1. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO 3D Circuit Integration Technology for Multiproject Fabrication Program Kickoff 7 April 2000 L-325, MIT Lincoln Laboratory Introduction Original Program Review New Program Effort Lisa McIlrath8:30-10:00 Break and Camera Demonstration Advanced Photodiode Development: 150mm Wafer Transfer Effort: Purchase of Wafer Aligner/Bonder: 3-D Via Topologies: Introduction: New Lincoln Effort: Schedule: James Burns10:45-11:00 Keith Warner 11:00-11:15 Craig Keast10:30-10:45 Craig Keast11:50-12:00 Peter Wyatt 11:30-11:50 Andy Loomis 11:15-11:30 Lunch and Discussion:All12:00-1:00

2. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO 3D Circuit Integration Technology for Multiproject Fabrication TREX Enterprises: System Integration New Research in 3D Architectures and Systems Break and Camera Demonstration New Program Overview: High Resolution Camera Design: Summary of Prior Results: Algorithms for Activity Detection with 3D Sensors: Lisa McIlrath9:00-9:30 Steve Hawley 9:30-9:50 Lisa McIlrath8:40-9:00 Victor Lum 9:50-10:05

3. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO N1 Test Reticle Layout

4. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO N1 3D Photodiode Active Pixel 10  m via 32  m x 37  m pixel area

5. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO 3D Transfer/Via SEMs - 9/98 Deep and shallow 10  m vias - top view

6. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO N1 Via Chain Measurements - 9/98

7. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO N1 Diode Measurements - 9/98

8. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO N2 Test Reticle Layout

9. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO 6  m via on 150mm wafer -- 7/23/99 Adhesive Oxide Aluminum

10. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Photomicrograph of Imager Metal-1 Pad 3D Via

11. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO N2 2D & 3D Ring Oscillator Measurements

12. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO First 3D 64x64 Imager Results - 9/99 Dark ImageRoom LightBright Light

13. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO NU - LL 3D Technology Transfer Wafer-to-wafer bonding process under development at Lincoln Laboratory Traveller of NU 3D process delivered to Lincoln Complete devices from North 3 and 4 runs Transfer Keith Warner to Lincoln - (task completed)

14. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO 3D Pixel Design: Free-Running Sampled Oscillator 100000111  CLK t (x max /x).  x max.  A B V V < B ? A Iph V

15. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO 3D & 2D Pixel Layouts MOSIS HP 0.5  m process 30  m x 30  m pixel 3D SOI-CMOS 0.8  m process 2-layer 45  m x 45  m pixel

16. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Circuits / Systems Design Status Pixel-Parallel A/D Imager Design -- Tests / Design Revs Complete 40nW / pixel @ 3.3V, 0.1% Residual Fixed Pattern Noise 64x6448x48

17. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Circuits / Systems Design Status 3rd Layer Design Taped Out 11/1/99 On-chip VCO with 2 16 (65536) bit range On-chip pixel-parallel 1st stage low pass filtering Programmable resolution / dynamic range

18. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Circuits / Systems Design Systems Environment Camera demo system modified for 256 x 256 imager compatibility and interface upgrade Research in future smart sensor designs: – Video tracking demo (V. Lum, M-Eng thesis) – Video feedback control architectures (A. Aina, PhD thesis)

19. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Testbed Demonstration Camera System (Demo Setup in Office)

20. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Activity Monitoring Current imageBackground modelDetected objects MIT Artificial Intelligence Laboratory Object Tracking Using Adaptive Background Mixture Models Courtesy Chris Stauffer & Eric Grimson

21. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Analog Memory with Digital Feedback Pixel Oscillator Phase- frequency detector Change detector Adaptive memory Voltage- Controlled Oscillator A-Data Store Charge Pump

22. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Multimode memory module Pixel Input F.D. VCOCharge Pump Monitor F.D. VCOCharge Pump Monitor enable active enable active Problem: VCO tracks new values faster than monitor detects them

23. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Compensated Memory F.D. VCOCharge Pump enable active Pixel Input Filter Solution: Integrate a low pass filter into the loop

24. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Creating the Filter F.D. VCOCharge Pump enable active Pixel Input Edge Counter reset Compare Logic

25. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Detecting Activity Pixel Bitstream VCO output Input frequency change Second unmatched edge Activity is determined by the temporal distance between pairs of unmatched edges

26. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Better circuit / interconnect ratio “Unrestricted” vertical interconnections between layers Low digital system power: P=CV 2 f The Enabling Technology High Bandwidth  -Processors Mixed Material System Integration Large Focal Planes Exploiting Different Process Technologies Advanced Imaging Technologies SOI CMOS 3D

27. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Path to Industrialization Phase I:Infrastructure Development Phase II:Small Volume 3D Processing Center for Multi-Project Runs Phase III:High Volume Manufacturing Industry-Standard State-of-the-Art SOI/CMOS Process Automated Wafer Align / Bonding / Interconnect Patterning Goals:

28. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Phase I Plan (25 months) Process Development –0.8  m SOI/CMOS 0.18, 0.25  m FDSOI –Reliable low temperature oxide bonding –High aspect ratio Tungsten plug fill Systems Development –High Definition Imager Platform –3D-compatible near-IR imaging technique –3D CAD tools packaging

29. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO Systems Design Schedule

30. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO 0.25  m FDSOI Test Pixel 14  m x 14  m (or less)

31. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO High-Resolution Near-IR Imager Explore best method for III-V incorporation with automated 3D process technology –Proposal accepted from C. Fonstad, MIT, for selective InGaAs in Si growth Initial photodiode array lots for investigation Imager design unchanged Compatible with basic platform systems demo

32. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO 3D CAD Tools Develop minimal toolset for 3D cell layout, design rule checking, netlist extraction Interface with commonly available tools, e.g., Magic, L-Edit, Spice Platform independent Remove major obstacle for new users in Phase II Plan: –Build on prior work developed on Cadence tools –Negotiate distribution agreement with Si-valley software vendor(s).

33. Soldier Systems Center MIT Lincoln Laboratory DARPA DARPA - MTO High Definition Imager Platform Interface 3D camera with SXGA (1024x1280) display Identify military users Human factors issues