1. 111111 Signal Integrity @ Intel CDC Columbia, SC 11WW14 Hendrick, Matt R [matt.r.hendrick@intel.com] Gregory, Adam J[adam.j.gregory@intel.com]

2. 22 Intel Columbia  ~230 employees  Largely Validation EE’s  Analog & Digital  Product Application Engineers  Signal Integrity  Software (BIOS) Engineers  Product Architecture  Marketing  Many more…

3. 33 Signal Integrity Roles  Chip to Chip Communication Ingredients  PCB (FR4, Megtron)  Connectors, Cables  Packages, Sockets, Vias  Flex Cable  USB, PCI-Express, SATA, DDR – you name it!  Current Emphasis on High-Speed Serial 5GT/s+  Simulations consist of many different 3D and circuit-based tools  Circuit: Spice, Nexxim  Full 3D: HFSS, CST, ADS, etc.  Statistics based data analysis: JMP  Scripting: Matlab, Perl, VBA, etc.

4. 44 Surface Current (J) @ 1GHz 79-mil stub11-mil stub

5. 55 Surface Current (J) @ 15GHz 79-mil stub11-mil stub

6. 66 Via Insertion Loss (S21) 11-mil stub 79-mil stub dB Hz

7. 77 Signal Integrity Internship, Summer 2011 Qualifications  Ability to communicate effectively with internal customers  Ability to work well in a diverse team environment, and with minimal supervision  Disciplined and high attention to details  Willingness to learn new things  Good documentation skills and practices  Familiarity with HSPICE/Spice tools would be an added advantage  Programming skills with Perl, and C is highly desired Related Course Work preferred but not req’d  CMOS and VLSI Design  Applied Electromagnetics  Numerical Analysis  High Speed Digital Design  Analog and Mixed Signal IC Design  Digital Electronics  Electron Devices  Advanced Logic Design  Computer System Architecture design  Computer Architecture  Linear Integrated Circuits  Signal Integrity Engrg. Intern. Job ID #597860  http://www.intel.com/jobs/index.htm http://www.intel.com/jobs/index.htm  #1 Resume Booster: ELCT 762 (Signal Integrity for High Speed Circuits)