2. 1 9 MEMS Commercial Packages, Materials, and Equipment Ken Gilleo PhD ET-Trends LLC 84%

3. 2 Commercial Suppliers Commercial suppliers are emerging  Large packaging foundries; e.g., AMKOR  Smaller specialized; e.g.; RJR Polymers  Start-ups; e.g., Hymite, Silex Packages  Standard  Modified standard  Full custom

4. 3 Cavity ; “Free Space” or “Head Room”  sometimes isolated from the environment or not Minimized stress, especially for sensors Controlled internal environment  dry and non-contaminating  no reactive organics Or access as required:  Gas/air -Liquids -Solids  Energy beams; e.g. light for MOEMS  Biological agents RJR MEMS Packaging

5. 4 Quantum Leap Packaging Molded plastic cavity type; LCP Process is plastic injection molding Metal lead frames (MLF) are insert-molded Lid seal is ultrasonic or adhesive Passes He leak test Handles up to 500 o C; highest of any plastics

6. 5 QLP MEMS Package LCP Lid MLF Insert molded with LCP Air Cavity for device Package looks like over-molded after sealing Base with exposed pad Ultrasonic Seal

7. 6 HyCap® for MEMS Hermeticity exceeds MIL 883F Controlled atmosphere, vacuum Particle free TCE matched to silicon Thin 0.1 - 0.4mm SMT and/or wirebondable Wafer level process Low cost

8. 7 HyCap® for MEMS HyCap ® MEMS PCB Hermetic AuSn sealing ring El. contact µ-Via SMD-contact

9. 8 HyCap ® Silicon Based Packages µ-Vias Electrical connection Solder bumps for chip contact AuSn sealing ring SMT-solder bumps Headroom for MEMS SMT sideside Chip

10. 9 HyCap ® S – deep cavity package Cavity (>250 µm) and small footprint (down to 1x1 mm 2 ) No thermo-mechanical stress Reduced MEMS overhead (smaller die size) Wafer level assembly and testing Controlled atmosphere (gases, vacuum, getter)

11. 10 Silex MEMS Package Silicon body & lid Uses unique TSV Conductors are doped Si plugs Hermetic May not be suitable for RF (vias higher Ω than Cu) DRIE via with plug;

12. 11 Silex cont. Micro-mirror with integrated package

13. 12 Kyocera Kyocera offers ceramic cavity packaging for MEMS: Kyocera is cooperating with Coventor (CoventorWare). This enables MEMS device designers to simulate the behavior of their device within the package during the development phase.

14. 13 Amkor packages MEMS in a variety of packages for air bag and rollover detection sensors for automotive applications. Amkor has developed several technologies including wafer level protected MEMS, capped MEMS and several types of molded packages. Amkor also overmolds MEMS devices capped by fabs Amkor

15. 14 Samsung

16. 15 Samsung cont.

17. 16 Session Summary Billions spent on MEMS devices (especially in USA) Not enough invested in MEMS package R&D Custom requirements limit commercial products MEMS OEMs forced to invent their package These packages are not always optimum MEMS packaging industry is evolving Semi-standard packages are a starting point