1. Nano Technology for Microelectronics Packaging
MINAEST-NET Partnering TU Berlin/FhG-IZM, Berlin, Germany - 22 April 2005
Nano Technology for Microelectronics Packaging
Karl-Friedrich Becker, Rolf Aschenbrenner
BECAP - TU Berlin / Fraunhofer IZM
Gustav-Meyer-Allee 25 / Berlin

2. Hetero System Integration on Organic Substrate

3. Possible Applications for Nanotechnology within Electronic-Packaging
Transparent Encapsulation / Provide diffusion barriers for OLEDs
Module protection by planar encapsulation / functional layers
Self Assembly of Components
Low temperature inter-connection technology for low cost applications / for (bio-)sensors
DISPLAY
BATTERY IC
R-NET
OSCILLATOR
TAPE
COIL
SAW-Filter
Sensor Devices with Nano Functionality
Base material with optimized mechanical, optical and electrical properties and geometrical functionality
Advanced thin film technology for RF integration (self assembly)

4. Nano Materials for Packaging – IZM Focus
Nano-Scale filler within encapsulant - IZM
Nano Filled Epoxy as SiP Base Material – Duromer with „Ceramic CTE“
Use of nanoscale filler particles to realize materials that allow high accuracy structuring in combination with e.g. LIGA mold inserts. Direct metallization yields CTE-matched duromer substrates (Duromer MID) with high accuracy µStructures for high precision 3D assembly of sensors/MEMS suited for security issues ...
Nano Fillers for (Opto-)Encapsulation
Use of nanoscale filler particles to realize encapsulant transparency while providing matched thermomechanical properties for optoelectronic packaging. Currently 20 wt% is a maximum for low viscosity liquid encapsulants
Nano-Scale SiO2 filler within transparent encapsulant – Courtesy Hanse Chemie
Solder Nanoparticles generated by
ultrasonic dispersion method - IZM
Nano Scale Solder Particles for Fine Pitch Interconnects
Realization of Type 6 and 7 solder paste using ultrasonic dispersion in inert media – base material for fine pitch solder printing on Wafer or on organic substrate. Tm reduction due to nano size effect has been shown by Wronski et al 1967, Dick et al, 2002.

5. Interconnects for NanoSystems – Aims
Interconnect Targets:
Fine pitch due to increasing no. of interconnects per die
Low profile for improved high frequency performance
Low temperature potential to allow heterogeneous integration with temp sensitive bio and polytronic devices
Low cost potential by WL processing and infrastructural embedding
Interconnect Challenges:
Planarity and Homogeneity of Fine Pitch Interconnects
Surface Effects Dominate Over Bulk Effects
Yield optimum combination of LowTemperature Interconnection for Bio Packaging, Low Cost Packaging, ... and High Temperature Stability
Low Profile Interconnects Need Stress Compensation
40 µm Flip Chip Pitch and 60 Wire Bond Pitch
eGrain

6. Nickel Bump / UT Solder Bump
Interconnection Technology from Micro to Nano
Molecular Modeling
Continuum Approach
FEM Simulation
Potential for Low Temperature Interconnects /
Reactive Interconnects
Complexity
NanoVelcro / NanoLawn
Nickel Bump / UT Solder Bump
Solder Bump / Wire Bond
10 nm
100 nm
1 µm
10 µm
100 µm
1000 µm
Interconnect Pitch

7. Resolution Enhancement
Nano-Reliability at IZM
Structure - Property Correlation by Combined Simulation & Experiment
NEW:
Nano-Material Composition Design: Matrix & Filler
Parameters
NEW:
Nano-Simulation Ab-Initio Calculation of Nano-Parameters for FE-Input, Homogenisation, Molecular Modeling
Correlation
Structure
Continuum FE-Simulation Stress and Strain Fields, Lifetime Prediction
Macroscopic Materials Testing Verification of Bulk-Properties
Correlation
Design Guide
Nano- Analytics Verification of Nano-Structure, Nano-Deformation
Resolution Enhancement
Contact: B. Wunderle
Department Mechanical Reliability & Micro Materials

8. Outlook - Nano Technology Potential for Packaging Applications
Advanced Devices as carbon nano tubes, molecule transistors, - sensors, -actuators
Effective Interconnection Technologies as thin, elastic, reactive interconnects, vertical and horizontal orientation, additive structure generation and low temperature interconnection technologies
Improved Materials e.g. low cost thermal management, tailor made materials, super materials
Cost Efficient Assembly zero-force, high precision component assembly, handling of smallest geometries, self-assembly resolving the handling issues of state of the art technology
System Integration: Sensors, Actuators and MOEMS