1. Design Win Replication: FX3 Solution for 3-D Imaging
Simplify Your 3-D Imaging Design With a Flexible, One-Chip, USB 3.0 Solution
Presentation: To provide an engineering overview to customers for a Cypress solution.
Title slide: To define what the presentation will cover. The subtitle is a short sentence stating the key opportunity.
Rev. *B

2. 3-D Imaging: Next Killer App for USB 3.0
3-D Imaging is changing the way consumers interact with content
3-D video cameras create the perception of depth, offering a more immersive viewing experience
3-D game consoles track body movements, eliminating the need for game controllers
3-D motion sensors track finger gestures, eliminating the need for keyboards and mice
3-D Imaging requires high data bandwidth
Uses two image sensors instead of one, doubling the image data
Requires higher frame rates to enable precise motion sensing and fast-action games
3-D Imaging is the trend in video, gaming and motion-sensing products
3-D Video Camera
by Panasonic
XBOX 360 Game Console
by Microsoft
3-D Motion Sensor
by Leap Motion
Market Vision: To define the market opportunity. Presents compelling data and end product photos relevant to the local market.

3. Terms You Will Hear Today
3-D Imaging
Uses two image sensors to capture three-dimensional images or to track movements
Requires more bandwidth – up to 3.0 Gbps
Bandwidth
Bandwidth = # pixels per frame (resolution) x frames per second (frame rate) x # color bits per pixel (color depth)
For example, Bandwidth required by 3-D video = Two image sensors x 2.07 megapixels per frame x 30 fps x 24-bit color = 3.0 Gbps
USB 3.0 (SuperSpeed USB)
Operates at 5 Gbps—10x faster than USB 2.0 (Hi-Speed USB)
Distributes 1.8x more power to bus-powered devices than USB 2.0
Provides backward compatibility with USB 2.0
USB 3.0 Host, USB 3.0 Device, USB 3.0 Hub
The USB 3.0 Host (e.g., a PC) directs traffic flow and distributes power over the bus
The USB 3.0 Device (e.g., a hard disk drive) is a peripheral on the bus
The USB 3.0 Hub directs data traffic between a USB 3.0 Host and multiple USB Devices
Common Image Sensor Configurations for 3-D Imaging (Two Sensors)
Application
Column Pixels
Row Pixels
Resolution
Frame Rate
Color
Depth
Bandwidth
Video
1,920
1,080
2.07 megapixels
30 fps
24 bits (RGB)
3.0 Gbps
Gaming
1,280
720
0.92 megapixels
120 fps
8 bits (B&W)
1.8 Gbps
Motion Sensing
640
480
0.31 megapixels
60 fps
0.3 Gbps
Terms of Art (ToA): To clearly define for engineers all ToAs used in the presentation. To carefully and fully define Cypress-proprietary ToAs needed to explain our system solution.

4. Additional Terms USB Camera Controller USB 3.0 Peripheral Controller
A microcontroller that converts an image sensor data stream into USB traffic
USB 3.0 Peripheral Controller
A microcontroller in a USB 3.0 Device that handles USB 3.0 protocol and communicates with the USB Host
USB 3.0 Driver
A software program in the host system that operates or controls the USB 3.0 Device attached to it
Firmware
A set of instructions programmed on a USB 3.0 Peripheral Controller
USB Video Class (UVC)
A specification that defines the standard behavior of a USB video camera, known as a “UVC camera”
Widely adopted in consumer cameras supported by major PC operating systems
Terms of Art (ToA): To clearly define for engineers all ToAs used in the presentation. To carefully and fully define Cypress-proprietary ToAs needed to explain our system solution.

5. FX3 Terms EZ-USB® FX3™ Controller
Cypress’s programmable USB 3.0 Peripheral Controller with integrated USB 3.0 transceiver
Includes a powerful on-chip ARM9 processor and 512KB RAM for firmware storage and data buffering
Supports additional peripheral connectivity via I2C, I2S, SPI and UART
Includes a Software Development Kit (SDK) with example code to reduce your design effort
GPIF™ II: Second-Generation General Programmable Interface
Programmable 100-MHz, 32-bit interface that allows FX3 to communicate with systems that have a parallel interface
GPIF II Designer
Design software that installs on your PC
Contains simple graphical user interface (GUI) to configure the GPIF II
GPIF II Descriptor
A set of commonly predefined GPIF II configurations used to program FX3 more quickly
FX3 Application Programming Interface (API)
A software interface in the SDK library that enables firmware programs to interact with each other to create specialized USB
functions
Cypress Control Center
A part of the FX3 SDK that installs on your PC
A simple GUI used to configure the FX3 Development Kit (DVK)
Terms of Art (ToA): To clearly define for engineers all ToAs used in the presentation. To carefully and fully define Cypress-proprietary ToAs needed to explain our system solution.

6. Design Problems Engineers Face
1. 3-D Imaging requires up to 3-Gbps bandwidth
USB 2.0 provides only 480-Mbps bandwidth
2. 3-D Imaging requires multiple ICs
Two image sensors to capture a 3-D image
Two camera controllers and a hub to send image data to a PC
Multiple ICs cost more and need more PCB area
3. 3-D Imaging designs must be flexible, to support
Different image sensors with various resolutions, frame rates and bus widths
Different USB data types to transfer captured images
Standard UVC or custom USB cameras
FX3 solves these problems
FX3 provides 5-Gbps bandwidth – 10x the bandwidth of USB 2.0
FX3 is a one-chip solution that reduces cost and PCB area
FX3 has programmable GPIF II and on-chip ARM9 for design flexibility
Cypress’s ultra-compact, one-chip FX3 solution provides high bandwidth and design flexibility for 3-D Imaging
USB 2.0 Multichip Solution for 3-D Imaging 8
USB 2.0
USB 2.0 PC 8
USB 2.0 hub
Image sensors
Camera controllers
FX3 One-Chip Solution for 3-D Imaging
8-16
16-32
USB 3.0 PC
8-16
FX3
Image sensors
Traditional Approach and Challenges: To present the traditional approach and the challenges engineers will face when using it to realize the Market Vision. Ends with a one-sentence segue clearly stating the benefit of the Cypress solution.

7. FX3 Solution: 3-D Imaging Made Easy
GPIF II connector
The GPIF II is programmed to match the interface
A USB 2.0 multi-chip solution costs more and requires more PCB area
The state diagram of an image sensor interface
USB 3.0
connector
Upgrading a complex USB D Imaging design to use USB 3.0…
Is simplified by FX3 with programmable GPIF II…
Prototyped quickly using the FX3 Development Kit…
To get started, you should:
Buy the FX3 DVK online (CYUSB3KIT-001)
Choose your image sensors
Download and install the FX3 SDK on your PC
Read App Note: How to Implement an Image Sensor Interface with FX3 in a UVC Framework
Configure the GPIF II interface for two sensors with the GPIF II Designer software
Write FX3 3-D Imaging firmware using the FX3 SDK
Prototype your firmware design quickly with the FX3 DVK
And miniaturized into a small 3-D motion sensor by Leap Motion.
1 inch
0.5 inch
3 inches
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide To provide a short, clear list of what to do to get started.

8. Configuring GPIF II for Two Sensors
FX3 Example Project Demonstrating GPIF II Interface Customization for Two Image Sensors
Initiate a new project using Cypress-supplied interfaces, or start from scratch
Select the type, bus width, and I/Os of the desired interface
Create a state machine that matches interface timing by adding state blocks and transitional conditions
Visualize state transitions and associated output signals
Generate GPIF II descriptor to be used in the next step: Design FX3 firmware 1 2 4 3 5
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.

9. Write Firmware Quickly Using FX3 SDK
FX3 Example Project Demonstrating 3-D Imaging Firmware Design in FX3 SDK
Use the UVC example code as a reference to write your FX3 3-D Imaging firmware in C code. Insert the GPIF II descriptor into the project directory.
Compile the firmware by clicking the “Build All” button under the “Project” tab
Use the App Note “How to Implement an Image Sensor Interface with FX3 in a UVC Framework” for complete design guidelines
Learn about FX3 functionality by reading the “FX3 Programmers Manual” and the “Firmware API Guide” included in the SDK 1 2 3 4
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.

10. Prototype Quickly with FX3 DVK
Prototype 3-D Imaging designs quickly with FX3 DVK
Build a custom dual-image-sensor daughter board based on your image sensor of choice
Connect the daughter board to the FX3 DVK using the GPIF II connector
Connect your DVK to the PC using a USB 3.0 cable and install the Cypress USB 3.0 driver
Program the FX3 DVK with 3-D Imaging firmware using the Cypress Control Center
The FX3 DVK will reconnect to the PC as a UVC camera
Run video-capture software (e.g., AMCap or equivalent) to watch the live video from two image sensor sources
Example: 3-D Motion Sensor Prototype by Leap Motion FX3 DVK + Dual-Image-Sensor Daughter Board
FX3 DVK (CYUSB3KIT-001)
5-V Power Jack
Two Aptina Image Sensors (MT9V024)
JTAG
Headers
USB 3.0
Connector
FX3
GPIF II
Connector
RS232
Connector
I2S Headers
SPI Headers
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.

11. Example End-Product Design
3-D Motion Sensor by Leap Motion
Factory Debug Connector
USB Connector
Image Sensor #1
19.2-MHz Crystal
FX3
SPI Flash
Image Sensor #2
For a quick 3-D Imaging demonstration, buy a Leap Motion 3-D Motion Sensor
Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.

12. EZ-USB® FX3™ Solution Example: 3-D Motion Sensor
EZ-USB FX3 Value
Block Diagram
Design Challenges
Deliver 3-D Imaging without bandwidth limitations
Eliminate need for multiple ICs to reduce BOM
Provide flexibility to meet customer design requirements
Shrink PCB to achieve smaller form factor
EZ-USB FX3 Solution
5-Gbps bandwidth enables high-bandwidth 3-D Imaging
GPIF II connects FX3 directly to two image sensors
Powerful on-chip ARM9 CPU and 512KB RAM provided
4.7-mm x 5.1-mm, 131-ball wafer-level chip-scale package
EZ-USB® FX3™
One-Chip Solution
JTAG
512KB RAM
(32 End Points)
Image Sensor #1
ARM 9
8-16 32 32
GPIF II 32
USB 3.0
Image Sensor #2
8-16 32
USB 3.0 Enabled Host
UART
SPI
I2C
I2S
Suggested Collateral
App Notes: Getting Started with FX3
FX3 Hardware Design Guidelines
How to Implement an Image Sensor Interface with FX3 in a UVC Framework
Videos: FX3 3-D Imaging Demo
Documents: FX3 Programmers Manual (included in SDK)
FX3 Firmware API Guide (included in SDK)
Control
3-D Motion Sensor
by Leap Motion
Boards and Software
Kit: EZ-USB FX3 DVK (CYUSB3KIT-001)
Software: EZ-USB FX3 Software Development Kit
GPIF II Designer
Solution Examples: To give detailed one-page Solution Examples from the field in the specified format.

13. FX3 Solution vs. Competition’s
8 mm
6 mm
5.1 mm
6 mm
6 mm
4.7 mm
Feature
FX3
Two USB Camera Controllers + USB 2.0 Hub
One-Chip Solution
Yes No
Design Miniaturization
24 mm2
150 mm2, including layout space
USB 3.0 Data Rate (5 Gbps)
Yes, 10x USB 2.0
No, USB 2.0 only (480 Mbps)
Programmability
32-bit ARM9
8-bit MCU (8051 or home brew)
Software Development Kit
On-Chip Memory
512KB SRAM
1KB SRAM
Competitive Comparison: To define key features of the Cypress solution and demonstrate its superiority over the Next Best Alternatives (NBA’s). Must be credible and objective to the salesperson and customer.

14. FX3 3-D Imaging Solution Value
Competitor
Two USB 2.0 Camera Controllers: OmniVision OV538
Price: $1.75 x 2 = $3.501
BOM Integration
USB 2.0 Hub: Microchip USB2512B
Price: $1.332
Additional Value
Design Miniaturization: FX3 = 24 mm2 CSP enables smaller enclosure size vs. competition = 150 mm2 (Savings = $0.02 per mm2)
Value added: $2.52
USB 3.0 Data Rate: FX3 5-Gbps bandwidth supports higher resolution and higher frame rate vs. USB Mbps competition
Value added: $2.253
Programmability: 32-bit ARM9 CPU enables encryption, vendor-specific device class, and other customization vs. 8-bit 8051 competition
Value added: $3.114
SDK: FX3 provides industry standard tools, saving up to 30 man-weeks of engineering effort at $5k per man-week; amortized over 100ku
Value added: $1.50
On-Chip Memory: FX3 512KB SRAM allows large buffers (8 x 16KB) for higher data throughput vs. 1KB competition (Savings = $0.01 per KB)
Value added: $5.11
Competitor
$3.50
USB 2.0 Hub
$1.33
BOM Integration Value
$1.33
Design Miniaturization
$2.52
USB 3.0 Data Rate
$2.25
Programmability
$3.11
SDK
$1.50
On-Chip Memory
$5.11
Justification:
OmniVision OV538, $2.25*2=$5.00
datasheet,
C-temp (0 – 70C)
8 x 6 mm = 48mm2
Microchip USB2512B, $1.62
datasheet,
Extended C-temp (0 – 85C)
6 x 6 mm = 36mm2
Design Miniaturization, $2.52
Total PCB saving times $0.20 per mm2, (150-24)*0.20 = $2.52
USB 3.0 Data Rate, $2.92
We find the price difference in ASP between equivalent USB 2.0 vs. USB 3.0 hubs from TI and Microchip
TI USB 3.0 hub (TUSB8040, $4.56), TI USB 2.0 hub (TUSB2036, $1.61), delta = $2.95
Microchip USB 3.0 hub (USB5534, $4.36), Microchip USB 2.0 hub (USB2512B, $1.47), delta = $2.89
Assumption: The delta in USB 3.0 vs. USB 2.0 hubs is how much a customer is willing to pay for USB 3.0 bandwidth.
Programmability, $2.51
FX3 has a on-chip 32-bit ARM9 processor, whereas competition solution has 8-bit processor (either 8051 or homebrew). The value added is calculated by comparing price difference between 8-bit and 32-bit microcontrollers
ARM: LPC3130FET180,551, 1ku,
8051: P89LPC916FDH,118, 1ku,
Delta: $2.51
SDK, $1.50
FX3 comes a number of open source tool to reduce customer engineering effort
GPIF II Designer – simplify the configuration of GPIF II interface to connect to any image sensors
Industry standard tools like Eclipse IDE and GNU compiler/debugger to empower customers to write their own FW
This saves a total of 30 man-weeks. Considering typical NRE is $5k per man-week, customers save $150k by choosing FX3. If amortized over 100ku, it adds a value of $1.50
On-chip Memory, $5.33
- Cost of 512KB SRAM is $5.33
====
FX3 SKU, DBC, 1ku Web Price
- CYUSB3011-BZXC (16-bit, 256kB, C-temp), $16.00, $16.80
CYUSB3012-BZXC (32-bit, 256kB, C-temp), $17.75, $18.64
CYUSB3013-BZXC (16-bit, 512kB, C-temp), $18.50, $19.43
CYUSB3014-BZXC (32-bit, 512kB, C-temp), $20.00, $21.00
CYUSB3014-BZXI (32-bit, 512kB, I-temp), $26.00, $27.30
Total Additional Value
$14.49
Total Value Delivered
$19.32
Target Cypress Solution:
CYUSB3014-FBXCT
Total Cost:
$13.94
28% Total Savings:
$5.38
1 Estimated1ku pricing per customer input on 2/25/ ku pricing from Microchip Direct: price delta between USB 3.0 Hub (USB5532B) and USB 2.0 Hub (USB2512B) on 2/25/2015
2 1ku pricing from Microchip Direct (USB2512B) on 2/25/ ku pricing from TI: price delta between ARM9-based MCU (AM1802) and 8051-based MCU (TUSB3210) on 2/25/2015
EVC Slide: To clearly define the value of the Cypress solution, including BOM integration and unique functionality.

15. Here’s How to Get Started
1. Watch our demo video: FX3 3-D Imaging Demo
2. Read the Getting Started with EZ-USB FX3 App Note: AN75705
3. Buy the $397 EZ-USB FX3 Development Kit: CYUSB3KIT-001
3-D Motion Sensor
by Leap Motion
Call to Action: To tell customers how to start their design process.

16. References and Links FX3 3-D Imaging Demo Video: FX3 3-D Imaging Demo
Machine Vision Camera Demo Video: FX3 MV Camera Demo
FX3 HD 720p Camera Kit Demo Video: FX3 Camera Kit Demo
EZ-USB FX3 App Note:
Getting Started with EZ-USB FX3: AN75705
Gives highlights of USB 3.0 technology and an overview of the FX3 architecture, software, and collateral
Shows FX3 SDK setup, Cypress USB driver installation, firmware download, and USB 3.0 traffic verification
EZ-USB FX3 Hardware Design Guidelines and Schematic Checklist: AN70707
Shows how to design a board with 5-Gbps USB 3.0 traces
How to Implement an Image Sensor Interface with FX3 in a UVC Framework: AN75779
Describes a UVC video streaming application in which FX3 streams images from an image sensor to a USB Host
EZ-USB FX3 Development Kit: CYUSB3KIT-001
EZ-USB FX3 HD 720p Camera Kit: FX3 Camera Kit
Software Development Kit: EZ-USB FX3 Software Development Kit
Provides Eclipse IDE, ARM GCC, Cypress USB 3.0 driver, example code, FX3 Programmers Manual, and API Guide
GPIF II Designer: GPIF II Designer
References and Links: Provide comprehensive view of resources to assist in learning about and adapting the solution.