1. HCCB TBM Mechanical Design R. Hunt, A. Ying, M. Abdou Fusion Science & Technology Center University of California Los Angeles May 11, 2006 Presented by Ryan Hunt

2. May 11, 2006UCLA Fusion Science & Technology Center2 Overview Allocated ½ Port Allocated ½ Port Design Requirements Design Requirements Description of HCCB Subcomponents Description of HCCB Subcomponents Overall He Flow Routing Scheme Overall He Flow Routing Scheme Assembly Process Assembly Process Manufacturing Requirements Manufacturing Requirements Figure 1

3. May 11, 2006UCLA Fusion Science & Technology Center3 U.S. Submodule within ½ Port Figure 2

4. May 11, 2006UCLA Fusion Science & Technology Center4 TBM Design Requirements Overall size must fit within available space (51cm x 38.9cm x 71cm) Overall size must fit within available space (51cm x 38.9cm x 71cm) He must cool first wall to acceptable temperatures He must cool first wall to acceptable temperatures He must cool breeding zones He must cool breeding zones All cooling plates & manifolds must satisfy stress criteria All cooling plates & manifolds must satisfy stress criteria Helium channels (for both FW and cooling channels) must be economically fabricable Helium channels (for both FW and cooling channels) must be economically fabricable Must house appropriate amounts of breeder and beryllium multiplier Must house appropriate amounts of breeder and beryllium multiplier Back wall must align with JA Submodules into common ½ port back wall manifold Back wall must align with JA Submodules into common ½ port back wall manifold Must ensure survival of structural box under accidental conditions (TBD) Must ensure survival of structural box under accidental conditions (TBD)

5. May 11, 2006UCLA Fusion Science & Technology Center5 Connection to Port Frame Back Shield Opening Space of 1248 x 750mm is available (minus 20mm between TBM and frame on each side for TBM grasping) Opening Space of 1248 x 750mm is available (minus 20mm between TBM and frame on each side for TBM grasping) 3 Large Pipe Openings, 1 medium (instrumentation), 7 small openings 3 Large Pipe Openings, 1 medium (instrumentation), 7 small openings Piping must also avoid allotted space for structural attachment keys Piping must also avoid allotted space for structural attachment keys Optimization of pipe connections and communication with IT and JA Optimization of pipe connections and communication with IT and JA 750 1248 Figure 3: Front view of port frame back shieldFigure 4: Back view of half-port TBM

6. May 11, 2006UCLA Fusion Science & Technology Center6 Common Back Wall Manifold Assembly Serves to collect and combine pipes from each Submodule Serves to collect and combine pipes from each Submodule Collaboration with JA for acceptable design/solution Collaboration with JA for acceptable design/solution System of internal manifolds System of internal manifolds Keys will be too long if pipes are combined behind manifold (problems with torque) Keys will be too long if pipes are combined behind manifold (problems with torque) Accepts from each Submodule: Accepts from each Submodule: 3 He coolant lines (inlet, outlet, & bypass) 2 Gas Purge Lines 1 to 2 instrumentation conduits ( = 6 to 7 lines total from each Submodule) Allowed: Allowed: 3 Large Penetrations allocated to 3 main helium coolant lines 7 small penetrations 3 of 7 for purge gas outlet lines (one for each Submodule) for tritium concentration measurement 3 of 7 for purge gas inlet lines to accommodate different gas compositions for tritium (1 small penetration and 1 medium remaining for instrumentation) Figure 5

7. May 11, 2006UCLA Fusion Science & Technology Center7 Overview of HCCB Sub-components First Wall Panel First Wall Panel Breeder & He Channels Breeder & He Channels Internal Cooling Manifolds Internal Cooling Manifolds Beryllium Zones Beryllium Zones Top & Bottom Walls Top & Bottom Walls Back Plates and FW He manifolds for inlet & outlet Back Plates and FW He manifolds for inlet & outlet Figure 6

8. May 11, 2006UCLA Fusion Science & Technology Center8 Flow Diagram Summary

9. May 11, 2006UCLA Fusion Science & Technology Center9 U.S. Planning for RAFM Steel Fabrication Technology Development for ITER TBM Four Parallel lines of technological development planned: Four Parallel lines of technological development planned: 1. Square tube manufacturing and bending to produce first- wall. 2. Hot Isostatic Pressing (HIP) technology to join square tubes to form the first wall, and the fabrication of other elements such as internal cooling plates and manifolds. 3. Investment casting as an alternative to HIP.  Reduces the need for extensive joining operations.  Reduces the amount of NDE needed (fewer joints).  Potentially less expensive than other fabrication methods.  Complex castings of 9-10 Cr steels have been produced with mechanical properties similar to those of wrought products. 4. Electron-beam, laser welding, and possibly other techniques to join internal cooling plates and manifolds to the first-wall structure.

10. May 11, 2006UCLA Fusion Science & Technology Center10 First Wall Panel Utilize 3 pass snaking system to distribute He Utilize 3 pass snaking system to distribute He Turns in the snake achieved in back plates Turns in the snake achieved in back plates Stack 16 Paths (as below) to constitute first wall Stack 16 Paths (as below) to constitute first wall Figure 7 Figure 8

11. May 11, 2006UCLA Fusion Science & Technology Center11 First Wall Fabrication Two Methods Two Methods 1. Components of first wall are bent into U-shape before assembly, and are then pressed between two metal plates and joined with HIPPING process  Sealing welds must be made at ends and along pipe path (likely must be done prior to giving to a manufacturing co.) 2. Two thicker plates each with desired half-channels milled out. Pressed and joined with HIPPING process, and finally bent into U-shape of first wall  Much more machining  Have had inaccurate channel dimensions (at corners) when bending occurs after welding

12. May 11, 2006UCLA Fusion Science & Technology Center12 Back Plates System of three metal Plates: System of three metal Plates: 1. 5mm plate to direct inlet flow to first wall and outlet flow to outlet. 2. 20mm plate attached via HIP weld (alternatively have both as one thick plate ~25mm)  Once attached, sections are milled to create flow conduits  Alternatively could use investment casting to form flow conduits  Creates inlets/U-turns/outlets for the FW 3 pass snake concept  necessitates accurate welding to match back plate with each first wall path 3. 5mm cover with holes for inlet/outlet Figure 9

13. May 11, 2006UCLA Fusion Science & Technology Center13 Internal View of a FW Segment 1 of 16 Paths of First Wall (3 passes) Back Plates (Milled section) Figure 10: (6mm Shaved off side of Submodule to achieve the above cut view) U-Turn He Inlet Welding Plane

14. May 11, 2006UCLA Fusion Science & Technology Center14 Breeder Zone Cooling Plates Necessary Dimensions dictate geometry Necessary Dimensions dictate geometry (top/bottom of multiplier, breeder) (top/bottom of multiplier, breeder) Designed as two snakes starting from sides and interweaving Designed as two snakes starting from sides and interweaving Alternate Method contains 1 pass for simpler manifolds Alternate Method contains 1 pass for simpler manifolds Much cooler on one side than the other Much cooler on one side than the other Uneven breeder cooling Uneven breeder cooling Thermal expansion problems Thermal expansion problems Figure 11

15. May 11, 2006UCLA Fusion Science & Technology Center15 Breeder Coolant Channel Fabrication Difficult as geometry is much more complex. Difficult as geometry is much more complex. Options available: Options available: 1. Half Plates joined by Hipping. Manufactured either through: 1. milling and bending, or 2. Investment casting 2. 1mm square tubes stacked and HIPPED between 0.5mm plates 3. Entire model is cast, no HIPPING is involved. Figure 12: Example of Outer Half of Coolant Channels

16. May 11, 2006UCLA Fusion Science & Technology Center16 Internal Manifolds Allows double snake design to occur Allows double snake design to occur Green diverts flow from top & bottom walls Orange transfers flow from one pass to the next 4 vertically & horizontally compartmented sections (TBD) Blue is outlet collector Tan tubes distribute flow poloidally to all parallel channels Uneven coolant flow will make manifold design challenging Uneven coolant flow will make manifold design challenging Figure 13

17. May 11, 2006UCLA Fusion Science & Technology Center17 Top Wall Accepts flow from first wall at center via back plates Accepts flow from first wall at center via back plates Outlets to breeder zone Outlets to breeder zone Number of passes and channel size Number of passes and channel size TBD as it is highly dependent on mass flow rate vs. amount of necessary cooling of wall TBD as it is highly dependent on mass flow rate vs. amount of necessary cooling of wall Thickness of wall Thickness of wall TBD based on stress analysis and deformation of wall TBD based on stress analysis and deformation of wall Manufactured in similar fashion as back plates Manufactured in similar fashion as back plates Figure 14

18. May 11, 2006UCLA Fusion Science & Technology Center18 Assembly Process Problems with welding accessibility? Problems with welding accessibility? Figure 15

19. May 11, 2006UCLA Fusion Science & Technology Center19 Obstacles to Overcome Thin walled members could have high deformation under thermal expansion (tolerance) Thin walled members could have high deformation under thermal expansion (tolerance) Future stress analyses will tell what thicknesses and supports will be necessary. Future stress analyses will tell what thicknesses and supports will be necessary. Very small He channels (with thin walls) are hard to manufacture Very small He channels (with thin walls) are hard to manufacture Need to decide manufacturing strategy of coolant channels and first wall channels so more detailed design can begin. Need to decide manufacturing strategy of coolant channels and first wall channels so more detailed design can begin. Parallel flow Parallel flow Need system of baffles, buffers, and diverters to assure equal flow to all channels in Poloidal direction. Need system of baffles, buffers, and diverters to assure equal flow to all channels in Poloidal direction. Attachments to Port Frame Back Shield Attachments to Port Frame Back Shield Limitation on number of pipes from Submodule means coordinated effort with JA to combine each pipe system from 3 in to 1 Limitation on number of pipes from Submodule means coordinated effort with JA to combine each pipe system from 3 in to 1 i.e. each Submodule has 1 He outlet pipe = 3 total for ½ Port. Needs to be combined into a single common pipe. i.e. each Submodule has 1 He outlet pipe = 3 total for ½ Port. Needs to be combined into a single common pipe.

20. Questions or Comments?