1. ISS Interlock Demand Planning Update
Foxconn
March 2009

2. Key Messages Volumes by Qtr: cycle over cycle changes
2FQ Quarterly Progress
Additional Topics:
AMD G6: DL385, BL495c, DL165
LVOs/Upsides
Lucky Falls (SE1210): +200 in Apr (850), +500 in May (1000)
T2 launching 6/2 but supply chain ready 4/27
Aligning launch to “ProLiant SL” launch w/ Spartan
Potential deals in May
Spartan Overview
Back up: Mar Interlock Volumes

3. AMD G6 DL385 / BL495c / DL165
New gen which is really a processor “speed bump”
AMD Istanbul
Processor “drop-in”
Marketing branding “G6” to align to rest of G6 portfolio
Recent development
Targeting June/July launches
July HE, or “high efficiency” processors
Same chassis, PCA as G5
No need to drive traditional G6 “transition risk volume” on Mod1/Mod0’s

4. Spartan Overview
“ProLiant SL” new ProLiant product line: Scalable Line
PCA’s in 1U trays, in 2U shelf (enclosure)
Naming
Product Line: SL6000
Product Families:
HP ProLiant SL170z G6: 1 T2 PCA per tray
HP ProLiant SL2x170z G6: 2 T2 PCA’s per tray
HP ProLiant SL160z G6: 1 DL160 G6 PCA per tray
Expected demand mix:
Potential demand spikes, SCI
Combined “ProLiant SL” Launch with T2 June 2nd

5. ProLiant Product Line GroupsDL ML BL
SL – category
DL100
DL300
DL500
ML100
ML300
ProLiant Blades
Integrity Blades
Storage Blades
Enclosures
Networking
Etc.
SL1000 family
SL6000
SL100 Servers
Big series
SL300 Servers
Etc.
Etc.
Etc.
SL320
SL170
Series
Only 1 at launch
SL160
Etc. 5
23 April 2017
HP Confidential

6. 2U Shelf/Enclosure Features: Support for (2) 2P (socket) server trays
Shared Fans, High Efficiency, N+1 Redundancy
2U Shared Power
Support for 460W, 750W, or 1200W AC configurations
Full Hot Plug RPS, or ebrake RPS support
Multi-node Efficiency
Shared fan control
Power capping & measurement
Optional interface to Rack Control Unit
HP 10k G2 rack optimization
Bulk 10U rail system for lowest cost
3rd Party rack support
Supports common DL100 rail
High efficiency (92%) common slot power supplies
Server Trays
High efficiency N+1 Redundant Fans
23 April 2017

7. HP ProLiant SL (1 EATX in 1U)
HP ProLiant SL160z
HP ProLiant SL (1 EATX in 1U)
Processor
Chipset
2P Intel
Intel® 5520 Chipset
Memory
18 DDR3 DIMM Sockets
Storage
HP Embedded SATA controller w/RAID
Up to 2 NHP LFF HDDs
Networking
Embedded Dual Port 1GbE NICs
I/O Expansion
1 x16 FH PCIe slot
Management
Standards based DCMI & IPMI
Basic Functionality, node-level power on/off
Additional Features
High 50%+ load
Hot Plug, N+1 PSU (optional)
Density
2 server nodes in 2U
1 EATX nodes in 1U tray
Tylersburg chipset
1 x24 PCIe slot

8. HP ProLiant SL 2 in 1U (per node)
HP ProLiant SL2x170z
HP ProLiant SL 2 in 1U (per node)
Processor
Chipset
2P Intel
Intel® 5520 Chipset
Memory
16 DDR3 DIMM Sockets
Storage
HP Embedded SATA controller w/RAID
1 NHP LFF HDDs (2 in tray, 1 per node)
Networking
Embedded Dual Port 1GbE NICs
I/O Expansion
1 x16 LP PCIe slot
Management
Standards based DCMI & IPMI
Basic Functionality, node-level power on/off
Additional Features
High 50%+ load
Hot Plug, N+1 PSU (optional)
Density
4 server nodes in 2U
2 half-EATX nodes in 1U tray
Tylersburg chipset
1 x24 PCIe slot

9. HP ProLiant SL (per node specs)
HP ProLiant SL170z
HP ProLiant SL (per node specs)
Processor
Chipset
2P Intel
Intel® 5520 Chipset
Memory
16 DDR3 DIMM Sockets
Storage
HP Embedded SATA controller w/RAID
Up to 6 NHP LFF HDDs
Networking
Embedded Dual Port 1GbE NICs
I/O Expansion
1 x16 LP PCIe slot
Management
Standards based DCMI & IPMI
Basic Functionality, node-level power on/off
Additional Features
High 50%+ load
Hot Plug, N+1 PSU (optional)
Density
2 server nodes in 2U chassis
1 ea, EATX PCAs in 1U module

10. Spartan Rack Integration
Node Serviceability
Front View
Rear View
Cable channel
Optional Hot Plug Redundant PS

11. Quarterly Volumes Gaining T2 and Spartan, 3FQ
Upcoming Foxconn portfolio changes:
Gaining T2 and Spartan, 3FQ
Losing BL460c after G1, DL160/DL180 after G5

12. 2FQ Progress - WW
“Foxconn Total” includes G6 products.

13. 2FQ Progress - EMEA
“Foxconn Total” includes G6 products.

14. 2FQ Progress - APJ
“Foxconn Total” includes G6 products.

15. 2FQ Progress - AM
“Foxconn Total” includes G6 products.

16. Interlock Demand Volumes (Published on 3/5/09)
Back up
Interlock Demand Volumes
(Published on 3/5/09)

17. Interlock Volumes - WW
23 April 2017

18. Interlock Volumes - AM
23 April 2017

19. Interlock Volumes - EMEA
23 April 2017

20. Interlock Volumes - APJ
23 April 2017

21. ISS Historical Trends - unit ships/qtr
Instability in market
Where are we in downturn?
Opportunity for market leadership
Market slowdown, with some areas showing accelerated growth
G6 driven uptick?
January Plan
February Plan

22. ISS Server Planning Scenarios
Low plan (green line) communicated to ODM’s 2/6, regional plan (blue line) remained higher
Regions have since aligned to Q2
Some of Q3 and Q4 aligned, continued tie-outs with the regions
Key Message: continue to execute to interlock

23. Revised Demand Planning Interlock Volume Process
Action taken week of 2/2 to reduce overall plan by approx 7-8% for Q2
Top down volume planning (GBU)
Bottom up product mix planning (regions)
Tie out process
Transition Planning
Marketing
Pricing
Regions
Generate LCVF
Publish interlock volumes
Detailed product line tie out with regions week of 2/16
Bottom-up planning is difficult to coordinate because many different assumptions may be made across multiple groups/individuals. For example, there may be conflicting ideas across planners and/or regions about growth rates across businesses and overall rate of recessional decline, making the establishment of a consistent and integrated plan challenging.