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Published byCecilia Polly Maxwell Modified over 9 years ago
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WP4 – Optical Processing Sub-System Development Start M06, finish M30 UCC lead Plans for next 6 months: –Begin firmware/control work –Focus on initial hybrid integrated photonic devices –Develop driver/control boards –Incorporate 3mm long SOAs in optical modules –Start work on higher index contrast passive waveguides
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Twin Regenerator Motherboard chip Hybrid design showing SOA array in place Silicon daughterboard Semiconductor optical amplifier array (SOA) Passive pigtailing arrowhead
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Other devices Basic regenerator XOR gate –Includes time delay structures 2x2 switch fabric Integration approach is transparent to passive waveguide device structures. Long path length (cm’s to metre) possible
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Driver Board Requirements: –Constant current sources for SOAs (0-1A) –Current sources for phase shifter heaters (0- 150mA) –Thermoelectric temperature control –Control algorithm for MZI bias setting
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3mm v 2mm SOAs Comparison of gain recovery 3mm fully recovers in ~ 25ps (40Gb/s bit time)
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160Gbit/s XOR gate Uses 3mm SOA 2 MZI in a master MZI Should be much faster switch than previous design
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FYI optical memory - principle Clock Data Loop (L) Output & Clock 1 Data 1 Loop (L) Output 1 & & Clock 2 Data 2 Output 2 DTI ModeMap project Wavelength conversion Loop length fixes memory capacity
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FYI optical memory - implementation Uses: – ≈ 1/3 of a ø 150cm wafer –6 quads Technology Δ = 0.75% Will need to move to 2% Δ to reduce size
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