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New Super Bubbler Advantages of Using NMS Super Bubbler-3 (Electrostatic discharge system) Nomura Micro Science Co.,Ltd. Sept. 1998.

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Presentation on theme: "New Super Bubbler Advantages of Using NMS Super Bubbler-3 (Electrostatic discharge system) Nomura Micro Science Co.,Ltd. Sept. 1998."— Presentation transcript:

1 New Super Bubbler Advantages of Using NMS Super Bubbler-3 (Electrostatic discharge system) Nomura Micro Science Co.,Ltd. Sept. 1998

2 Where is Super Bubbler used? Q:Where is Super Bubbler used ? A:Mainly Super Bubbler is used at the dicing process of assembly plant in the semiconductor manufacturing. Nowadays, over 300 Super Bubblers (including Super Bubbler1, 2) are used in the world.

3 What for? Q:What is Super Bubbler-3 used for? 1.To remove Electrostatic Harms caused by rinse water(ultra pure DI water) at the dicing process. 2.To prevent small bits or particles of cutting from sticking to the wafer surface caused by electrostatic attraction at the dicing process.

4 Electrostatic Harms? 1. The charged Static Electricity in ultra pure water has high voltage, which causes a breakage of the devices very easily. causes a breakage of the devices very easily. 2. Electrostatic attraction causes swarf (Small bits at cutting) sticking to the wafer surface at the dicing process.

5 Why is it charged ? Why is it charged ? Q:Why Static Electricity is charged ? A:Recently, the pressure of cleaning water(ultra pure water) at the dicing process is getting higher and also it has high resistivity(18.24MOC). Therefore the Static Electricity would be charged easily by high friction of high resistivity water and objects.

6 How to solve ? Q:How to solve this problem? A:To discharge the built up Static Electricity by CO 2 gas injection to pure DI water. By CO 2 gas injection, the pure DI water is re-ionized and the charged Static Electricity is discharged immediately.

7 Standard Resistivity? Standard resistivity for the dicing process is given below.Standard resistivity for the dicing process is given below. (For semiconductor assembly plant) (For semiconductor assembly plant) 1.0~0.3 MOC 1.0~0.3 MOC More than 1.0 MOC is not effective.More than 1.0 MOC is not effective. Less than 0.3MOC changes PH of water too low. Low PH water makes dicing blade life shorter.Less than 0.3MOC changes PH of water too low. Low PH water makes dicing blade life shorter.

8 Needs of Users Needs of users at dicing process are as follows.Needs of users at dicing process are as follows. 1.Inlet water pressure is high. more than 0.4MPa more than 0.4MPa 2.Low running cost. 3.Easy operation and no maintenance. 4.No contamination to wafer or process.

9 Comparison of NMS Super Bubbler-3 and Meg-con

10 Advantages of NMS Super Bubbler-3 Compared with Meg-con

11 More information about Super Bubbler ’s Advantages(Proposal of Simple System) In case of Bubbler3, it is able to make a Dicing System more simply. Because it is able to supply pure DI water into the dicing machine directly. But in case of Meg-con, it needs a extra Booster pump.In case of Bubbler3, it is able to make a Dicing System more simply. Because it is able to supply pure DI water into the dicing machine directly. But in case of Meg-con, it needs a extra Booster pump. Dicing Machine SuperBubbler From Pure DI Water Making System Available Water Pressure 0.4~0.5MPa Case of Super Bubbler-3 Dicing Machine BoosterPump Meg-con Raised up to 0.4~0.5MPa From Pure DI Water Making System Need of Under 0.35MPa Case of Meg-con Water Pressure 0.4~0.5MPa Max. inlet press. 0.5 MPa Max. inlet press. 0.35 MPa


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