1. Career Paths for Materials Science and Engineering Graduates Dr. Laura J. Turbini Chemistry Lab Manager and Principal Scientist Research in Motion

2. Materials Advantage University of Toronto 2 My Checkered Career AB, Chemistry MS and PhD, Inorganic Chemistry High School Teacher Industry Researcher and Manager Technical Editor University Professor Research Centre Director Lab Manager Principal Scientist Octobeer 14, 2010

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15. April 17, 2007SMTA Toronto Workshop 200715 Dendritic Growth Copper dendrite growing from cathode. Forms only when copper-complexing reagent present

16. April 17, 2007SMTA Toronto Workshop 200716 Depletion of Anode: Open Circuit

17. Tin Dendrites Octobeer 14, 2010Materials Advantage University of Toronto 17

18. April 17, 2007SMTA Toronto Workshop 200718 Important Electrical Parameters Electric Field E = V/d Ohms Law V = IR Resistance R =  (d/A) Conductivity  = 1/  OH - Br - H+H+ Pb + Cu +2 Cl - Sn +4

19. March 10, 2008TMS Annual Meeting19 A Closer Look at CAF Conductive Anodic Filaments are copper-containing corrosion by- products that emanate from the anode of a circuit and “grow” subsurface toward the cathode, frequently along the fibre-epoxy interface. CAF + Anode - Cathode

20. March 10, 2008TMS Annual Meeting20 Conductor Configurations Hole-to-hole Hole-to-trace Trace-to-trace + _ + Trace-to-hole + _

21. March 10, 2008TMS Annual Meeting21 Catastrophic CAF Failure AnodeCathode

22. 27 Corrosion of Copper in Chloride Media Formation of CuCl  Cu + Cl -  CuCl + 1e - Generation of oxygen and hydrogen ions  2H 2 O  O 2 + 4H + + 4e - CAF Formation  12 CuCl + 3O 2 + 6H 2 O  4Cu 2 (OH) 3 Cl + 4Cu 2+ + 8Cl - Pourbaix Diagram of Cu-Cl-H 2 O system A. Caputo, L.J. Turbini, and D.D. Perovic, Journal of Electronic Materials, vol. 39, pp. 92-96, 2010

23. 23 SEM Analysis of PCB cross- section Copper Glass Fibres Filled Epoxy Core Prepreg HDI

24. Epoxy and fillers characterization 24  Silica is used to reduce the coefficient of thermal expansion (CTE)  Aluminum and magnesium hydroxides are used as flame retardants

25. Epoxy and fillers characterization 25 PSi O

26. Time to Delamination 26 MgMg H150 Delamination between epoxy/glass fibers and epoxy/epoxy

27. 27 Temperature to decomposition (T d ) Derivative wt% change/˚C vs. T Overlap curves with all materials Materials with Al(OH) 3 Materials without Al(OH) 3  The presence of Al(OH) 3 causes an increase in the rate of weight loss as this compounds starts decomposing at 200 ˚C 27

28. Materials Advantage, University of Toronto 28 Questions? Octobeer 14, 2010