1. Detector to chip

2. Electronic here Detector (here only bottom stack) PCB

3. Specs <3 GHz bandwith As small as possible to limit dead space As simple as possible Possibility to dissemble

4. Transition 1 Strip dimension shrink (W/L = cst) Transition here ?

5. Transition 2 Continuous microstrip to coplanar transition Problem: Transition 1 & 2 implies coating a PCB with an angle which might not be possible and expansive

6. Real world implementation Instead of having an angle in the PCB the angle can be made via staking of layers. In PCB we can have up to 16 layers. Need to be simulated. Vias not represented here

7. Transition 2 simplest implemetation

8. Transition 2 improvement improvement Field rotation The via transition could be replaced by progressive stacking of layer for a smoother transition.

9. Status Model being put in HFSS for field simuation. PCB card design started with the help of Mircea. Help given by Xioahuan (Klaus’ student) working on the same issues. All ideas to go from PCB to microstrip are welcome.