1. ECE 300 Microprocessor Project Nick Jones Bibi Morales Bibi Morales Hadi Choueiry Tyler Griffin Tyler Griffin Group 9

2. Objectives To learn to use teamwork and communication skills to complete a project. Gain experience with PCBs and surface mount components Learn precision soldering Programming and debugging in C To select a proper temperature sensor that meets the needs of our particular project.

3. Board Components - Chip The first component that was soldered onto the board was the MSP430 chip using the provided microscope. This was done by aligning the chip with the circuit traces and keeping it stable with a tiny bit of flux. There were 100 solder connections which proved to be difficult at first.

4. Board Components-LCD Display 40 pin LCD It was difficult to line up the pins to fit in the slots on the board. The holes on the board sucked the solder down into board.

5. Board Components – Resistor and Capacitors These components were placed on the board and held in place by a small amount of solder. They were then soldered down. C1 0.1 uf C2 0.1 uf C3 10 uf (polarized) C4 0.1 uf C5 0.1 uf C6 10 uf (polarized) C9 1.0 uf C10 0.1 uf R5 47 kohms

6. Board Components- Other parts The components were placed on the board: Push button switch voltage regulator 5 volt input connector slider switch JTAG connector 32.7 kHz crystal

7. Board Components – Switch Added switch Selects between On board AD22103 Off board AD590

8. The Completed Board

9. Sensor Circuit AD590 AD22103

10. Temperature Sensor AD590 and AD22103

11. Programming the Chip The files provided by Dr. Green, lcd.c, lcd.h, delay.c, delay.h, demo.c, sensor.c, were used in our project. The MSP430 Flash emulation tool was connected to the board and the computer. Using IAR and C-SPY we programmed the board.

12. Programming the Board sensor.c

13. AD22103 Results

14. AD590 Results

15. Questions? Nick Jones Bibi Morales Bibi Morales Hadi Choueiry Tyler Griffin Tyler Griffin Group 9