1. LHCf Arm2 – status of hardware upgrade in Firenze Lorenzo Bonechi 20 December 2013

2. Main points for the work in Firenze Assembling of new silicon  -strip detectors – New silicon wire bonding scheme to reduce the saturation effect in the front-end electronics for high energy releases with respect to the original scheme – 8 sensors are available (8 needed) One recovered from a test plane Testing the new hybrid boards – 2 types (Left and Right) – Not enough electronics components for the complete replacement of the old hybrids – 7+7 under test (8+8 needed) – Some faults found Modification of the manipulators – We must increase the speed to decrease the time that is necessary to go from the GARAGE position to the RUNNING position and vice versa 2

3. The idea for the new silicon planes 3 Readout Floating 80  m implant pitch 160  m readout pitch Silicon sensor In the original scheme one strip over two was connected to the front-end electronics and the other strips were floating. Silicon sensor Readout GND OLD Loosing some part of the released energy

4. Assembling of new silicon planes 4 Gluing of NEW type hybrid circuits to old type kapton fanout Gluing of silicon layers to the NEW kapton fanout (with GND pads for charge loss)  -strip fanout Bias pad (to be connected to the silicon back-plane)

5. Glue deposition on the new kapton fanout cable 5 Y-side Thin layer of siliconic glue (not hard) Electrically-conductive (Ag) glue deposited on a bent strip of golden kapton film for sensor biasing Thin layer of kapton tape for insulation GND large pad Plane with vacuum system

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9. 9 X-side

10. Gluing X-side silicon+kapton fanout to the thin (0.5 mm) aluminum layer 10 ARALDITE 2011 Epoxy glue

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12. Wire bonding at the Delvotec machine 12

13. 13 Wire bonding at the Delvotec machine

14. 14 Wire bonding at the Delvotec machine Mirko Brianzi INFN-Fi technician

15. Wire bonding on the first layer has been completed yesterday afternoon I will continue the assembling after testing the first layer – We can test for pedestals and noise – Do we test also with laser? 15

16. Test of the new hybrid circuits 7 (Left) + 7 (Right) boards have been mounted by an external company – not enough electronics devices to produce 8+8 Successful testing for 10 boards – 1 board has a problem on one PACE3 chip – 3 boards have shorted power lines The 4 faulty boards have been delivered to the company for a x-ray check – There should be some news within today… 16

17. Pedestals and noise on a good board 17 ADCs Strip number ADCs PEDESTALS SIGMAS

18. 1 PACE3 chip with some problems? 18 ADCs Strip number ADCs PEDESTALS SIGMAS

19. Modification of the manipulators 19 Only one manipulator has been modified and tested (two days ago). The modification was necessary because the beam dumping procedure in 2013 went faster than in 2010. It lasted about 5 min. So the target of this modification was 5 min for 12 cm movement (from the operation position to the garage position it took about 12min before the modification) (email by Menjo) Replacement of the gear box (decreased the gear ratio from 30 to 12.5) Test with 20.7 kg weight was successfull. Final vertical speed: 12 cm / 4 min Power consumption is well below the limits of the engine

20. Conclusions MERRY CHRISTMAS !!! 20