1. ITRS Factory Integation TWG
2017/3/27
2002 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing
The Factory
Si Substrate
Mfg
Wafer
Mfg
Chip
Mfg
Product
Mfg
Distribution
Reticle
Mfg
FEOL
BEOL
Probe/Test
Singulation
Packaging
Test
Increasing cost &
Cycle time implications
Factory is driven by Cost, Productivity, and Speed:
Reduce factory capital and operating costs per function
Enable efficient high-volume production with operational models for high and low product mixes and other business strategies
Increase factory and equipment reuse, reliability, and overall efficiency
Enable rapid process technology shrinks and wafer size changes
Faster delivery of new and volume products to the end customer
FITWG 2000

2. Factory Integration Requirements and Solutions are Expressed through 6 Functional Areas
Production Equipment
Process and Metrology equipment
Mainframe and process chambers
Wafer Handling Robots, Load Ports
Internal software & computers
Process
Equipment UI
Facilities
Cleanroom, Labs, Central Utility Building
Facilities Control and Monitoring Systems
Power, Plumbing, HVAC, Utilities, Pipes, UPS
Life safety systems, waste treatment
Factory Operations
Policies and procedures used to plan, monitor and control production
Direct factory labor
Test Manufacturing
Prober, Handler, and Test Equipment
Manufacturing processes to test wafers and chips
Material Handling Systems
Wafer and Reticle Carriers
Automated storage systems
Interbay & intrabay transport systems
Personnel guided vehicles
Internal Software & computers
Factory Information & Control
Data and Control systems required to run the factory
Decision support
Process control
Plan, Schedule, Dispatch
Computers, databases, software outside equipment
AMHS
Eqpt
(side view) DB
Management
Document
MES
MCS
Network or Bus
DSS
Controllers
Station
APC
Scheduling +
Dispatching

3. 2002 Factory Integration Focus Areas
New business requirements driving changes to the factory design
Combination of many different industry business models: IDM, Foundry, Joint Ventures, Collaborations, other Outsourcing, etc
Faster new product delivery to customers [design to receipt]
Integrating the Factory with other parts of the engineering chain (design, reticle mfg…)
Implications of 300mm factory sizes reaching 30k-40k wspm on facilities, AMHS, and factory control systems
Gaps Factory productivity/Equipment OEE and methods to improve including Equipment Engineering Capabilities (EEC)
EEC includes e-diagnostic, fault detection, process control, on-line manuals, spares management etc.
Factory modeling needs and gaps to do design analysis, demand planning, optimization tradeoff analysis, etc.
Preparing for more focus in 2003 on Assembly and Test Manufacturing driven by costs & complexities

4. ITRS Factory Integation TWG
2002 Difficult Challenges
2017/3/27
> 65nm through 2007
< 65nm after 2007
Managing Complexity
Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions
Need to integrate the entire product development process
Factory Optimization
Productivity increases are not keeping pace with needs
Flexibility, Extendibility, Scalability
Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills
Post Conventional CMOS Manufacturing Uncertainty
Inability to predict factory requirements associated with different manufacturing requirements
450mm Wafer Size Conversion
Timing and manufacturing paradigm for this wafer size conversion
Will 450mm be a scale up of 300mm or a more radical change in manufacturing technology (single wafer carriers, etc.)
FITWG 2000

5. Factory Operations Technical Requirements
Year of Production
2001
2002
2003
2004
2005
2006
2007
2010
2013
2016
Wafer Diameter
300mm
450mm
High Volume / Low Mix Factory Requirements
Factory cycle time per mask layer (non-hot lot) [1,2] (days)
1.4
1.3
1.2
1.1
1.05 1
Factory cycle time per mask layer (hot lot) [1,2,7] (days)
0.9
0.8
0.7
0.65
0.6
Number of lots per carrier (lot)
One
Wafer layers/day/head count 55 61 67 73 81 89
High Volume / High Mix Factory Requirements
Factory cycle time per mask layer (non-hot lot) [2,3] (days)
0.95
Factory cycle time per mask layer (hot lot) [2,3,7] (days)
0.75
0.55
0.5
0.45
0.4
0.35
Multiple 37 41 45 49 54 60
Common requirements across Both Factory Types
Groundbreaking to first tool move-in (months). 9 8 7 6
5.5 5
First tool move-in to first full loop wafer out (months) 4
3.5 3
2.5 2
1.5
Node to Node change-over (weeks) 13 12 11 10
9.5
Floor space effectiveness 1X
2003 will propose adding new product cycle time to the metrics (analysis on-going)
- Progress lacking in ability to run multiple lots per carrier

6. Production Equipment Technical Requirements (1 of 2)
Year of Production
2001
2002
2003
2004
2005
2006
2007
2010
2013
2016
Wafer Diameter
300mm
450mm
Throughput improvement (run-rate) per year
Base
+4%
New base
+10 to 12%
Relative consumables, chemicals, gases, exhaust, emissions, utiliity
<1.0X 200mm 
-10%
Bottleneck equipment OEE
75%
78%
80%
82%
84%
87%
88%
90%
91%
92%
Average equipment OEE
55%
58%
60%
63%
65%
67%
70%
72%
74%
Relative maintenance/spares cost
<1.0x 200mm
<98%
Overall factory non-product wafer usage as a % of production
<16%
<15%
<14%
<13%
<12%
<11%
<10%
<9%
% capital equipment reused from previous node
Limited
>90%
>70%
Wafer edge exclusion
3mm
2mm
Production equipment lead time: 
- Order to move-in (Litho)
12 mos
- Order to move-in (other tools)
6 mos
- Setup to full throughput capable
4 wks
No significant changes to values
- Progress lacking in OEE improvements, NPW reduction

7. Production Equipment Technical Requirements (2 of 2)
Year of Production
2001
2002
2003
2004
2005
2006
2007
2010
2013
2016
Wafer Diameter
300mm
450mm
Process/product changeover time (weeks) 4 3 2
Production equipment install and qual cost as % of its capital cost
10% 8% 6%
Process equipment availability
>85%
>88%
>90%
>92%
>94%
>95%
Metrology equipment availability
92%
94%
95%
>96%
>97%
>98%
Ability to run different recipes and parameters for each wafer
Partial
Yes
Max allowed electrostatic field on wafer and mask surfaces (V/cm)
150
100 75 50 25
Relative capital cost of production equipment
<1.3x of 200mm 
New base
<1.3x of 300 mm
No significant changes to values
- Progress lacking in OEE improvements, NPW reduction

8. Material Handling Technical Requirements (1 of 2)
Year of Production
2001
2002
2003
2004
2005
2006
2007
2010
2013
2016
Wafer Diameter
300mm
450mm
Material handling total capital cost as a % of total capital cost
< 3%
< 2%
Wafer Transport system capability
Separate interbay/ intrabay
Some Separate
Some Direct
Direct tool
Direct tool to tool
MTTR (minutes) (SEMI E10) 24 20 18 15 12 10 8
Failures per 24-hour day over total system (SEMI E10)
<1
<0.75
<0.5
<0.3
System throughput [20k wspm Factory]
·Interbay transport (moves/hour)
1200
1300
1400
1500
1625
1750
1875
2000
· Intrabay transport (moves/hour)
170
180
190
200
System throughput [40k wspm Factory]
· Interbay transport (moves/hour)
2400
2600
2800
3000
3250
3500
3750
4000
No significant changes to values
AMHS system throughput numbers include both 20k and 40k wspm factories
+ Good progress on AMHS single transport hardware system development

9. Material Handling Technical Requirements (2 of 2)
Year of Production
2001
2002
2003
2004
2005
2006
2007
2010
2013
2016
Wafer Diameter
300mm
450mm
Stocker cycle time (seconds) 15 14 12 10 8
Average factory wide carrier delivery time (in minutes) 5
Maximum factory wide carrier delivery time (in minutes) 20
Stocker storage density (% Total WIP carrier volume / Total stocker volume)
* Small stocker (%)
> 25
>30
>40
>50
* Nominal stocker (%)
>35
>45
>60
Material handling equipment lead time (weeks)
<16
<14
<12
<11
<10
<9
<8
Material handling equipment installation time (weeks)
<7
<6
<5
<4
System downtime required to extend system capacity when previously planned (minutes)
<180
<90
<60
<30
<15 30
No significant changes to values
AMHS system throughput numbers include both 20k and 40k wspm factories
+ Good progress on AMHS single transport hardware system development

10. Factory Info & Control Technical Requirements
Year of Production
2001
2002
2003
2004
2005
2006
2007
2010
2013
2016
Wafer Diameter
300mm
450mm
Availability of mission critical system (%)
99.97%
99.98%
99.99%
Mean Time to Recover for mission critical applications (minutes)
<30
<15 15 10 5
Availability of the total factory system (%)
99.80%
99.90%
99.95%
Peak number of AMHS transport moves supported by material control system (moves/hr)
8,000
8200
8400
8600
8850
9150
9450
9700
% Factory information and control systems reusable for next node
>93%
>80%
Time to create FICS industry standard (months)
<12
<6 4
Lead time for solutions to conform to standards
>18
<9
<4
FICS cost including integration as a % of capital
<2%
Ability to run different recipes/parameters for each wafer
Partial
Yes
? Need to assess software systems (scheduling, dispatching, etc) readiness for single transport system
- Lead time to create and conform to standards needs additional progress

11. Facilities Technical Requirements
Year of Production
2001
2002
2003
2004
2005
2006
2007
2010
2013
2016
Wafer Diameter
300mm
450mm
Cleanroom area as a % of total site building area
17%
Mfg (Cleanroom) area/Wafer starts per month (m2/WSPM)
0.34
Classification of air cleanliness in the manufacturing (cleanroom) area
ISO Class 5
ISO Class 6
ISO Class 7
ISO Class 8
ISO Class 9
Power utilization (demand/installed)
80%
70%
Gas and chemical purity
Discussed in Yield Enhancement Chapter
Power and water consumption
Discussed in EHS chapter and Process Equipment sections
Factory construction time (months) from ground break to all facility ready 12 10
Facility capital cost as a % of total factory cost (includes equipment)
15%
Production equipment install and qual cost as a % of capital cost
10% 8% 6%
Facility operating cost including utilities as a % of total operating cost
13%
Utility cost per total factory operating cost (%) 3%
Maximum allowable electrostatic field on facility surfaces (V/cm)
150
100 75 50 25
No significant changes to values
- Facilities momentum needed to reduce cycle time

12. Key Gaps: 2003 Focus areas for Factory Integration
Technology Gaps that Need Attention Today
Integrated intrabay readiness for 300mm Factories
Ability to run different process parameters for each wafer
Production equipment OEE
NPW Reduction
Hot Lot and normal cycle times for high mix factories
Faster Product delivery
Efficient Product development
Better modeling capabilities
Future Technology Gaps and Focus Areas
Factory software systems to support Direct Transport AMHS
Equipment Engineering Capabilities and Standards
Engineering Chain Management Systems
Impact of 157nm and Next Generation Litho on the Factory
Post Conventional CMOS Manufacturing
450mm Wafer Processing

13. Integrated Solutions are Essential to Meet Needs +
Agile Manufacturing
- Equipment Engineering Capabilities
- Single wafer control
Engineering Chain Mgmt
Process Control
- FDC, R2R, W2W control
IM and M2M matching
Material Handling
- Direct Transport for Send Ahead, monitors, hot lots
Integrated Sorters, Stockers, Metrology?
Flexible Factory Designs
Quick ramp-up operation
Extend & Scale quickly
Convert quickly
Technology Requirements
New disruptive process technologies
Next Generation Litho
157nm litho
High K gate stack
Low k dielectrics
Copper processing +
Improved Productivity
Decreased Factory Cycle Time (QTAT)
Improved Equipment Efficiency
Reduction in non-product (I.e. test) wafer usage
More efficient direct labor
Faster factory conversion at technology nodes
Integrated Factory
Goal = Meet Factory Challenges and Technology Requirements

14. Industry Business Model Is Changing
ITRS Factory Integation TWG
2017/3/27
Industry Business Model Is Changing
Foundry/Fabless
Age
IDM Age
Collaboration Age
Transactions and Interlinkage will be flexible and open.
Marketing IP
Design
Marketing
Design
Design
EP/BP
Fab
Marketing
Design
Fab
Foundry
水平分業の時代から、よりフレキシブル、ダイナミックなコラボレーション時代に変化していく。この時代のキーテクノロジーの一つがＩＴ技術になる。
IPﾞ
Foundry
Marketing
IT is a must and Speed is most important
FITWG 2000

15. Engineering Chain Management
Customers want new products delivered faster [design  ship]
The Engineering Chain integrates the development flow from design specification to customer delivery for a new product through engineering data exchange
Engineering Chain = Design  Reticle  Process Integration  Customer  High Volume
This is different from supply chain mgmt which focuses on efficient volume production
Engineering chain management ensures customer cycle times are met, while new products are properly integrated with the process
Supply Chain (O2D)
Sales
SCP
MES
Factory
Shipping WO
WIP
Order
Promise
Design
Commerce Data
Engineering Data
Engineering Chain (T2M)
e-Diag
Maintenance
Support
EE Data
EES
APC
Recipe
Eqpt. Configuration
Mass Production
Product Development
Process
Devmn’t
YMS
Mask
Eqpt.
Eqpt. Supplier

16. Potential Solution it is driving
Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality
Metric
Potential Solution it is driving
Production Equipment Overall Equipment Efficiency (OEE)
Equipment Engineering Capabilities including: e-Diagnostics, spares management, fault detection, on-line manuals to improve MTTR
Advanced Process Control to improve output
Integrated factory scheduling and dispatching capabilities to improve equipment utilization
Optimized Wafer movement at equipment
Ability to run different process parameters for each wafer on equipment
Implement embedded controller standards
MES capabilities to handle standard and non-standard operational scenarios
Non-product wafers as a % of factory wafer starts
Techniques to design equipment for reliability
Advanced Process Control systems
Hot-Lot and regular lot cycle time per mask layer for the factory
Direct transport systems integrated with factory schedulers for tool to tool moves
Innovative carrier/wafer level control systems

17. Potential Solution it is driving
Translating Material Handling, FICS, and Test Manufacturing Metrics to Reality
Metric
Potential Solution it is driving
Number of transport types in the factory
Direct tool transport using conveyors
Direct tool transport using overhead hoist
AMHS system throughput for interbay and intrabay
Electrical, mechanical, and control systems for transport types: OHS, OHT, RGV, AGV, PGV
Improved Scheduling/Dispatching for direct tool transport, hot lots, send ahead wafer, etc.
Time to create industry standards
Monthly or Continuous voting cycles to approve
Use Internet for balloting/approval
Dedicated resources for development
Lead time for solutions to conform with standards
Develop standards and applications in parallel
Automated test tools for compliance verification
Groundbreaking to first tool move in
Standardized design concepts
Design tools including e-tools
More off-site module construction

18. Continued Standardization is needed to Reduce Integration Time, Cost, and Complexity
Production Equipment
AMHS interfaces
Automation data interfaces
Facilities hook-up
ESD
Factory Information & Control
E-Factory standards (EEC, APC, etc.)
Equipment Data Interfaces
Company Data Interfaces
Security
Process
Equipment UI
Test Equipment
Automation data interfaces
AMHS interfaces
Facilities hook-up
ESD
Partner
Security
Firewall
Customer /
Supplier
Material Handling Systems
Production Equipment Interfaces
Automation data interfaces
Facilities hook-up
Carriers
Facilities
Height, weight, temperature
Equipment Hook-up
Safety
AMHS
Eqpt
(side view)
Not an exhaustive list

19. Potential Solutions driving R&D Agenda
Engineering chain management models, data integration and interface standards
Factory capacity planning and supply chain management systems integrated with actual factory data
Internet based Manufacturing and Engineering systems
Advanced Factory/Mfg Modeling Tools and Capabilities
Equipment Engineering Capabilities (EEC)
e-diagnostic, fault detection, advanced process control, on-line manuals, spares management, etc.
Scheduling, Dispatching, and MES integration for Direct Transport AMHS
Additional Industry Standards for Equipment, AMHS, Facilities, and Information/Control Systems

20. Key Messages
Improving the Factory’s Cost, Productivity and Speed is essential
Business strategies, market demands, and process technology changes continue to make factories difficult to integrate
More focus must be spent on new product development and high mix factory cycle times
Gaps in Production Equipment OEE, Factory NPW usage, and Factory modeling must be improved.
e-Factory concepts are being developed to solve complexity, integration and equipment OEE issues
Standards have been very effective in 300mm, but must be implemented more consistently in some areas
More focus must be given to Post-Fab manufacturing (Assembly, Test, etc.) to improve productivity

21. No Significant 2002 Changes to ESD Requirements
Production Equipment Technology Requirements
Facilities Technology Requirements
Test Manufacturing Technology Requirements
Was
Maximum allowable electrostatic charge on devices
1-2.5 nC V
1.0 nC
100V
0.5 nC
50V
0.1 nC
10V
0.25 nC
25V Is
Facilities Standards
The SEMI ESD Task force is
currently working on a new
document to define facility
electrostatic levels. First ballot
expected March Change
color to blue – under development
Facility electrostatic
levels stds
No data available to support changing the values in the tables
SEMI ESD Task Force working on a document for electrostatic compatibility in the factory – most likely data source for changes