1. Status of procurement of Module Assembly Machines A. Di Mauro (CERN) 5th ITS, MFT and O2 upgrade Asian workshop, Wuhan, 08.06.2015

2. Summary of financial aspects ItemCost [Euro] Development and set-up226360 CERN prototype (baseline + probe card systems)202208 Bari (baseline system)161276 Liverpool (baseline system)161276 Pusan (baseline + probe card system)202208 Strasbourg (baseline system)161276 Wuhan (baseline system) *161276 Wuhan, 08/06/2015MAM2 Contract placed between CERN and IBS-PE (NL): 1.Property of machines will remain to CERN for three years 2.For EU countries: machines have to be first delivered to CERN for custom formalities then to final sites Cost include transport, installation and commissioning, documentation and personnel training, 3 y warranty with preventive and corrective maintenance * Machine for Wuhan ordered separately to simplify procedure (deadline: end of June)

3. Baseline MAM and purchase options The baseline machine will perform semi-automatic or fully automatic placement of chips with ± 5  m accuracy wrt external markers and interconnection of FPC and chips via automatic soldering by laser of 200  m Sn/Ag balls AOI based on hi-res camera with 1¨ sensor, 2048x2048 pixels, 10x objective, 1.1x1.1 mm field of view, focal depth 3.6  m, image processing by Labview IMAQ package (expected sub-pixel resolution of 0.25  m): chips dimensions, edge integrity, pads cleanness and Sn- Ag soldering ball presence in FPC vias Purchase options: – Probe card system for electrical chip testing (CERN and Pusan), included in contract : 40932 Euro – Sn-Ag balls presence in solder ball transfer tool (SBTT): 9928 Euro; not included for the moment but worth to be considered Wuhan, 08/06/2015MAM3

4. The test performance specifications Test ID TPS-Design verification (1x) Product verification (every series machine) FAT-proto SAT-proto FAT-series SAT-series 1xx* 2xx 3axx 3bx 3dx 4axx x x 4bxx x x 5 <-- 6xx 6xx** FAT/SAT-a xxxx FAT/SAT-b1 xx FAT/SAT-b2 xx FAT/SAT-c xxxx Interface check x x Wuhan, 08/06/2015MAM4 #1 : Gripper and pre-position chuck functionality #2 : Robot repeatability #3a : Vision system calibration #3b : Accuracy and repeatability of chips dimensions, AOI (detection of chips defects) #3d : Recognition of soldering grid holes, soldering balls and laser head alignment #4a : Vacuum system for chucks #4b : Vacuum system for soldering chamber #5: Gripper and axis (± 5  m 3  accuracy) #6 : Probe card system Factory Acceptance Test and Site Acceptance Test: chip AOI, probe test (CERN and Pusan), HIC assembly, chip position, SW

5. Wuhan, 08/06/2015MAM5 MAM preliminary layout (tendering proposal picture, will be updated)

6. Machine concept Wuhan, 08/06/2015MAM6 Interface position for the chips tray Intermediate position between the tray and the HIC-assembly table: the “pre-position chuck”, where the chip is clamped by vacuum after take-over from the tray. On this chuck the positions of the markers are measured on a flat chip. The pre-position chuck is also used to clamp chips during electrical inspection with the probe card. The HIC-assembly table with the vacuum surface to clamp the chips. Reference markers on the HIC- assembly table (as close as possible to the chip markers) A chip handling system with a XY- guiding A position sensor (vision system) to acquire position data of the markers on chips/table and for chips AOI. A gripper for chip take-over by means of a vacuum pad, with actuation of the Z-direction and of the rotation up to 180 o about the Z-axis (Rz). A laser system for soldering the FPC to the chips by means of soldering balls. Last added feature: bar code reader Trays and HICs (TBC) will have a 2D bar code identifier (coded info TBD) Chips from half wafer are stored in 24 slot trays, position in tray (0-23) depends on position in wafer. Chips will be identified by the tray S/N + position in tray. The value is hard-coded upon first electrical test by burning fuses of chips.

7. Wuhan, 08/06/2015MAM7 Summary of main interfaces specification Environmental conditions, network, supplies Assembly table Overview of specifications and interfaces Author: Project number: Last update: IBSPE 22228 2015-05-26 Ergonomics issues

8. MAM preliminary footprint Wuhan, 08/06/2015MAM8 Preliminary weight: ~1400 kg

9. Lab requirements NRDescriptionValueUnitComment 1 Temperature range20 ± 2 CC 2 Relative humidity30-60%Non-condensing 3 Floor vibration levelcompliant with vibration criterion C- 4 Heat in (to machine)Machine should not be placed in vicinity of radiating heat sources - Wuhan, 08/06/2015MAM9 [1] [1] Colin G. Gordon, Generic criteria for vibration-sensitive equipment. http://www.colingordon.co/library-generic- vibration-criteria-for-vibration-sensitive-equipmenthttp://www.colingordon.co/library-generic- vibration-criteria-for-vibration-sensitive-equipment Laboratory features have to be measured and compared to suggested Vibration Criteria. If necessary decoupling platform will have to be installed.

10. Lab requirements Wuhan, 08/06/2015MAM10 Network access Remote access to the HIC assembly machine is required for first line diagnosis. Furthermore data generated during HIC-assembly process must be stored on a server connected to the plant network PC OS Installation of PC (OS, virus scanner, firewall) supplied by IBS done by institute? Issues with respect to remote access, update of OS (not automatic) and virus scanner, no automatic updates of machine software to be verified.

11. Lab requirements Wuhan, 08/06/2015MAM11 N 2 supply N 2 is used for flushing soldering chamber and releasing soldering balls. In addition it could be used to keep clean FPC under gas prior to assembly. Pollution (dust, water, grease) will have a direct impact on soldering efficiency. Nitrogen-60 + silicon/grease-free SS pipes + 0.5  m filter (e.g. Swagelok SS- 6F-MM-05) Internal requirement: clean room of at least 100000 class NRDescriptionValueUnitComment 1 Pressure2bara 2 Flow>1l/min Non-condensing 3 QualityTBD 4 Connection Pipe diam.: 10 mm- both female and male connector are delivered by the customer (being CERN/institutes)

12. Lab requirements Wuhan, 08/06/2015MAM12 Pressurised air supply Filters for particles, oil and water to be installed Exhaust Connections: DN 16 ISO KF NRDescriptionValueUnitComment 1 Pressure6barg 7 bar, 80 nl/min 2 Flow> 10l/min 3 Qualityclass 3.3.3- Purity class 3.3.3 (A,B,C acc. ISO 8573.1) Solid particles per m 3 : 1…5 micron: 50 0.5…1 micron: 10.000 Oil, including vapor: < 1 mg/m 3 Water content @ 7 bar: pressure dew point: < -20 ºC 4 Connection Pipe diam.: 10 mm - both female and male connector are delivered by the customer (being CERN/institutes)

13. Lab requirements Wuhan, 08/06/2015MAM13 Electrical power Filters for particles, oil and water to be installed NRDescriptionValueUnitComment 1 Electrical power 3P+N+G-3 phases +neutral + ground 2 Voltage400Vtolerance ±10% 3 Frequency50Hz±0,1 Hz; TBD 2 Current16AC 3 Mean power consumption HIC assembly machine TBDW Mean power consumption of machine to be confirmed by IBS 4 Peak power HIC assembly machine TBDW 5 Connectormale-5 pins acc. to IEC 60309; HIC assembly machine side

14. Assembly table interfacing 3 different tables for IB, OB and MFT (module size: 1x9 chips, 2x7 chips 1x1-5 chips, respectively) 3 different approaches for FPC mounting and alignment Wuhan, 08/06/2015MAM14

15. Assembly table interfacing Wuhan, 08/06/2015MAM15 IB: Flex-frame with dowels to mount and align FPC Cover with quartz window Stave gluing vacuum chuck Flex-frame FPC Chips (1x9) Chips vacuum chuck Base plate

16. Assembly table interfacing Wuhan, 08/06/2015MAM16 IB

17. Assembly table interfacing Wuhan, 08/06/2015MAM17 IB

18. Assembly table interfacing Wuhan, 08/06/2015MAM18 IB

19. Assembly table interfacing Wuhan, 08/06/2015MAM19 IB Soldering grid

20. Assembly table interfacing Wuhan, 08/06/2015MAM20 IB

21. Assembly table interfacing Wuhan, 08/06/2015MAM21 IB

22. Assembly table interfacing Wuhan, 08/06/2015MAM22 OB: mount and align FPC using dowels and ruby balls on vacuum chuck (removable frame to avoid interference with gripper while placing chips) – see V. Manzari’s talk

23. Assembly table interfacing Wuhan, 08/06/2015MAM23 MFT: mount and align FPC using removable dowels on vacuum chuck (to avoid interference with gripper while placing chips) – see G. Martinez’s talk

24. Assembly table interfacing Wuhan, 08/06/2015MAM24 Bottom interface plate common to all tables (IB, OB, MFT) to implement connections with vacuum/gas systems

25. Assembly table interfacing Wuhan, 08/06/2015MAM25

26. Reference markers Chips are placed on vacuum chuck using external markers implemented on assembly table Request from IBS: to align to nominal position of pALPIDE3 chips markers, increase distance from 300  m to 450.6  m Wuhan, 08/06/2015MAM26 pALPIDE3 layout

27. Reference markers Wuhan, 08/06/2015MAM27 Test by mechanical drilling of 36 holes (0.25 mm diameter, 0.4 mm deep) Diameter: 261.9 ± 1.2  m Position deviation from nominal: -1.8 ± 1.2  m Accuracy OK for MAM, issue with light reflection from hole bottom, fill with black ink to enhance contrast

28. Ergonomics issues Wuhan, 08/06/2015MAM28 All manual tasks in standing position Distance from assembly table crucial for delicate intervention like placement of single balls or correction of ball placement faults

29. Ergonomics issues Wuhan, 08/06/2015MAM29 To ensure required accuracy the assembly table has to be as close as possible to linear actuator and drive Distance to assembly table ~ 305 mm (3x8 chips tray layout) seems reasonable Develop specific tool(s) for such interventions

30. Preliminary GUI: initialization Wuhan, 08/06/2015MAM30

31. Preliminary GUI: select chips Wuhan, 08/06/2015MAM31

32. Preliminary GUI: chip AOI Wuhan, 08/06/2015MAM32

33. Preliminary GUI: select HIC position Wuhan, 08/06/2015MAM33

34. Preliminary GUI: chip position check Wuhan, 08/06/2015MAM34

35. Preliminary GUI: pad inspection Wuhan, 08/06/2015MAM35

36. Preliminary GUI: ball placement inspection Wuhan, 08/06/2015MAM36

37. Preliminary GUI: final position check Wuhan, 08/06/2015MAM37

38. Integration of probe card system Finalization of specifications ~ completed (J-F Grosse-Oetringhous, Y. Kwon) Main features: – 2D (Y,Z dedicated axes) displacement – mechanical alignment along X – Budget for needle placement: pad position on pre-pos chuck 6  m + needles probe card position 28  m + sliding of needles during overdrive 40  m = 74  m → no issues (even assuming contact pads diameter of 260  m) Wuhan, 08/06/2015MAM38

39. Integration of probe card system Budget for z-overdrive for electrical contact 50  m overdrive at the edge of estimated budget Wuhan, 08/06/2015MAM39 descriptionvalue (  m) Needle plane flatness 10 Card deflection 10 Card alignment ZRxRy 10 Z step5 Chip thickness variation 2 Chuck flatness 5 Budget to contact all needles 42

40. Key milestones and deliverables Wuhan, 08/06/2015MAM40 Schedule has been revised according to changes in chips (pALPIDE2 and 3), assembly table and probe-card availability TASKPrevious deadlineNew deadline Delivery chips (pALPIDE2: 10 pad, 100 real) and trays proto for testing Wk24Wk25: 10 pad + 20 pALPIDE2; Wk35: 80 pALPIDE2 MS1.2: Design presentation and approvalWk25 (19/06/2015)26/06/2015 (TBC) Delivery probe card, PC and SWWk25Wk32 * (Wk40 pALPIDE3) Delivery HIC assembly tablesWk32 (07/08/3015)~ok for IB, MFT, TBC for OB Delivery chips in tray (pALPIDE3 + final trays)Wk32Wk38 MS1.4 prototype FAT and approvalWk42 (16/10/2015)TBC by IBS MS1.5 prototype SAT and approvalWk44 (30/10/2015)TBC by IBS All other machines will be delivered in the various sites starting 29 weeks after prototype SAT, every 2 weeks (presumably between June and September 2016)