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Published byMadeline McGregor Modified over 11 years ago
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4/8/2002, Monday Scientists
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Interfacial Fracture
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Interfacial Fracture (Scientists) J.W. Hutchinson J.R. Rice Z. Suo
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Complex Singular Stress Field
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Stress Oscillation Mode Mixty
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Electronic Packaging
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MEMS Packaging MicroElectroMechanical Systems
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Processing Very Small Peripheral Array (VSPA)
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Thin Film Nix
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Thin Film Technology
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Thin Film Processing
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Film Growth Zuqiang Qi Bo Shi
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Electroceramics Z. Suo
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Damage Mechanics Jean-Louis Chaboche Voyiadjis, G.Z. and Robert Dorgan Gradient formulation in coupled damage-plasticity Archives of Mechanics, 53, 565-597
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Composite Toughness EFFECTS OF PULL-OUT ON THE MECHANICAL- PROPERTIES OF CERAMIC-MATRIX COMPOSITES THOULESS MD, EVANS AG ACTA METALLURGICA, 36 (3): 517-522, 1988
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Fiber Pull-out Amol Jadhav
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