3. Richard Hansen

4. Micro-electro-mechanical Systems (MEMS) Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion

5. MEMS Fabrication Processes DRIE Deep reactive-ion etching LIGA Lithographie, Galvanoformung, Abformung (Lithography, Electroplating, and Molding) Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion

6. Carbon-Nanotube-Templated Microfabrication Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion

7. Carbon-Nanotube-Templated Microfabrication Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion

8. CVI Using Metal Carbonyl Precursors Heating Electrodes Metal Carbonyl CNT SampleCartridge Heater Gas Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion

9. High Tensile Stress in Deposited Metal Film 1 mm Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion

10. Extent of Infiltration Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion 200 μm 1 μm

11. Structure of Metal film in CNT composite materials The metal oxycarbide puts metal atoms in an FCC structure with C or O at their octahedral sites (Lattice constant of about 4.16 Å) TEM AnalysisPowder Diffraction Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion

12. Materials Properties of CNT composite materials Cantilever Setup Young’s Modulus on the order of 10 GPa 4-Point Probe Setup via the Van der Pauw Method Resistivity on the order of 100 μΩ  m Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion

13.  Versatile Process  High-Aspect-Ratio  Materials Properties Dominated By Filler Material Motivation CNT-M CVI Process CVI Challenges Materials Properties Conclusion