1. Introducing Speedstack 2013 March 2013 - Richard Attrill / John Lee

2. 2 New Features New ‘Processed Thickness’ displayable column

3. 3 New Features New ‘Processed Thickness’ displayable column Processed Thickness, a single column that contains the conductor Finished Thickness and dielectric Isolation Distance. Totalling these fields equals the Stack Up Thickness

4. 4 New Features New ‘Processed Thickness’ displayable column Processed Thickness, shown on the Technical Report

5. 5 New Features Calculated Impedance field now highlighted Speedstack 2012 Speedstack 2013

6. 6 New Features Design rule check (DRC) improvements New mechanical drill aspect ratio checks

7. 7 New Features Stack Up Thickness Enhancements New ‘Solder Mask Thickness’ and ‘Stack Up Thickness with Solder Mask’ calculations now included within Speedstack Stack up thickness calculations also included on Speedstack status bar. Easy to keep track on stack up thicknesses while adding / swapping and deleting materials.

8. 8 New Features Stack Up Thickness Enhancements Stack Up Information grid layout improved to more clearly present stack up thickness data Updated Speedstack status bar showing stack up thickness totals

9. 9 New Features Stack Up Thickness Enhancements New ‘Solder Mask Thickness’ and ‘Stack Up Thickness with Solder Mask’ calculations now included on report

10. 10 New Features Printing Enhancements The selected Units are now printed on the title bar Improvements have been made to the position of the dimensioning text and lines / arrows

11. 11 New Features Interfacing with other systems XML It is now possible to automatically import an XML file into Speedstack on launch. Useful for importing pre-existing stack up data

12. 12 New Features Interfacing with other systems Call an external program / utility / script from within Speedstack via the External Utilities menu

13. 13 New Features Interfacing with other systems External Utilities menu defined within the Configuration option

14. 14 New Features Multiple instances of Speedstack may now run simultaneously

15. 15 New Features Other Speedstack enhancements Technical report improvements Impedance structure highlighting improvements for Advanced structures A more consistent number accuracy (precision) is now used for the dielectric constant, isolation distance and finished thickness fields shown on the stack up graphic Opening / saving of SCI project files is now given more emphasis throughout Speedstack than the older STK file format

16. 16 New Features Other Speedstack enhancements The Speedstack keyboard short-cuts have been reallocated to more Windows-like functionality. Short-cuts that originally use the Insert key have been changed to more suitable keys in order to support Apple keyboards Alterations have been made to the controlled impedance tab scroll bar behaviour to accommodate Simplified / Traditional Chinese and Korean Windows 7 OS Speedstack now confirms adequate screen resolution during start up

17. 17 New Features Windows 8 Speedstack 2013 has been tested for compatibility with Windows 8

18. 18 New Features Upgrading to Speedstack 2013 Active Speedstack Polarcare customers are entitled to upgrade to the 2013 release Speedstack 2013 requires a new license: The Speedstack 2012 license will NOT be suitable for Speedstack 2013 The 2013 license will NOT be suitable for Speedstack 2012 or earlier releases Users wishing to evaluate Speedstack 2013 prior to upgrading should contact their local Polar Instruments office

19. Thank you

20. For more information: Contact Polar now: Phone USA / Canada / Mexico Ken Taylor ( 503) 356 5270 Ken Taylor Asia / Pacific Terence ChewTerence Chew+65 6873 7470 Japan japan@polarinstruments.asiajapan@polarinstruments.asia+81 45 339 0155 UK / Europe Neil Chamberlain +44 23 9226 9113 Neil Chamberlain Germany / Austria / Switzerland Hermann Reischer+43 7666 20041-0 Hermann Reischer www.polarinstruments.com