1. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Ann Arbor, MI January, 2001 Michael McCorquodale General Manager and Manager of MEMS Development Solid State Electronics Laboratory Center for Wireless Integrated Microsystems Department of Electrical Engineering and Computer Science University of Michigan Ann Arbor, Michigan 48109-2122 mmccorq@eecs.umich.edu (313) 205-3489

2. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation The Purpose of Mobius Mobius Integrated Systems Utilizes Emerging and Available Technology to Deliver True System-On-A-Chip Solutions to the Embedded Systems Market The Automobile Instrumentation Cluster (AIC) is an example of an embedded system: Inside the car, a system senses speed, rpms, etc. and then actuates gauges depending on specific calculations made on the acquired data What is an embedded system?

3. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Components of Embedded Systems and Current Implementation So what’s the problem?  Packaging costs high  Power too high  Size too large  Engineering resources spent designing board  Functionality low  Applications limited Antenna Microprocessor Wireless Interface Frequency Reference Sensor/Actuator Interface Sensor Actuator Quartz Crystal Resonator (Frequency Reference) Sensor/Actuator Interface Wireless Interface Board Level Implementation Microprocessor Sensors/Actuators

4. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation The Mobius Solution Single Chip Implementation (SOC) Mobius Antenna Microprocessor Wireless Interface Frequency Reference Sensor/Actuator Interface Sensor Actuator Quartz Crystal Resonator (Frequency Reference) Sensor/Actuator Interface Wireless Interface Board Level Implementation Microprocessor Sensors/Actuators

5. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Realizing The Mobius Solution SOC Implementation Packaging costs reduced: Fewer Circuits Power reduced: Less Input/Output Size Reduced: Fewer Circuits, Fewer Pins Less Engineering resources on board: Simpler System Possibilities for increased functionality Possibilities for new applications Single Chip Implementation or System-On-a-Chip (SOC) How is it Done? Integrating existing technology: RF + Analog + Digital New application in existing technology: Si Wireless Utilizing emerging technology: MEMS Support Emerging Standards: Bluetooth Vision: SOC solutions require competency in all technologies True-System-On-a-Chip Recognizing MEMS as an enabling technology

6. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation SOC Market System-On-A-Chip (SOC) Market: –Total Available Market: Currently $5 Billion –Projected to be $17 Billion by 2002 –Currently SOC 30% of Integrated Circuit (IC) Market –Projected to be 70% of IC Market by 2003 Potential Markets –Initial Target Segment: Automotive Electronics –Scaling in Additional Markets: biomedical, environmental monitoring, industrial, manufacturing, communications, wireless, instrumentation, and testing

7. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation The Mobius Team Founders Michael McCorquodale –General Manager and Manager of MEMS Development –PhD Candidate: Wireless IC and MEMS Research –ASIC Development with Hughes Space and Communications Matt Guthaus –Manager of Digital Circuit Development –PhD Candidate: Low-Power Microarchitecture Research –Microcontroller Development with National Semiconductor Keith Kraver –Manager of Analog Circuit Development –PhD Candidate: Low-Power, Low-Voltage, Mixed-Signal IC Research –Analog Circuit Development with National Semiconductor Dr. Richard Brown –Technical Advisor –Associate Chair Electrical Engineering Division, University of Michigan

8. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Strengths and Weaknesses Strengths Strong Technical Foundation Top PhD Students, Top Faculty, Top Institutions, Top Research Interdisciplinary Group and Innovative Approach to TSOC Development Vision: Recognizing Emerging Technology, Leveraging Knowledge of Existing Technology Hustle: Young, Motivated, Experienced Team, Well Recognized Weaknesses Formal Business Experience Solution: Recruited 6 Top Michigan MBA Students for Business Plan Development This Term Strong Competitors: Established Semiconductor Companies Solution: Competitors Must Retool, Competitors Must Combine Disparate Resources, New Org Structure for TSOC Development

9. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Funding and Timeline Capital Sought $10MM First Round for Initial Product Delivery Expenditures Core Development, Management, Sales Team Office Space, Computer Hardware, Software, CAD Tools Manufacturing and Testing Development Phases 1 st Six Months: Specification and System Analysis, Establish Relationships with Embedded System Companies Next Year: Product Development, ASIC Electronic Designs Become Available, MARKETING & SALES Next Six Months: Product Fabrication, Test, Initial Offering

10. M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Why Invest in Mobius? Strong, Scalable, Needed Technology with Significant Added Value Motivated, Experienced, Talented Team Tremendously Expanding Market Applications in Broad Spectrum of Markets Opportunity to Capitalize on Emerging Applications First Mover Opportunity Current Strategy Full Business Plan Development in Progress: Due Diligence Seeking Start-Up Capital From Angel Investors and Venture Capitalists Looking for Investors to Fill Gaps: Management, Partnerships, etc. Assembling Advisory Board Specifying Initial Product Offerings