Non-clean space Construction Impact Design/Build Time Schedule Methodology for Future Facility Modeling High Level Approach HIGH LEVEL First Draft Average Tool Size Tool Scaling Factor Admin Scaling Factor Support Space Scaling Factor Cost per square foot

14. 2008 ITRS Public Conference San Francisco, USA 14 DRAFT – DO NOT PUBLISH Total AMC Concept YE Interface