1. Dirk Beernaert, European Commission Brussels, 16 December 2010
IC design Challenges and opportunities Workshop
Dirk Beernaert, European Commission Brussels, 16 December 2010 1

2. Semiconductors as key enabling industry
Electronics
WW$1500B /
Europa $315B
Automotive Industrial Defense
Medical Space
Semiconductors
$256B /
Europa $41B
Service Providers
WW$6300B / Europa $1600B
- Internet Services Providers
- Games
- Broadcast
- Telecom Operators
Semiconductors provide the knowledge & technologies that generate some 10% of global GDP.
2007 World GDP=65200BUS$ (ppp based)
Source: IMF, ESIA, WSTS, Decision

3. Industrial and Medical Military, Civil Aerospace, Security
The Supply Chain Today
Data Processing
Communications
Industrial and Medical
Consumer
Automotive
Military, Civil Aerospace, Security

4. The evolving SC value chain / landscape
From a linear chain...
...to a networked model
Academia,
Scientific
Research
Institu-
tions
Eq.& Materials
IDM
DISTI
(branded) OEM
Service providers
(virtual) Network op.
(Consumer) Retail
Businesses, Consumers, Authorities
S/C Mfg
Services:
Foundry
SATS
Fabless
IP Providers:
IP blocks
Software
(firmware, stacks,
middleware, OS)
Design houses
EDA
DISTI
ODM
EMS
(branded) OEM
Module
makers
Service providers/
(virtual) network op.
(Consumer) Retail
Distrib.
Content
Industry:
Providers
Aggregators
Service prov.
Businesses, Consumers, Authorities
Academia,
Scientific
Research
Institu-
tions
Eq.& Materials
IDM
Logistics
service
providers
From more vertical and simple model with dominating IDMs (‘real men have fabs’) to far more complex picture
Source: ESIA

5. Changing business models
Global Consolidation: Number of Logic IDMs with Fabs. European Chip makers are moving up the value chain: From the hardware supply side into the final application
Semi
equipment
materials
Wafer foundry
Software
System
mgmt
Chip maker
Application
Content
protection
Infrastructure
integrator
Service
provider
Delivery
network
Gateway
Legislator
regulations
IBS 2009, ST 2010 5

7. Nanoelectronics ”Small, smaller, smarter”
Keep research, manufacturing, integration & system competence in Europe?
IP, lead markets, user-supplier relationships, regional innovation clusters, equipment, manufacturing, SMEs
Policy & more efforts to keep Europe attractive for investments in semiconductor research & manufacturing and for their application in key lead markets
High on EU 2020 Agenda -

8. Nanoelectronics ”Small, smaller, smarter”
- Advanced communication & computing components enabling pervasive applications -
Lower cost, higher performance and more functionality
performance
Enabled by
Smart design and Smart manufacturing of Smart Components
Digital Society
Power consumption
More than Moore: Diversification
Analog/RF
Passives
HV Power
Sensors Actuators
Biochips
130nm
Interacting with people and environment
Non-digital SoC & SiP -
90nm
65nm
Combining SoC and SiP: Higher Value Systems
Moore’s Law: Miniaturization
Baseline CMOS: CPU, Memory, Logic
45nm
Information
Processing
Digital content
SoC
32nm
22nm
Beyond Moore

9. Current FP7 R&D Work Programme
To stimulate interaction of system and technology to better explore European system competences.
To address energy efficiency needs for mobile applications
Nanoelectronics products as system enablers and solution providers for global challenges as aging society, global warming, growing population or sustainable manufacturing.
To prepare for “beyond” traditional shrinking (ITRS roadmap) -
Moore’s Law: Miniaturization
Baseline CMOS: CPU, Memory, Logic
130nm
90nm
65nm
45nm
32nm
22nm
Beyond Moore
Analog/RF
Passives
HV Power
Sensors Actuators
Biochips
Information
Processing
Digital content
SoC
Interacting with people and environment
Non-digital SoC & SiP
Combining SoC and SiP: Higher Value Systems
More than Moore: Diversification

10. Manufacturing, Equipment assessment and Access
Access to nano-manufacturing and to advanced technologies to be assured in Europe.
Access to world wide equipment market for European suppliers, especially SMEs, need to be stimulated.
Access to design tools and multi-project wafers fabrication for education, PhD and SMEs.
Semiconductor Equipment for
Wafer Bonding with Plasma Activation EV Group, CEA-LETI, Soitec
Ruthenium Atomic Vapor Deposition
Competitiveness in Nanoelectronic
Device Generations
AIXTRON, Fraunhofer IISB, Infineon Munich
Low Energy and Dose Implant Test
SEMILAB, Fraunhofer IISB,
ST Microelectronics Crolles II,
NXP Crolles R&D
Metrology Using X-Ray Techniques
Jordan Valley, CEA-LETI,
STMicroelectronics Crolles II,
NXP Crolles R&D
3D Integration of Bulk Si Wafers
EV Group, CEA-LETI,
STMicroelectronics Crolles II

11. ENIAC Joint Undertaking as Public-Private Partnership
Executive Dir. and secretariat
Health & the Aging Society
Energy Efficiency
Safety & Security
Automotive & Transport
Communication & Digital Lifestyles
Design Technologies
Equipment, Materials & Manufacturing
Semiconductor Process & Integration
Industry and R&D actors
Commission and Public Authorities
New
emphasis

12. FP7-CIP/ICT/ENIAC Budget Profiles: 70% increase in period 2011-13
M€ 
2007
2008
2009
2010
2011
2012
2013
TOTAL
PF7 ICT
1.189
1.217
1.227
1.241
1.382
1.582
1.760
9.597
CIP 58 52
105
113
120
135
149
732
ENIAC JU (2/3nat’l + 1/3EC) 97
106 87
125
240
620
1275

13. What’s next for nanoelectronics R&D in Europe?
What are the challenges ahead in a globalized world?
What are the priorities?
How to measure impact and success?
What’s necessary to better exploit results in Europe?
What’s necessary to innovate and invest in Europe?