1. Progress on the CMS Pixel front-end system ACES Workshop CERN 4. March 2009 R. Horisberger Paul Scherrer Institut

2. 4 layer pixel system 4, 7, 11, 16 cm  1216 full modules CO2 cooling based Ultra Light Mechanics BPIX modules with long 1.2m long microtwisted pair cables Shift material budget from PCB & plugs out of tracking eta - region Modify PSI46 ROC for 160MHz digital readout & Increase depth of ROC buffers Serialized binary optical readout at 320 MHz to old, modified px-FED Recycle & use current AOH lasers  320MHz binary transmission Same FEC’s, identical TTC & ROC programming Keep LV-power supply & push more current through cables BPIX Upgrade Phase 1 (2013)

3.  1216 modules (1.6 x present BPIX)

4. Each half shell has 10 cooling loops Each supply tube feeds 5 cooling loops Angle bend (~3 0 ) during insertion taken by carbon fibre hinge Stainless steel tubes diameter = 1.8mm wall thickness = 100μm Carbon fiber hinge CO2 Cooling Loops and Connection to Supplytubes

5. PBIX mechanics 2013 in detail Carbon fiber faces Thickness: 200μm Total weight: 22.12gr. Stainless steel tube Outer diam.: 1.5mm Wall thickness: 50μm Total Weight: 9.74gr. Stainless steel bends Outer diam.: 1.8mm Wall thickness: 100μm Total weight: 1.09gr. Carbon fiber flange Thickness: 200μm Weight: 0.86gr. Airex flange filler Thickness: 4mm Weight: 0.55gr. Carbon fiber flange Thickness: 200μm Weight: 0.86gr. Weight of glue: 6.20gr Weight of modul clamps: 7.70gr. Weight of CO 2 : 7.50gr. Total weight: 59.11 gr.

6. Current Fpix module layout 7 module geometries 168 modules per disk  1080 ROCs Radial layout of (72) 2x8 outer and (44) 2x8 inner radius modules 1 module geometry 116 modules per disk  1856 ROCs R 144.6 mm R 58.7 mm R 161 mm R 39 mm Conceptual Disk Module Layout radial and  overlaps (with 20° tilt of sensors) to cover Phase 1 FPIX region

7. Total Quantity per half disk: Outer: 2X8 : 24 modules, 384 ROCs 1X8 : 24 modules, 192 ROCs Inner: 2X8: 24 modules, 384 ROCs The Complete FPIX Assembly CO 2 cooling structure Conceptual design of new blade with TPG substrate and cooling pipe

8. 10 0 20 40 Current Pixel System with Supply Tubes / Cylinders 60 80100 FPIX service cylinder BPIX supply tube DOH & AOH mother board + AOH’s Power board endflange prints Layer 3 & 1+2

9. BPIX Cabling & flexible cooling pipes

10. Shift PCB/Plug Material out of tracking Volume 10 0 20 4060 80100 FPIX service cylinder DOH & AOH mother board + AOH’s power board Modules with long pigtails (1.2m) CCA wires 16x(2x125  Move DOH & AOH boards back by 50-60cm

11. px-AOH px-DOH PLL Delay25 px-FED px-FEC crt, 40MHz fast I 2 C 40 MHz analog out trk-FEC CCU I2CI2C I2CI2C CMS Pixel System 40MHz analog optical Current System: 0-suppressed analog coded data readout at 40MHz ABAB New Phase 1 System: 0-suppressed serial binary data readout at 320MHz, same data structure 320 MHz binary 320 MHz binary optical

12. Analog readout (40MHz) serial (1 or 2 channels) Double columns in ROC blocked until read out controlled by serial readout token: TBM-ROC1-…-16-TBM analog multiplexer and line-driver in TBM BPIX module 4 x 4 ROC  TBM  AOH  pxFED A - channel B - channel skip

13. ROC TBM analog summing amplifiers A fibre B fibre Current Pixel Module Readout Layer 1& 2  2 Fibre A & B Layer 3  1 Fibre A ROC  TBM : 40 MHz analog readout TBM  pxFED : 40 MHz analog readout 40 MHz

14. Pixel uses analog coded digital pixel readout Pixel address 5 x 3 bit Pulse height 1 x 8 bit  total 23 bits/ pixel hit in 6 clock cycles chip header 1 pixel hit ub b 3 rd c 1 c 2 r 1 r 2 r 3 ph  160 Mbits/sec link speed resp. 1300 pJ/bit 8 levels = 3bits Present analog coded data transfer of pixel system

15. ROC TBM analog summing amplifiers New Serialized Binary Pixel Module Readout Layer 1 - 4  1 Fibre/module ROC  TBM : 160 MHz digital readout TBM  pxFED : 320 MHz digital readout 160 MHz 320 MHz

16. New serial binary data transfer of pixel system time 25ns 40 MHz LHC Clock 1111 XXXX101010111001101100011011 pulse heightrow/column address 1 pixel hit 150nsec long 24 bits with 160 MHz ROC header 12 bit long New ROC serial bit clock is 160MHz  4 bits / LHC clock cycle 160 MHz clock to be generated in each ROC by 40 MHz  160 MHz PLL circuit  See talk H-C. Kästli

17. MUX core ROC 160 MHz bus channel A 160 MHz bus channel B 320 MHz uplink core Token A Token B TBM Basic Idea of digital module

18. Pixel ROC 26 dcol 160 pix/each TBM-chip 4 x 4 ROC 160 MHz serial binary 320 MHz serial binary pxFED replace present ADC plug-in card with deserializer card deserializer plug in card New TBM purely digital chip no x-tra data buffering Multiplex 2 token passages Core of ROC chip unchanged but modified I/O periphery: 1) address DAC removed 2) 1 ADC for pulse height added 3) 40MHz  160MHz PLL added 160 MHz PLL 1x ADC (8-bit) 160/ 320 MHz PLL Changes for 160/320 MHz serial binary readout

19. Pixel FED HEPHY, Vienna M.Pernicka H. Steininger 3x 12 channels with 9 piggy-back ADC cards

20. Discussions with M. Pernika, M. Friedl, H. Steininger from HEPHY about replacement of ADC card with deserializer card look technically promissing.

21. Implications for the ROC Signal chain in present ROC psi46V2 Chip periphery column periphery Pixel cell

22. Address internally already digital  Remove DAC  trivial column periphery Pixel cell Implications for the ROC

23. Need to digitize pulse height information  Need fast 8 bit ADC ADC column periphery Pixel cell Implications for the ROC

24. New fast and low power output driver ADC column periphery Pixel cell Implications for the ROC

25. Output at 160MHz  Clock multiplier with PLL ADC PLL 40MHz column periphery Pixel cell Implications for the ROC

26. ADC PLL 40MHz FSM Modified logic All changes in the ROC periphery No modification of the complex and well debugged chip core (double columns)! column periphery Pixel cell

27. 8 Bit successive approximation current ADC Not pipelined  need 8 clock cycles conversion time Last year first 4 Bit prototype in 0.25  m produced and tested @ PSI Works well up to 80MHz Noise problems and non-linearity discovered Improved version resubmitted (B. Meier) Pulse Height ADC

28. Improved 8 Bit version submitted in February 09 Added sample/hold circuit at input 8 bit DAC Added capacitance to power rails Size: 640  x 90  80 MHz conversion clock  100nsec/conversion Pulse Height ADC  one per ROC B. Meier PSI

29. Some building blocks (grey) submitted in IBM 0.25  m in 4/08 Tested individual components and complete PLL with external filter / divider Works as expected from simulation, appeared very robust Locks immediately for 80/160/320 MHz output Phase-frequency detector Charge pump Loop filter Voltage controlled oscillator Clock divider Up/down current voltage Output clock Reference clock 40MHz Clock multiplier / PLL

30. Measured frequency range of 2 VCOs in 0.25  m ≈ possible target output frequencies Doesn’t fit well with simulations (not a surprise)  large margin PLL – Voltage Controlled Oscillator

31. Complete clock multiplier cell Size: 380  m x 100  m No external components, but added pads to change filter characteristics with external R/C (diagnostics) Improved design ready (Beat Meier) To be submitted in February 09 Clock multiplier / PLL

32. 4 layer system needs higher uplink bandwidth Only feasible with digital links Implementation with minimal impact on overall system Changes in present 0.25mm ROC limited to small regions in interface block No change in down link chain All new functional blocks were submitted mid February on MPW. ROC modifications planned until November 09 Changes in TBM restricted to uplink signal path. Target speed: 320 MHz Conclusion & Outlook

33. 1 st R&D Sumission of PLL, ADC & LCDS blocks on 0.25umMarch 2008 done Design of UL Barrel Mechanics Fall 2008 done 2 nd Submission of final 160 MHz PLL & 8bit ADC Feb. 2009 done Fabrication of 1 Layer prototype barrel mechanics March 2009 now Phase 1 TDR Summer 2009 Submission of digital pixel ROC (PSI46dig)Nov. 2009 Submission of new digital TBMNov. 2010 Start of module production (18 month) Spring 2011 Start of module integration onto mechanics Summer 2012 Install new 4 layer pixel detector Feb. 2013 Schedule & Crucial Dates