1. Presented By : LAHSAINI Achraf & MAKARA Felipe

2.  Introduction  Difficult Challenges : > Difficult Challenges between 2013 – 2020 > Difficult Challenges beyond 2020  Technology Requirements > Capabilities and Accuracy Requirements  Reliability Modeling  Robustness, Manufacturability & Yield  Numerical methods & Interoperability  Potential Solutions  Cross-Cut issues

3. Introduction Material, Reliability, Active devices and Interconnects issues are becoming more and more important in all processes. Design robutness and manufacturing are affected by all areas simulated. Modeling Goal : > Support technology development and Optimization > Reduce development times and costs

4. Difficult Challenges : Difficult Challenges between 2013 - 2020 Modeling and Simulation requirements must be set in time. Physical effects interact with each other and must be separated.  Equipement Scale Modeling  Lithography Modeling  Compact Modeling  Package Modeling  Numericable Methods  Materials Modeling  Reliability Modeling  Robustness Modeling   Front End Process Modeling  Device Modeling  Interconnects and Integrated Passive Models

5. Difficult Challenges Beyond 2020 Modeling of chemical,thermoelectrical and electrical properties of new materials. Nano-Scale Modeling for Emerging Research Devices and Interconnects. Open common data set for all physical data relevant for modeling.

6. Technology Requirements : Lithography Modeling : > Optical image Modeling > Electromagnetic Scattering Analysis > Direct Pattering Techniques > Resist Modeling > Integrated Modeling Systems > Coupling of Metrology and Modeling

7. Device Modeling : > Contact Resistance > 3D Modeling > Dopant, geometric and structural fluctuations > CMOS Scaling > Modeling requirements for novel devices

8. Materials Modeling : > Material Properties Database > Datamining > Required Parameters > Materials Models

9. Package Simulation : > Increasing pin counts and size contraints result in exprensive Packages. > Required integrated electrical, thermal and mechanical simulations. > Package must meer demanding requirements.

10. Reliability Modeling Study and prediction of the failures Device faults Bias Temperature Instability (BTI) Hot Carrier Injection (HCI) Random Telegraph Signals (RTS) Eletrostatic Discharge (ESD) Memories malfunction (volatile and non-volatile) Interconnection faults ISO26262 - failure rate for automotive devices

11. Robustness, Manufacturability & Yield Design CI’s that are not affected by production variations Systematic (lithography, proximity...) or Random Need to simulate variations on all transistors fast Gb memories (bit failure around 10 -18 ) Implementation of suggested DR Estimate the whole circuit performance Multi-physics modeling Heat, mechanical...

12. Numerical methods & Interoperability Calculate fast and in every case Developing of algorithms for calculations 3-dimentional computing Montecarlo simulations (or another stochastic sim.) Rethink the linear solvers Implementation on multicore CPUs Interoperability: use tools from every vendor

13. Potential Solutions Increase cross-discipline efforts Adequate resources for research Evaluate the simulation benefits Share of the information Simulation tools for equipements Integration of simulators

14. Cross-cut issues Design/System drivers Manufacturability; impact of parasitics and fluctuations on doping... Test and Test Equipment Simulation is needed for tests equipment; defect detection; simulation of the stress on the testing... Process Integration, Devices & Structures Reability of a new gamma of materials and technologies (Ge, III/V, carbon nanotubes, interconnections...)

15. Cross-Cut issues Emerging Research Devices Extension of the scope of the simulation is needed, as well as standardisation of new devices simulation Emerging Research Materials Increase in the number of materials; decrease in the size; Simulation may not be possible yet Radio Frequency for Communications Simulation of components and interaction; SoC/SiP; 3D eletromagnetic; compact models; Heat...

16. Cross-Cut issues Front-end processes Modelisation of the processes, performances, variability and defects Lithography Push the optical and extreme ultraviolet to its limit; Model for non ideal masks, lenses...; Prediction of the photoresists behavior; Mechanical, thermal and fluidic simulations

17. Cross-Cut issues Interconnect Models are based on RC/RLC; Process variations; “3D” integration; electro-thermal-mechanical... Factory Integration Physical processes during device fabrication; Increasing the yield throught simulation Assembly and packaging Mechanical/Electrical/Thermal/Reability(...); Stacked die; Materials; Soldering;

18. Cross-Cut issues Environment, Safety and Health Resource, chemicals, cleaning reduction to minimum; Better understanding of the processes Yield Enhancement Metrology Bi-directional links (one needs the other) MEMS Sim. already mentioned + stress, flows, materials...

19. Thank you for your attention