1. PACS IHDR 12/13 Nov 2003 PACS FPU Distribution Boards and FPU Harness Concept R. Graue, D. Kampf Kayser-Threde

2. PACS IHDR 12/13 Nov 2003 PACS FPU Distribution Board – Blue Detector

3. PACS IHDR 12/13 Nov 2003 PACS FPU Harness layout due to equal length of all detector modules Distribution Board – Red Detector

4. PACS IHDR 12/13 Nov 2003 PACS FPU EM Breadboard

5. PACS IHDR 12/13 Nov 2003 PACS FPU Rigid-flex boards Material –PCB: FR4 –Flexible Harness: Polyimide Layout shall be designed according to CNES QFT/SP.0019 Connectors: Cannon MDM 3401029 01B.... FR139 Capacitors: WIMA MKS 6,8 micro Farad, 50 VDC, 30 VAC Resistors: RNC 55 according to ESA SCC 40001 001 Distribution Board – Approved Design

6. PACS IHDR 12/13 Nov 2003 PACS FPU Distribution board test matrix

7. PACS IHDR 12/13 Nov 2003 PACS FPU Incoming inspection according to inhouse procedures Visual inspection (components, bonding points) Measuring machine Pin to pin continuity Insulation Cross talk ohmic resistance test PCB layout test against Gerber data (automated inspection protocol) Distribution Boards – Functional Verification Plan

8. PACS IHDR 12/13 Nov 2003 PACS FPU Distribution Boards Functional Check Out Test Plan on FPU level Functional tests (prior and after cold vibration tests and during He temperature tests) –Complete detector chain operation required –Detection of Photoconductor signals (tbd by MPE) –Test operations controlled by COE (MPE-tbc) –Validation of signals by MPE (determination of nominal Photoconductor operation)

9. PACS IHDR 12/13 Nov 2003 PACS FPU PCB design completed Manufacturing data package completed ICD updated CQM components tested /screened/released by ESA (Resistors, capacitors, connectors) CQM Distribution Board –Status - Completed Tasks I Design, Documentation and Components

10. PACS IHDR 12/13 Nov 2003 PACS FPU EM Test board –Manufactured –Functional testing –Cryogenic cycling test (LN2) –Cryogenic vibration test (LHe) – Cryo STM test CQM Boards –PCBs Manufactured and under inspection (NCR wrt anomalies) PFM Boards –PCBs Manufactured and under inspection (see CQM) CQM Distribution Board –Status - Completed Tasks I Assembly

11. PACS IHDR 12/13 Nov 2003 PACS FPU CQM Boards –Assembly –Functional testing –Cryogenic cycling test (LN2) –Qualification testing of bookbinder fabrication technology –Documentation (Inputs for DP) –Distribution board delivery until 11.2003 PFM Boards –Asssembly and testing –Capacitor screening and distribution board delivery until 7.2004 Distribution Board –Status – Open Work and Schedule

12. PACS IHDR 12/13 Nov 2003 PACS FPU Distribution Boards Cryo Qualification Test Matrix TestsPlanned Qualification Tests Performed BB Test Performed Cryo STM Test Comments Ambient simplified Functional Test prior / after Cold Vibration Test XX-KT provided stand alone test Cold Vibration Test (LN 2 or He) – (3 axes) X-X (He)MPE tests; mounted in Cryo STM (FPU) Thermal Cycling LN 2 XX-KT shock tests with 10 cycles Ambient functional tests after thermal cycling test (LN 2 ) XX-KT tests Thermal Vacuum Test (He)XXXMPE provided functional BB and CQM FPU tests Functional Test at cryogenic temperatures (He) XX-BB test provided by MPE with performance characterization  Distribution Boards are Cryo Vibration Qualified

13. PACS IHDR 12/13 Nov 2003 PACS FPU PFM Capacitor screening (Updated procedure) Verification test plan of PCB bookbinder technology manufacturing procedure in progress –Microscopic tests (e.g. cracks) –Thermal tests –Functional tests Distribution Board - Open Points

14. PACS IHDR 12/13 Nov 2003 PACS FPU FPU Harness Architecture

15. PACS IHDR 12/13 Nov 2003 PACS FPU Harness designed and approved Manufacturing data package released CQM/PFM Manufacturing completed CQM/PFM Hardware delivered and inspected ICD approved CQM harness under integration into FPU (CQM) Harness – CQM/PFM Procurement Status