1. John Cary CEO 14:00: I NTRODUCTION TO T ECH -X AND V ORPAL (J C ARY ) 14:30: I NTRODUCING N AUTILUS (P S TOLTZ ) 14:50: S IMULATING M EDICAL P LASMAS USING FDTD (A L IKHANSKII ) 15:10: C OFFEE B REAK 15:30: A EROSPACE PLASMAS AND (V ORPAL /N AUTILUS CO - SIMULATION ) (A LEX L IKHANSKII ) 16:00: V IZUALISATION TECHNIQUES WITH HDF5 FILES (J S MITH ) 16:20: CCP CHAMBER SIMULATIONS (P S TOLTZ ) 16:50: C ONCLUDING REMARKS (J S MITH ) SIMULATIONS EMPOWERING YOUR INNOVATIONS Jonathan Smith Tech-X UK Ltd & Cockcroft-Tech-X Industrial Fellow W ELCOME TO THE ICOPS 2012 V ORPAL W ORKSHOP AND D AVID S MITHE AND M ING -C HIEH L IN

2. What are the plans for today? Show how to get answers using Vorpal Work with you on various plasma modeling problems Get your feedback In this introduction: Overview of Tech-X Recent additions to Vorpal Roadmap for Vorpal SIMULATIONS EMPOWERING YOUR INNOVATIONS

3. With 18 years of experience, Tech-X’s mission is to provide customers with the best computational software and engineering services to enable their breakthroughs in research, development, design, and operations www.txcorp.com High-performance computational software High-performance visualization and HPC application front ends Enhancing code performance Other development including quality and portability

4. Our partners and collaborators are at the leading edge of science and technology. They represent a broad spectrum of efforts to discover, describe, predict and exploit the complex behaviors of matter and energy. Partners and Collaborators

5. Customers and Commercial Partners We provide our customers with both off-the- shelf and customized solutions addressing their advanced technology needs.

6. Tech-X has a history of discovery and recognition SIMULATIONS EMPOWERING YOUR INNOVATIONS AVS Innovation Award Department of Energy Visualization Awards 2008 Tech-X UK Ltd wins 2010 knowledge business of the year Crab Cavity Visualization Far reaching discoveries Laser-Plasma Accelerator 2011

7. Vorpal: Past and Future (Road Map) OOPIC Pro 5.0 improvements 5.2 improvements Road Map  6.0 features  7.0 features SIMULATIONS EMPOWERING YOUR INNOVATIONS

8. OOPIC Pro has reached its end of life All OOPIC Pro features will be supported by Vorpal 6.0, which furthermore has a host of other features (3D, better parallelism, more solvers, …) Support will have to be at a volunteer basis after December 31, 2012 XOOPIC remains available SIMULATIONS EMPOWERING YOUR INNOVATIONS

9. Vorpal: Plasma and EM modeling framework Broad range of plasma, EM and ES models  Particle-in-cell, Boltzmann fluid, Euler fluids  Cut-cell algorithms for accurate electromagnetics in complex geometries Runs on largest-scale parallel supercomputers, routinely on > 30,000 node concurrently Extensive implementations of plasma-material interaction physics  Sputtering  Secondary emission,  Ionization, recombination, nuclear reactions SIMULATIONS EMPOWERING YOUR INNOVATIONS

10. Vorpal: Wide range of applications Widely used in government, industry and academia (all projects below with involvement of Tech-X personnel) High-energy physics: Laser Wakefield Accelerators Aerospace: Plasma engines, dielectric barrier discharges Photonics: Bandgap structures, meta-materials Surface interaction: Multipactoring, electron cloud effects High-Power Microwave: Cavity optimization, Magnetrons, Gyrotrons Semiconductor manufacturing: Surface deposition reactors Ion sources: Electron cyclotron resonance ion sources High energy-density physics: laser fusion, inertial confinement fusion (ICF) SIMULATIONS EMPOWERING YOUR INNOVATIONS

11. Vorpal 5.0 (Sep 2011) Improved Visualization Environment Simulations in Cylindrical Coordinates Improved Framework for Collisions Electromagnetic Simulations on GPUs Improved Restart Performance Improved Documentation VorpalComposer (VisIT based visualization) SIMULATIONS EMPOWERING YOUR INNOVATIONS

12. Composer Toolkit Approach: Customizable Workflow bridges the gap to HPC

13. Vorpal 5.2 (March 2012) Inclusion of new, improved port macros. More cylindrical examples Improvements to particle post-processing External circuit improvements Further enhancements to visualization tools.  Improved cylindrical visualizations  Improved phase-space plots SIMULATIONS EMPOWERING YOUR INNOVATIONS

14. Vorpal 6.0 (expected Aug-Sep 2012) Remote control and visualization Implicit electromagnetics Improved parallel performance Modularity Flexible collision framework to allow  Collisional recombination  1->2 body decay Allow user definition of all process rates/cross sections  Cross sections  Field ionization  Secondary electron yield  Sputtering User definable post analysis SIMULATIONS EMPOWERING YOUR INNOVATIONS

15. Vorpal 7.0 (expected Aug-Sep 2013) Constructive Solid Geometry Input file generation  Syntax highlighting  Context sensitive help  Validation (strong typing)  Preview of calculated variables  'Tree view' More CAD readers (STEP, SAT) Space-charge limited emission (Child Langmuir) Coulomb collisions Embedded boundary electrostatics Higher-performing particles  AVX  GPU  MIC? Neutral fluid flow, with fluid heated by the plasma SIMULATIONS EMPOWERING YOUR INNOVATIONS

16. We are looking for user input What do you need? What can make your life easier? sales@txcorp.com Tech-X Corporation 5621 Arapahoe Ave. Boulder, CO 80303 Tel: +1 303 448 0727 jonathan.smith@txcorp.co.uk Tech-X UK Ltd Daresbury Innovation Centre Sci-Tech Daresbury Keckwick Lane Warrington WA4 4FS +44 (0) 1925 320 210