1. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 1 Project: IEEE 802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Time to Market Pervasiveness - MultiBand OFDM Products] Date Submitted: [13 September 2004] Source: Roberto Aiello, CEO, Staccato Communications Eric Broockman, CEO, Alereon David Yaish, CEO, Wisair Contact:roberto@staccatocommunications.com www.staccatocommunications.com ecbroockman@alereon.com www.alereon.com david.yaish@wisair.com www.wisair.com Abstract:[Time to market is a term commonly discussed in developing markets, this presentation defines the true meaning of the term, industry expectations, and when interoperable standards-based (non- proprietary) products will become pervasive.] Notice:This document has been prepared to assist the IEEE 802.15. It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release:The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by 802.15.

2. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 2 Outline Definitions Product development timeline Conclusions: no TTM advantage for DS-UWB

3. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 3 Definitions Time to market –when the proposed technology will be ready for integration Time to market pervasiveness –Time to industry success: Volume & Profitability So...... What does it take? Time to market –One vendor doesn’t provide market pervasiveness Time to market pervasiveness requires an ecosystem –You need more than just a radio to assure market acceptance WiMedia – Interoperability & testing Wireless USB – Software integrated in operating systems 1394TA – Leverage multi-industry momentum –Broad industry support multiple vendors Multiple implementations Interoperability Price competition –Broad market appeal Designed for PC, CE and mobile markets (& supporting their convergence) Ease of use in all

4. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 4 Robust design for all target markets: PC, CE and Mobile  Wireless USB 1.0 specification to be published in 2004  Wireless USB Promoter Group announced 2/04  Multi-vendor wireless USB demonstration offered 9/04  Wired USB was 400Mu in 2003, NEC alone forecast 25Mu of W-USB in 2007  1394 Trade Association developing a PAL for the WiMedia platform  1394-TA has defined and published some of most fundamental elements of the PAL  Compliance & Interoperability WG is collaborating with the WiMedia Alliance  Wired 1394 was 100Mu in 2003  WiMedia Alliance is to UWB as WiFi is to 802.11  Will publish industry standard convergence layer specification in 2004  Wireless USB Promoter Group adopted WiMedia Alliance convergence layer  1394-TA engaged with the WiMedia Alliance  MB-OFDM PHY is product of extensive peer review by +170 companies Status Standards Organization USB 1394 WiMedia

5. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 5 Extensive industry support of over 170 member companies; please visit www.multibandofdm.org for a full list of companies which include: www.multibandofdm.org - Top 10 semiconductor companies (except TSMC; TSMC has invested in a MB-OFDM start-up company) - Many of the leading CE, PC and Mobile Phone companies - Endorsement by the Wireless USB Promoter Group and WiMedia Alliance and engagement with the 1394 Trade Association - Over $100M in 2004 venture capital investment into MB-OFDM start-up companies Broad Industry Support

6. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 6 Industry readiness High level protocol and application support –Wireless USB –Wireless 1394 –Wireless Video (IP) Multiple suppliers –better quality, lower cost –more choice of solution (package size, integration, power consumption, performance,…) Interoperability Certification authority –supported by the target industries

7. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 7 Industry timeline PHY Proposal Specs Stable Requirements  PC  CE  Mobile  W-USB  W-1394 Standards & Technology Creation 7/03 2/04 9/04 Q105 Q205 Q405– Q206 … Productization Multi-Vendor Interoperability IC Development IC Samples MAC Sim / Dev C & I Program Components Ecosystem Formation Corporate R&D Technology Demonstration (Intel Developers Forum) Development Platform Business Groups Engaged Commercial Deployment Product Development By the major CE, PC and Mobile Phone companies

8. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 8 Timeline, presented Sept 2003 Time PHY / MAC Convergence Arch PHY/MAC Interoperability Applications Connection Mgmt 1H 20032H 20031H 20042H 20041H 20052H 2005 Today, a proprietary bare pipe. A real product that won’t get returned? ‘05 Whole Product Proprietary Bare Pipe 802.15.3a Bare Pipe Doc: IEEE 802.15-03/343r1

9. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 9 Current timeline Q4 ‘05 End – Products on shelves Q2 ‘05 End – Products prototypes Q4 ‘04 Silicon engineering samples Q3 ‘05 Start product certification Plug fests Alereon, Staccato, Wisair timeline No TTM advantage for DS-UWB: -MB-OFDM will have silicon in Q4 ’04 -MB-OFDM will ship next year from multiple interoperable vendors

10. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 10 DS-UWB TTM inconsistencies July 7, 2000, Martin Rofheart, doc.: IEEE 802.15-00/195r4 Time to market –Sample chipsets 2Q01 –Limited availability 3Q01 –Production quantity 4Q01 July 2003 Matt Welborn, doc.: IEEE 802.15-03/153r9 Production ICs here today Sept 7, 2004, Communications Daily [Freescale] said it hoped to start shipping commercial product in about 6 months Sept, 13, 2004, Freescale press release, Jon Adams: “These milestones underscore the two-year time to market advantage” Products have been announced for 4Q 2001, Q2 2003, and Q2 2005

11. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 11 Spectrum discrepancy results in lower performance 34567891011 34567891011 GHz FCC Certification Test Report for Motorola Corporation FCC ID: RUN-XSUWBWDK doc.: IEEE 802.15-04/140r2 System tested is very different from IEEE proposal: Lower performance, lower bit rate, higher power

12. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 12 Current system doesn’t appear to be low cost, low power Source: FCC Certification Test Report for Motorola Corporation FCC ID: RUN-XSUWBWDK System tested appears to be much higher cost, lower performance, lower bit rate, higher power than current DS-UWB proposal

13. doc.: IEEE 802.15-04/0548r0 Submission September 2004 Alereon, Staccato Communications, WisairSlide 13 Conclusions Time to market pervasiveness requires not only product availability but –Multiple suppliers –Multiple vendors and their implementations –Total Ecosystem/Support Infrastructure Interoperability and certification Protocol and Application vendors Supporting/peripheral components suppliers no TTM advantage for DS-UWB