1. M.Oriunno, SLAC Stave cable and module options

2. M.Oriunno, SLAC Background - module The IBL electrical unit for data output is a single chip The use of the term “module” can be confusing when talking about IBL The stave cable only knows about single chips The number of chips per sensor depends on sensor technology  For 3D sensors we assume single chip sensors with active edges  For planar sensors we assume multi-chip tiles: 3 chips per tile if 4” sensor wafers 4 chips per tile if 6” sensor wafers  The cable DOES NOT CARE about the sensor, only the chips.

3. M.Oriunno, SLAC The stave cable Options for a stave flex cable have been proposed for a “traditional” single-width stave  Cable on top of modules  Cable on back of stave with wrap-around pigtail (similar to present staves, but flex cable instead of wire bundle)‏  Flying cable: cable “in the air” next to the stave All these options have difficult problems for assembly feasibility A bi-stave layout can provide an easier and reliable alternative

4. M.Oriunno, SLAC Cables cross section

5. M.Oriunno, SLAC Castellated bi-stave layout (bi-tube) Connectors out of envelop

6. M.Oriunno, SLAC Castellated bi-stave layout (bi-tube)

7. M.Oriunno, SLAC Castellated bi-stave layout (single tube) Diving EoS region Two tubes merged in a single one

8. M.Oriunno, SLAC Castellated bi-stave layout (single tube)

9. M.Oriunno, SLAC Cable design

10. M.Oriunno, SLAC Turbine single stave Need sharp bending radius Limited in width

11. M.Oriunno, SLAC Turbine single stave

12. M.Oriunno, SLAC Inverted Turbine single stave No need of sharp bending radius Connector directly on the thick kapton in the EoS region Limited in width

13. M.Oriunno, SLAC Inverted Turbine single stave

14. M.Oriunno, SLAC 14 FE-I3 active edge prototype 3D Stave Prototype Motivation: –Replacement/upgrade is converging towards stave design –Make a prototype to discover possible pitfalls Cooling Flex hybrid Power Assembly –Use learning from first prototype to make progress toward a final module with FE- I4 One row with up to 16 FE-I3 bump bonded to 3D sensor Individual connection using flex cable Cooling/support carbon structure http://indico.cern.ch/conferenceDisplay.py?confId=52370

15. M.Oriunno, SLAC 15 FE-I3 active edge prototype Flex Cable Use one cable to interface to 4 FE-I3 ASICs Stack them on bottom side of stave Critical parameter will be bending radius (see next slide) and routing density Will be routed in 2 layers in the bending part Layout finished! http://indico.cern.ch/conferenceDisplay.py?confId=52370 See Erlend Bolle ‘s talk

16. M.Oriunno, SLAC IBL EOS Services IBL – 84 cm EOS Shrink & surgical Tubing EOS with HRS Connectors & 0-80 Screws – 10 cm See Dave Nelson’s talk

17. M.Oriunno, SLAC IBL EOS Services with traveling harness EOS with traveling with traveling harness All wires soldered and spooled IBL 10 cm -15 cm diameter spool Direct solder wires

18. M.Oriunno, SLAC FE-I4 layout prototyping plans Plan to make real stave cable Continuation of prototyping exercise

19. M.Oriunno, SLAC Summary The main challenge of the IBL is to fit and perform in the narrow gap between the Pixel and the beam pipe On-stave-cables and EoS’s integration are the bottle neck The single stave layout may put heavy requirements on the cable design The bi-stave layout accommodate a standard kapton cable with comfortable real estate Beside a connectorized EoS region, a solution with soldered wires deserve consideration.