1. Receive processed un-thinned wafers from E2V

2. Processed for bump bonding (dice, bump and attach read out chip)

3. Silicon Holding block waxed to CCD and readout chip (same technique as E2V thick thin sandwich)

4. Device thinned (leaving thicker part underneath readout chip)

5. Two detector elements placed on jig and held in position by pins and vacuum

6. Glue added for attaching foam core

7. Foam core added

8. Pins attached to ladder blocks (not necessarily glued at this stage as may need removing again for wire bonding)

9. Ladder blocks mounted onto position frame

10. Ladder blocks glued into position

11. Position frame removed

12. Steps repeated for reverse side and two mated together (illustration shows working chips bonded to underside)

13. Thick part of sandwich removed with heater element (placed on top of ladder sandwich part) and then cleaned with IPA.

14. Populated flex circuits attached to ladder blocks

15. Placed on wire bonding jig and wire bonded

16. Variations of ends for RVC silicon sandwich Key: Green – ceramic Light blue – processed silicon Dark Blue – unprocessed silicon Orange – flex circuit Hatched – RVC foam Black – pin for attachment