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Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 1 DIRECT MEASUREMENT OF PLANARIZATION LENGTH FOR COPPER CHEMICAL MECHANICAL.

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Presentation on theme: "Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 1 DIRECT MEASUREMENT OF PLANARIZATION LENGTH FOR COPPER CHEMICAL MECHANICAL."— Presentation transcript:

1 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 1 DIRECT MEASUREMENT OF PLANARIZATION LENGTH FOR COPPER CHEMICAL MECHANICAL POLISHING (CMP) PROCESSES USING A LARGE PATTERN TEST MASK. Paul Lefevre, Albert Gonzales, Tom Brown, Gerald Martin,International SEMATECH, Austin, TX; Tamba Tugbawa, Tae Park, Duane Boning, Microsystems Technology Laboratories, MIT, Cambridge, MA; Michael Gostein, Philips Analytical, Natick, MA; John Nguyen, SpeedFam-IPEC, Phoenix, AZ.

2 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 2 Agenda Introduction Pre CMP topography International Sematech / MIT Mask 862 design Wafer process and metrology Planarization Length definition Planarization Length on different process Planarization Length on different consumables Conclusion

3 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 3 Introduction Visual observation copper residue are more or less pattern dependent (Qualitative) Feature size design / Pre CMP topography size Develop a direct qualitative method for planarization distance measurement. Help industry with having access to this mask International Sematech / MIT 862 (Semiconductor and CMP suppliers)

4 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 4 Pre CMP topography 50 um copper line, 50 um space 9 um copper line, 1 um space 0.25 um copper line, 0.25 um space 1 um copper line, 1 um space

5 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 5 Pre CMP topography consequence

6 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 6 Wafer layout

7 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 7 Mask layout

8 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 8 Small features (5mm x 4mm) Small structures

9 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 9 Wafer process Copper Thickness is 2X trench height

10 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 10 Metrology Measurements performed on Philips Impulse 300 15 measures per Structure -5 left -5 center -5 right

11 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 11 Results Top - Bottom PE = 1 – Bottom / Top

12 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 12 Results Minimum Planarization Length Maximum Planarization Length Average planarization Length Log Scale

13 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 13 Planarization Lengths Average Planarization Length Maximum Planarization Length = Minimum Feature size were removal bottom equal removal top Or Maximum Planarization Length = Minimum Feature size were planarization Efficiency is zero Minimum Planarization Length = Maximum Feature size where removal bottom is zero Or Minimum Planarization Length = Maximum Feature size where planarization efficiency is 1 Average planarization Length = (Min PL) x (Max PL) Average Planarization Length on a Log scale diagram is = Exp ( Average (Min PL, Max PL))

14 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 14 Consumable comparison

15 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 15 Consumable comparison

16 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 16 Consumable comparison

17 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 17 Process comparison

18 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 18 Process comparison

19 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 19 Process comparison

20 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 20 Process comparison Low Planarization Length Very high Planarization Length

21 Copper CMP Planarization Length - MRS 2001 - April 19 th, 2001 – Paul Lefevre – Page 21 Conclusion New International Sematech / MIT mask 862 allow a direct measure of planarization Length Definition of Planarization Length Wafers mask 862 available – In public domain

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