1. Standard based Instrumentation schemes for 3D SoC Neal Stollon Chairman, Nexus 5001 Forum www.nexus5001.org

2. Neal Stollon, Ph.D, P.E. Chairman, Nexus 5001 Forum nstollon@nexus5001.org Ph 972 458 9625 Neal Stollon is chairman of the 5001 Nexus Forum, which provides industry support for IEEE ISTO Nexus 5001 and related instrumentation standardization efforts. He has a Ph.D in EE from Southern Methodist University and is a licensed P.E., and has a decade of experience in debug architectures and instrumentation issues, on top of another decade or so of processor and SoC experience at TI, LSI Logic, MIPS, and elsewhere. Dr. Stollon is CTO at HDL Dynamics, providing systems analysis and consulting on embedded IP and instrumentation solutions for digital systems He is also the author of the book “On Chip Instrumentation: Design and Debug for Systems on Chip ”. He may be reached at neals@hdldynamics.com neals@hdldynamics.com Author Information

3. Standard based Instrumentation schemes for 3D SoC Abstract Stacked multi-die and 3D SoC are being prototyped as a next generation for increasing silicon complexity. Complex designs increasingly require means for on-chip debug and interactive access and analysis instrumentation. The complexities and interconnect limitations of 3D SoC make on-chip debug and instrumentation challenging, especially as they must be compatible with other standards being developed for heterogeneous 3D stacks. On-chip debug and instrumentation must interoperate with existing (i.e. JTAG) and proposed test strategies (i.e. PAR 1838) for 3D SoC. Key requirements for a 3D SoC debug and instrumentation environment map against proposed solutions, One is based on the IEEE 5001 Nexus standard. Nexus instrumentation features meet several of the key requirements for 3D SoC including low pin and via options for high performance debug interfaces between die layers support for heterogeneous and multi-core systems Interface standards should support both debug control and data trace in ways that are compatible with proposed 3D SoC test schemes.

4. What is 3D SoC Manufacturing technique for next generation of computing complexity Stacked die allow 3D low latency integration Test and Debug are integration and interconnect challenge Typical 3D SoC Test and Debug Proposals discussed per PAR 1838 Active JTAG TAP controller on all die Active JTAG TAP controller on bottom die IEEE 1500 wrapper/signaling on other die TCK TMS TDI TDO TCK TMS TDI TDO JTAG Path IEEE 1500 signals

5. 3D Instrumentation Challenges Larger number of cores, more deeply embedded problems –Debug data previously available at I/O, now embedded in 3D structures Diverse die with differing cores and other IP –instrumentation integration is limited by Vendor specific features –Need to support range of instrumentation protocols/interfaces –Limited IO and inter-layer vias are available for debug use Vias are expensive resource –Support for Legacy standards and existing debug features:

6. 3D SoC Debug Schemes Debug enabling TAPs – support both test and debug operations 1149.7 2 wire mode, decreases JTAG vias required Debug data port can be overlaid on 1500 signal interfaces Typical 3D SoC Test and Debug Proposals Active ATU TAP controller on all die Active JTAG TAP controller on bottom die IEEE 1500 wrapper/signaling on other die Data port Muxed to 1500 wrappers 1149.7 (2 wire) TMS TDI TDO TCK TMS TDI TDO TCK 1149.7 (2 wire) Reduced JTAG Pins Leverage IEEE1500 Signals Used for test

7. Concensus of 3D SoC Debug Needs Real Time Instrumentation – Debug and Calibration in stack Multiple Trace and Memory and Register Access Methods Real Time Read (Trace) / Write (Configuration) operations Heterogeneous Processor support – lots of legacy IP CPU/SoC architecture agnostic standard (different architectures per die) Implicit multi-core support Long Thin Wire for debug High performance and low IO Interface options Leverage mature technologies Compliance between standards/industry bodies addressing 3D SoC Proven use case in complex electronics Multiple tools Sources Support from leading vendors in the tools community Industry consortia support 7

8. A 3D SoC Nexus 5001 configuration Debug Control Messages Base die Subsystem Middle die Subsystem Top die Subsystem Trace Combiner Router Data /Trace Messages SerDes Channels 2-wire JTAG (1149.7) core Trace RAM Data Buffer Die Level 1149.1 JTAG chain Die level Processor Cross-triggers Multiplexed IEEE 1500 signalling (Bidirectional for calibration capabilities) Local Nexus 8

9. 9 Nexus 5001 Applied to each 3D die Layer 1500 complaint Output Port 1500 complaint Input Port JTAG TDI/TDO Debug Socket Data In FSM Data Out FSM JTAG TAP TCODE & Message Control/ Formatting Trace RAM Registers Nexus Debug Registers Debug Ctrl Debug Data Out Debug Data In. Processor DATA Socket Debug Socket Other IP DATA Socket Nexus Defined Domain Common regardless of Layer configuration Layer Defined Domain (Configurations different For each layer) bus Fabric SYSTEM BUS Packet-Based Messages Program Trace Data Trace Memory Substitution Vender -Defined

10. Why Nexus 5001 for 3D SoC Real Time Debug Instrumentation Architecture and interface standard IEEE Standard 5001 – ISTO Industry organization CPU/SoC architecture agnostic standard (15 different architectures to date) Default standard use in US Automotive electronics Support from range of vendors in the tools community Aligned with other standards bodies - 1149.1, 1149.7, MIPI, Power.org, OCP-IP Nexus provides a Instrumentation toolbox for SoC Debug Predefined or User defined Debug packet messages, application registers Support for levels of increasing debug functionality Embedded run control, Breakpoints, Instruction/data trace Memory and Register configuration and system analysis access Defines Multiple Trace and Debug Access Methods and interfaces JTAG & Parallel AUX. Read (Trace) / Write (Configuration) Ports Extended support for range of lower IO interface options –High speed SERDES Interface protocols –2 Wire/Parallel JTAG(IEEE 1149.7) Interface

11. Nexus 5001 packets support multi-core messages from different layers Nexus protocol is based on packets Packet may be originated by any core with Nexus instrumentation, independent of die layer subsystem Nexus Messages consist of 6 bit TCODE (Transfer Code) followed by variable number of packets Messages source packet Indicates IP block of message Allows simple Multi-core Nexus support on per message basis Each message contains optional timestamp for data synchronization Vendor packets are allow user specific commands and operations A trace message example

12. Nexus 5001 provides compliant access under JTAG Nexus Commend Sequencing: IR Nexus_Enable command Select DR Nexus Reserved Register (IMPR, OPMR, or other) DR Nexus Message to IPMR - parse message in register DR Nexus Message to OPMR scan out data in register Nexus 5001 provides protocol that operates under 1149.1 JTAG standard

13. Nexus 5001 includes IEEE 1149.7 JTAG Nexus debug over 2 wire interface provides minimum feature set Does not impact Nexus TCODE protocol or Multi-Processor/SoC debug support Nexus Aux (Data) In and Out ports extend 1149.7 bandwidth options for trace, calibration, memory access, … 1149.7 Star configurations allow direct control/data connection for Nexus ports in different devices –Address data flow with synchronization of data ports Nexus operation is compatible with 1149.7 (T0-T5) classes –Nexus protocol sits on top of 1149.7 signaling, –Improved transaction performance using 1149.7 (T5) CDX/BDX functions 1149.7 + Data Port Star Configuration DATA OUT DATA IN N TCK TMS TDI TDO M N TAP 2 TCK TMS TDI TDO AUX IN AUX OUT TCK TDI TDO AUX IN AUX OUT TCK TMS TDI AUX IN AUX OUT TDI TDO AUX IN AUX OUT TCK TMS TDI TDO AUX IN AUX OUT TAP 1 TAP 3

14. 5001 Nexus enables advanced IEEE 1149.7 JTAG features Custom instrument integration CDX/BDX interfaces 2 wire JTAG interface Parallel or Serial data connection Improved speed of debug operations Streamlined JTAG Function control Full 1149.1 emulation Increasing layers of functional enhancements Based on compliance with 1149.1 operations

15. 1149.7 Advanced CDX /BDX Options Background Data Transport (BDX) - utilize idle bandwidth during TAP IDLE, PAUSE_DR, and PAUSE_IR for transfers –Optimized throughput of data intensive trace/calibration operations Custom Data Transport (CDX) - implement a custom link protocol to “on the fly” change direction of the data transfers. –Allows Nexus data transfers to be driven from target

16. Nexus 5001 supports SerDes Signaling The Aurora protocol defines the physical layer, the link layer, data striping for one or more lanes, and flow control Supports both Framed and Streaming transfer modes Links support either a single or multiple lane channels 16

17. Key points We propose a Test compatible Debug Port implementation – 1500 and Parallel data ports operate under a common framework Nexus provides infrastructure for needed 3D SoC – Packet based commands simplify 3D internal connections Nexus-2012 standard adds access port options compatible with 3D SoC –SERDES protocol at base layer Debug data can be transferred as very fast add/drop port Leverages the very low latencies between 3D die layers –1149.7 2 wire option reduces number of through vias required Nexus Message can be treated as JTAG Rd/Wr register 1149.7 FSM are local to the per layer Port implementation Differing layers may have different instrumentation This discusses work in progress This presentation leverages concepts and work from IEEE PAR 1838 (3D Test Access Group) and IEEE 1500 (Embedded Core Test Group) – it has not been approved by either group.