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RTAX-S Qualification and Reliability Data September 7-9, 2005 2005 MAPLD International Conference Minal Sawant Ravi Pragasam Solomon Wolday Ken O’Neill.

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Presentation on theme: "RTAX-S Qualification and Reliability Data September 7-9, 2005 2005 MAPLD International Conference Minal Sawant Ravi Pragasam Solomon Wolday Ken O’Neill."— Presentation transcript:

1 RTAX-S Qualification and Reliability Data September 7-9, 2005 2005 MAPLD International Conference Minal Sawant Ravi Pragasam Solomon Wolday Ken O’Neill

2 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 2 Outline  Design Overview  MIL-STD-883B  Enhanced Antifuse Qualification (EAQ)  Sample Size and Test Sequence  Results  MIL-STD-883B  Enhanced Antifuse Qualification (EAQ)  Enhanced Lot Acceptance (ELA)  Plan  Results Terminology: EAQ = ELA (both processes use the same design) Group C = High Temperature Operating Life (HTOL) = Dynamic Programmed Burn In (DPBI)

3 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 3 Design Overview  MIL-STD-883B  Uses the QBI (Qualification Burn In) design  Goal: Device Feature  Maximum Utilization of logic cells  Test all IO standards  Test all macro offering (Carry chain, buffys etc)  Test RAM feature  Test for propagation delay Note: QBI = QCMON  EAQ  Uses the EAQ design  Goal: Antifuse Reliability  Tests all possible antifuse type  Based on NASA style design  Test for delay perceptibility

4 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 4 Top Level  QBI Design  EAQ Design

5 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 5 Delay Paths  QBI includes one small delay chain  EAQ includes 8 delay chains 22 Stages: ~ 36 ns

6 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 6 Design Summary  QBI  I/O’s are configured with all the different combinations of I/O standards, slew and pull-up resistor (I/O standards LVTTL, PCI, and PCIX, LVPECL, and Vref are used)  EAQ (RTAX1000S-CG624)

7 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 7 Antifuse Utilization

8 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 8 Sample Size  QBI :  129 equivalent RTAX2000S-CQ352B devices used at 125°C  Additional 78 devices of RTAX1000S-CQ352B used for LTOL (Low Temperature Operating Life) experiment at -55°C  EAQ :  300 devices of RTAX1000S-CG624 used

9 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 9 Test Sequence  QBI : HTOL  QBI : LTOL  EAQ : AXS1  EAQ : ASX2

10 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 10 QBI Summary  QBI  For RTAX2000S (87 units) = 84 + 3 spares  For RTAX1000S (98 units) = 90 + 8 spares  7 failures were observed during the HTOL and LTOL tests

11 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 11 QBI FA Investigation & Conclusions  All the 7 failures* observed from the (QBI) devices indicated identical failure signature due to equipment induced ESD  Physical Failure analysis indicated damage to the ESD circuit  Duplication of failure mode with MM testing indicated identical failure signature  ESD zap is due to the charge buildup on the CQ352 socket lid  This charge does not exist on the CG624 package  Thus no failures observed in the EAQ experiment  No additional failures due to ESD have been observed since the use of ESD friendly and staticide treated socket lids  De-processing of a second failed device showed the same failure signature  RTAXS Passed ESD at 2000 V HBM  RTAXS Passed ESD at 250 V MM *Failure analysis report available upon request

12 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 12 EAQ Summary  EAQ  9 failures were observed during the HTOL and LTOL tests  8 Failures had identical failure signature  1* (HTOL after 1000 hrs) unit has a different failure signature  Failure Analysis under progress  Antifuse has been eliminated as a potential cause  No Antifuse failures observed  EAQ experiment will be continued for an extra 1000 hours of HTOL on a sample size of 120 units from above lot  Results expected by Mid October 2005

13 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 13 EAQ FA Investigation Conclusions  Analysis and testing showed that all 8 failures* were on the same output pin “AE16”  All 8 devices came from burn-in board locations D1 and D2  Failure analysis indicated that the damage was on the output buffer pull-down transistor  Damage was due to contention problem on the burn-in boards  The -1V on the output, with over 300 mA current, exceeded the absolute worst case condition for extended periods  No additional failures have been observed since the contention was eliminated  AXS1 completed 250 hrs of LTOL and AXS2 completed 1000 hrs of HTOL with no failures  De-processing of a second failed device showed the same failure signature * Failure analysis report available upon request

14 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 14 ELAPlan  Uses the same high perceptive design as EAQ  ELA is the EAQ design used in the production flow of RTAX-S devices  A sample of units will be tested per each wafer lot before shipment  This will qualify the lot for shipment  Units will be programmed to the ELA design  Units will be sent for 168 hours of Burn in at 125°C  100% yield is required to qualify lot for shipment

15 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 15 ELAResults  Results to date – No Antifuse failures  Shipping RTAX-S to Space Flight Applications today

16 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 16 DSCC SMD Application Status  SMD#  Pre-assigned SMD# for RTAX-S are  5962-04219 for RTAX250S  5962-04220 for RTAX1000S  5962-04221 for RTAX2000S  SMD Application  SMDs in draft  Derived from Actel datasheet  Qualification Package in preparation  Qual results, FA reports, with TRB approval minutes  Qual lots attribute sheets, copies of assembly/test/burn-in travelers  Silicon technology summary  with XSEM showing planarized process  Support documents  Submission to DSCC being planned for the end of October 2005  Certification expected by the end of 2005

17 Sawant, Wolday, Pragasam, O’NeillRTAX-S Qualification and Reliability Data MAPLD 2005 - # 1032 17 Conclusion  NO ANTIFUSE FAILURES  More than 650,000 hours of test data available now  MIL-STD-883B Qualification completed successfully  EAQ experiment completed successfully  150 units with 1000 hours of HTOL and 250 hours of LTOL  150 units with 250 hours of LTOL and 1000 hours of HTOL  Shipping RTAX-S to Space Flight Applications today  Both “B” & “E” flows shipping

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